Patents Assigned to Skywork Solutions, Inc.
-
Patent number: 11973550Abstract: Beamforming communication systems with modular front-ends are provided herein. In certain embodiments, a beamforming communication system includes an antenna array partitioned into a plurality of sub-arrays, and a plurality of front-end modules each operatively associated with one of the sub-arrays. Each of the front-end modules includes at least two radio frequency (RF) transmit channels and at least two RF receive channels. Thus, the signals transmitted and received on the antenna array are processed using a multiple front-end modules servicing sub-arrays.Type: GrantFiled: December 27, 2021Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventor: Stephen Joseph Kovacic
-
Patent number: 11973523Abstract: Radio frequency front end modules are provided. In one aspect, a front end system includes at least one power amplifier configured to amplify a transmit radio frequency signal, at least one low noise amplifier configured to receive a receive radio frequency signal, an output node coupled to an antenna. The front end system further includes at least one switch configured to selectively couple the output node to the at least one power amplifier during a transmit period and to the at least one low noise amplifier during a receive period, at least one transmit filter coupled between the power amplifier and the at least one switch, and at least one receive filter coupled between the low noise amplifier and the at least one switch.Type: GrantFiled: December 2, 2021Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Joel Richard King, Tianming Chen, Shayan Farahvash, Stephane Richard Marie Wloczysiak, Anand Raghavan, David Richard Pehlke
-
Patent number: 11974390Abstract: A packaging substrate can include a first surface and a second opposing surface, the first surface including a first mounting region of a first electronic module region and the second opposing surface including a first electrical contacts region of the first electronic module region. The packaging substrate can include a saw street region with at least a portion that surrounds the first electronic module region, and a saw street feature formed on the second opposing surface within at least a portion of the saw street region, the saw street feature being a solder mask layer over a metal layer.Type: GrantFiled: February 8, 2023Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Bhuvaneshwaran Vijayakumar, Lori Ann Deorio, Anthony James Lobianco, Hoang Mong Nguyen, Robert Francis Darveaux
-
Patent number: 11973522Abstract: Aspects of this disclosure relate to a front end architecture for selectively adding an external carrier aggregation band. A switch element can connect a radio frequency signal path to an antenna path through a frequency domain multiplexer, such as a diplexer, in a first mode. The switch element can connect the radio frequency path to the antenna path and bypass the frequency domain multiplexer in a second mode. The frequency domain multiplexer can be external to a front end module that include the radio frequency signal path. In the first mode, a front end system can support carrier aggregation with a band associated with circuitry implemented external to the front end module.Type: GrantFiled: March 10, 2021Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Jen-Chien Chang, Reza Kasnavi, Roman Zbigniew Arkiszewski, Jeffrey Gordon Strahler, John G. Freed
-
Patent number: 11973115Abstract: Devices and methods for switch body connections to achieve soft breakdown. In some embodiments, a method of implementing a radio-frequency switching device can include providing an assembly of source, gate, and drain implemented on an active region; providing a first body contact implemented at a first end of the assembly; and providing a second body contact implemented at a second end of the assembly, the second end distal from the first end along a width of the radio-frequency switching device.Type: GrantFiled: May 4, 2023Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Ambarish Roy, Guillaume Alexandre Blin, Nuttapong Srirattana
-
Patent number: 11973467Abstract: Multi-level envelope trackers with an analog interface are provided herein. In certain embodiments, an envelope tracking system for generating a power amplifier supply voltage for a power amplifier is provided. The envelope tracking system includes a multi-level supply (MLS) DC-to-DC converter that outputs multiple regulated voltages, and an MLS modulator that controls selection of the regulated voltages over time based on an analog envelope signal corresponding to an envelope of the RF signal amplified by the power amplifier.Type: GrantFiled: April 14, 2023Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Florinel G. Balteanu, Serge Francois Drogi, Shayan Farahvash, David Richard Pehlke
-
Patent number: 11973283Abstract: Reconfigurable antenna systems with ground tuning pads are provided herein. In certain configurations, an antenna system includes an antenna element, a first tuning conductor spaced apart from the antenna element on a first side of the antenna element, a second tuning conductor spaced apart from the antenna element on a second side of the antenna element, a first ground tuning pad configured to receive a ground voltage, and a first switch electrically connected between the first tuning conductor and the first ground tuning pad. The first switch is operable to selectively connect the first tuning conductor to the first ground tuning pad to thereby tune the antenna element.Type: GrantFiled: February 23, 2021Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: René RodrÃguez, Dinhphuoc Vu Hoang, Hardik Bhupendra Modi
-
Patent number: 11973491Abstract: Aspects of this disclosure relate to a surface acoustic wave filter with an integrated temperature sensor. The integrated temperature sensor can be a resistive thermal device configured as a reflective grating for a surface acoustic wave resonator, for example. A radio frequency system can provide over temperature protection by reducing a power level of a radio frequency signal provided to the surface acoustic wave filter responsive to an indication of temperature provided by the integrated temperature sensor satisfying a threshold.Type: GrantFiled: June 30, 2021Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Joshua James Caron, Joel Anthony Penticoff
-
Patent number: 11973033Abstract: A flip-chip semiconductor-on-insulator die includes a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, and a first via layer between the active layer and the first metal layer. The die at least first and second contact pads and a transistor including a first terminal formed within the active layer. A first portion of the first terminal falls within a footprint of the first contact pad and a second portion of the first terminal falls within a footprint of the second contact pad.Type: GrantFiled: December 30, 2020Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Yang Liu, Yong Hee Lee, Thomas Obkircher
-
Patent number: 11973505Abstract: A delay circuit provides a programmable delay and includes an input selector circuit to select between a loop delay output signal and an input signal. A loop delay circuit provides a loop delay to the input signal and supplies the loop delay output signal. The input signal can be recirculated through the loop delay circuit to extend the range of the delay. The input selector circuit selects the feedback signal during recirculation. A variable delay circuit provides a variable delay to the loop delay output signal after the recirculation is complete and supplies a variable delay output signal. An output selector circuit selects the output of the output selector circuit during the recirculation and selects the variable delay output signal after the recirculation is complete to thereby provide a delayed signal with the delay based on the loop delay, the number of loops of recirculation, and the variable delay.Type: GrantFiled: January 26, 2023Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventor: Vivek Sarda
-
Patent number: 11973475Abstract: Apparatus and methods for true power detection are provided herein. In certain embodiments, a power amplifier system includes an antenna, a directional coupler, and a power amplifier electrically connected to the antenna by way of a through line of the directional coupler. The power amplifier system further includes a first switch, a second switch, and a combiner that combines a first coupled signal received from a first end of the directional coupler's coupled line through the first switch and a second coupled signal received from a second end of the directional coupler's coupled line through the second switch.Type: GrantFiled: February 27, 2023Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Foad Arfaei Malekzadeh, Abdulhadi Ebrahim Abdulhadi, Sanjeev Jain
-
Patent number: 11973468Abstract: Envelope tracking systems for power amplifiers are provided herein. In certain embodiments, an envelope tracker supplies power to a power amplifier that amplifies an RF signal. The envelope tracker includes a multi-level switching circuit that generates an output current based on an envelope signal indicating an envelope of the RF signal. The envelope tracker further includes a combiner that combines a DC voltage with the output current of the multi-level switching circuit to generate a power amplifier supply voltage for the power amplifier. Accordingly, the output current of the multi-level switching circuit and a DC voltage are combined to generate the power amplifier supply voltage. Implementing the envelope tracking system in this manner can provide enhanced efficiency and/or higher bandwidth relative to an envelope tracking system in which a multi-level switching circuit directly outputs a power amplifier supply voltage.Type: GrantFiled: June 27, 2023Date of Patent: April 30, 2024Assignee: Skyworks Solutions, Inc.Inventors: Serge Francois Drogi, Florinel G. Balteanu, David Richard Pehlke
-
Patent number: 11967981Abstract: A diversity receiver module comprising a multiple pole multiple throw switch, one throw being connected to a signal path configured to support both ultra-high band transmit signals and high-band transmit signals, and another throw being connected to an ultra-high band signal path configured to output an ultra-high band receive signal; an ultra-high band filter configured to filter ultra-high band signals, the ultra-high band filter being connected to a pole of the switch via a signal path; a high band filter configured to filter high band receive signals, the high band filter being diplexed with the ultra-high band filter; and a high band signal path configured to output a high-band receive signal, the high band signal path being connected to the high band filter.Type: GrantFiled: September 27, 2022Date of Patent: April 23, 2024Assignee: SKYWORKS SOLUTIONS, INC.Inventor: Anand Raghavan
-
Patent number: 11967896Abstract: Charging and discharging circuits for assisting charge pumps are disclosed. In certain embodiments, a radio frequency (RF) switch system includes an RF switch that receives an RF signal and is controlled by a switch control signal received at an input, a first charge pump configured to generate a first charge pump voltage, a level shifter powered by the first charge pump voltage and that generates the switch control signal based on a switch enable signal, and a charge pump assistance switch coupled to the input of the radio frequency switch and that activates to assist the first charge pump in response to a transition of the switch enable signal from a first state to a second state.Type: GrantFiled: September 26, 2022Date of Patent: April 23, 2024Assignee: Skyworks Solutions, Inc.Inventor: Guillaume Alexandre Blin
-
Patent number: 11967758Abstract: A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.Type: GrantFiled: November 15, 2022Date of Patent: April 23, 2024Assignee: Skyworks Solutions, Inc.Inventor: Ki Wook Lee
-
Patent number: 11967947Abstract: Aspects of this disclosure relate to a multiplexer, such as a duplexer, a quadplexer, a hexaplexer, or the like. The multiplexer includes acoustic wave filters coupled to a common node. A first acoustic wave filter of the acoustic wave filters includes acoustic wave resonators of a first type and a series acoustic wave resonator of a second type coupled between the acoustic wave resonators of the first type and the common node.Type: GrantFiled: April 13, 2021Date of Patent: April 23, 2024Assignee: Skyworks Solutions, Inc.Inventor: Joshua James Caron
-
Patent number: 11962294Abstract: A method for driving an output node includes driving a control node of an output device coupled to the output node according to an input signal and using a fixed regulated voltage and a variable regulated voltage. The method includes generating the fixed regulated voltage based on a first power supply voltage, a second power supply voltage, and a first reference voltage. The method includes generating the variable regulated voltage based on the first power supply voltage, the second power supply voltage, and a second reference voltage. The method includes generating the second reference voltage based on the first power supply voltage, the second power supply voltage, a reference current, and a predetermined target voltage level of the control node of the output device. In an embodiment of the method, generating the second reference voltage includes periodically calibrating the second reference voltage.Type: GrantFiled: November 14, 2022Date of Patent: April 16, 2024Assignee: Skyworks Solutions, Inc.Inventors: Peter Onody, Tamas Marozsak
-
Patent number: 11962283Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.Type: GrantFiled: December 1, 2022Date of Patent: April 16, 2024Assignee: Skyworks Solutions, Inc.Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
-
Patent number: 11962233Abstract: An isolated gate driver has a first portion in a first voltage domain and a second portion in a second voltage domain. The first and second portions are coupled by an isolation communication channel. The isolated gate driver transmits across the isolation communication channel a serial word containing first drive strength information and simultaneously transmits gate information with the serial word across the isolation communication channel. The gate information indicates a state of a gate signal for a transistor coupled to the second portion of the isolated gate driver. A demodulator circuit demodulates a signal containing the gate information and the drive strength information transmitted across the isolation communication channel in the serial word. A gate signal output circuit coupled to the demodulator circuit supplies the gate signal based on the gate information with a drive strength of the gate signal being based on the drive strength information.Type: GrantFiled: May 1, 2023Date of Patent: April 16, 2024Assignee: Skyworks Solutions, Inc.Inventors: Michael Robert May, Fernando Naim Lavalle Aviles, Carlos Jesus Briseno-Vidrios, Patrick Johannus De Bakker, Gabor Marek, Charles Guo Lin, Peter Onody, Tamas Marozsak, Andras V. Horvath
-
Patent number: 11961805Abstract: A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.Type: GrantFiled: September 13, 2021Date of Patent: April 16, 2024Assignee: Skyworks Solutions, Inc.Inventors: Howard E. Chen, Robert Francis Darveaux