Patents Assigned to Skorpios Technologies, Inc.
  • Patent number: 12253714
    Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: March 18, 2025
    Assignee: Skorpios Technologies, Inc.
    Inventors: Paveen Apiratikul, Damien Lambert
  • Patent number: 12210186
    Abstract: A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: January 28, 2025
    Assignee: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Publication number: 20240427085
    Abstract: A polarization-independent, optical circulator is formed in silicon photonics. The polarization-independent, optical circulator uses an optical splitter having two couplers and two waveguides joining the two couplers. One of the two waveguides is thinner than the other to create a large effective index difference between TE and TM modes transmitted through the one waveguide. Polarization rotators, including reciprocal and/or non-reciprocal rotators, are further used to create the optical circulator.
    Type: Application
    Filed: May 1, 2024
    Publication date: December 26, 2024
    Applicant: Skorpios Technologies, Inc.
    Inventors: Majid Sodagar, Wenyi Wang, Changyi Li, Guoliang Li, Murtaza Askari, Yi Wang, John Dallesasse, Stephen B. Krasulick
  • Patent number: 12169311
    Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: December 17, 2024
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, Timothy Creazzo, Elton Marchena, Amit Mizrahi, Derek Van Orden
  • Publication number: 20240275123
    Abstract: A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer, and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.
    Type: Application
    Filed: January 5, 2024
    Publication date: August 15, 2024
    Applicant: Skorpios Technologies, Inc.
    Inventors: Murtaza Askari, Stephen B. Krasulick, Majid Sodagar, John Zyskind
  • Patent number: 12007605
    Abstract: A polarization-independent, optical circulator is formed in silicon photonics. The polarization-independent, optical circulator uses an optical splitter having two couplers and two waveguides joining the two couplers. One of the two waveguides is thinner than the other to create a large effective index difference between TE and TM modes transmitted through the one waveguide. Polarization rotators, including reciprocal and/or non-reciprocal rotators, are further used to create the optical circulator.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: June 11, 2024
    Assignee: Skorpios Technologies, Inc.
    Inventors: Majid Sodagar, Wenyi Wang, Changyi Li, Guoliang Li, Murtaza Askari, Yi Wang, John Dallesasse, Stephen B. Krasulick
  • Patent number: 11901692
    Abstract: A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer; and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: February 13, 2024
    Assignee: Skorpios Technologies, Inc.
    Inventors: Murtaza Askari, Stephen B. Krasulick, Majid Sodagar, John Zyskind
  • Publication number: 20230358951
    Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.
    Type: Application
    Filed: March 6, 2023
    Publication date: November 9, 2023
    Applicant: Skorpios Technologies, Inc.
    Inventors: Paveen Apiratikul, Damien Lambert
  • Patent number: 11675134
    Abstract: An optical bandpass filter includes an optical splitter having at least four ports, one of the ports being designated as an input port and one of the ports being designated as an output port. First and second reflectors couple with respective third and fourth ones of the ports. The splitter directs portions of the input light from the input port, into the third and fourth ports, such that the portions of the input light propagate toward the respective first and second reflectors. The first and second reflectors reflect light having wavelengths within a predetermined wavelength range, back toward the splitter, as wavelength-selected light, and transmit light having wavelengths that are outside of the predetermined wavelength range, away from the splitter. The splitter directs at least a portion of the wavelength-selected light that propagates back toward the splitter, into the output port, as output light.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: June 13, 2023
    Assignee: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Stephen B. Krasulick
  • Patent number: 11624872
    Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: April 11, 2023
    Assignee: Skorpios Technologies, Inc.
    Inventors: Paveen Apiratikul, Damien Lambert
  • Patent number: 11585977
    Abstract: A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: February 21, 2023
    Assignee: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Patent number: 11409039
    Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: August 9, 2022
    Assignee: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
  • Patent number: 11360263
    Abstract: An optical device comprises a substrate, a waveguide disposed on the substrate, and a spot size converter (SSC) disposed on the substrate. The waveguide comprises a shoulder and a ridge. The SSC comprises a shoulder and a ridge. The ridge of the waveguide is aligned to a first stage of the ridge of the SSC. The waveguide is made of a first material. The shoulder and the ridge of the SSC are made of a second material. The second material is different from the first material.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: June 14, 2022
    Assignee: Skorpios Technologies. Inc.
    Inventors: Majid Sodagar, Paveen Apiratikul
  • Patent number: 11307440
    Abstract: A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: April 19, 2022
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, Damien Lambert, Andrew Bonthron, Guoliang Li
  • Patent number: 11249253
    Abstract: Photonic rotators integrated on a substrate are disclosed for manipulating light polarization.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: February 15, 2022
    Assignee: Skorpios Technologies, Inc.
    Inventors: John Dallesasse, Stephen B. Krasulick
  • Patent number: 11223348
    Abstract: A PAM (Pulse Amplitude Modulation) modulator driver is configured to receive a PAM input signal having N input amplitude levels and provide a PAM output signal having N output amplitude levels, where N is an integer. The PAM modulator driver circuit configured to electrically adjust amplitude levels in the PAM output signal.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: January 11, 2022
    Assignee: Skorpios Technologies, Inc.
    Inventors: Andrew Bonthron, Phuoc Nguyen, Viktor Novozhilov, Michael Nilsson, Wei-Min Kuo
  • Patent number: 11217963
    Abstract: A photonic die includes an optical component that can emit output light. The optical component includes a substrate having a length and width that are substantially greater than a thickness thereof, the thickness defining a vertical direction. The optical component includes a vertical edge, and a reflective or antireflective coating on the vertical edge, wherein the reflective or antireflective coating includes a silicon-based material.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: January 4, 2022
    Assignee: Skorpios Technologies, Inc.
    Inventors: Murtaza Askari, Stephen B. Krasulick
  • Patent number: 11194092
    Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: December 7, 2021
    Assignee: SKORPIOS TECHNOLOGIES, INC.
    Inventors: Paveen Apiratikul, Damien Lambert
  • Patent number: 11183492
    Abstract: Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: November 23, 2021
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, Timothy Creazzo, Elton Marchena, John Dallesasse
  • Patent number: 11181688
    Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermetically seals the chip in the platform.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: November 23, 2021
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena, John Y. Spann