Abstract: The present disclosure relates to devices and methods for detecting and preventing occurrence of a saturation state in a power amplifier. A power amplifier module can include a power amplifier including a cascode transistor pair. The cascode transistor pair can include a first transistor and a second transistor. The power amplifier module can include a current comparator configured to compare a first base current of the first transistor and a second base current of the second transistor to obtain a comparison value. The power amplifier module can include a saturation controller configured to supply a reference signal to an impedance matching network based on the comparison value. The impedance matching network can be configured to modify a load impedance of a load line in electrical communication with the power amplifier based at least in part on the reference signal.

Abstract: Configuration devices in a module. In some embodiments, a radio frequency module includes a serial bus including a first serial data line and a second serial data line. The radio-frequency module also includes a first switch coupled to a first device and a third line. The radio-frequency module further includes a module coupled to the serial bus and the first switch, the module configured to determine whether first data is detected on a first serial data line, determine whether second data is detected on a second serial data line, adjust a configuration of the first switch when the first data is detected on the first serial data line and the second data is detected on the second serial data line.

Abstract: In one example, a remote tuner module includes: a first tuner to receive, process and demodulate a first radio frequency (RF) signal to output an analog audio signal, and to receive and process a second RF signal to output a first downconverted modulated signal; a second tuner to receive and process the second RF signal to output a second downconverted modulated signal; a demodulator circuit coupled to the first and second tuners to demodulate and link the first and second modulated signals, to output a linked demodulated signal. The remote tuner module may further include a gateway circuit coupled to at least the demodulator circuit to output the analog audio signal and the linked demodulated signal.

Abstract: A tunable vector recombination amplifier comprises an input, an output, first and second amplifier circuit paths each including a respective phase shifter to receive a respective input signal from the input and to apply a respective phase shift to produce a respective phase-shifted signal, a respective interstage impedance matching network, and a respective amplifier connected between the respective phase shifter and interstage impedance matching network to receive and amplify the respective phase-shifted signal to produce a respective amplified signal, first and second controllable DC voltage sources each coupled to a respective amplifier and configured to provide a respective supply voltage to the respective amplifier, values of the supply voltages being independently controllable, and an output amplifier stage to receive, amplify, and vectorially combine the amplified signals to produce a combined signal having a specified phase determined by the phase shifts and supply-voltage values and a specified ampli

Abstract: Apparatus and methods for envelope alignment calibration in radio frequency (RF) systems are provided. In certain embodiments, calibration is performed by providing an envelope signal that is substantially triangular along an envelope path, and by providing an RF signal to a power amplifier along an RF signal path. Additionally, an output of the power amplifier is observed to generate an observation signal using an observation receiver. The observation signal includes a first peak and a second peak, and a delay between the envelope signal and the RF signal is controlled based on relative size of the peaks of the observation signal to one another.

Abstract: A front-end module may include an acoustic wave filter with a first and second interdigital transducer electrode, and a low noise amplifier (LNA) that converts a differential input to a single-ended output with respect to ground. The first interdigital transducer electrode may be single-ended with a first input bus bar configured to receive an input signal and a second input bus bar connected to ground. The second interdigital transducer electrode may be differential with a first output bus bar connected to a first output terminal and a second output bus bar connected to a second output terminal. The LNA may have a differential input connected to the acoustic wave filter, a first input transistor that receives a first signal from the first output terminal of the acoustic wave filter, and a second input transistor that receives a second signal from the second output terminal of the acoustic wave filter.

Abstract: Radio-frequency splitter circuits, devices and methods. In some embodiments, a power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.

Abstract: A method of manufacturing a ceramic resonator radio frequency filter includes placing one or more first coaxial resonators on a printed circuit board, and placing one or more second coaxial resonators over the one or more first coaxial resonators so that the coaxial resonators are arranged in a stacked configuration on the printed circuit board. The method also includes electrically connecting the one or more first coaxial resonators and second coaxial resonators to the printed circuit board.

Abstract: A method of manufacturing an acoustic wave device is disclosed. The method includes attaching a support layer to a ceramic layer. The support layer has a higher thermal conductivity than the ceramic layer. The ceramic layer can be a polycrystalline spinel layer. The method also includes bonding a piezoelectric layer to a surface of the ceramic layer. The method further includes forming an interdigital transducer electrode over the piezoelectric layer.

Abstract: A front-end module comprises a bias network including a current mirror, a junction temperature sensor, an n-bit analog-to-digital converter, an n-bit current source bank configured to automatically set reference current levels for one or more operating temperature regions, and a power amplifier. The bias network, junction temperature sensor, n-bit analog-to-digital converter, n-bit current source bank, and power amplifier are integrated on a first semiconductor die.

Abstract: A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Abstract: Examples of the disclosure include an amplifier system comprising an amplifier having an input to receive an input signal, and an output to provide an amplified output signal, the amplifier having a power level indicative of at least one of the input signal power and the amplified output signal power, and a linearizer coupled to the amplifier and having a plurality of modes of operation including a fully disabled mode and a fully enabled mode, the linearizer being configured to determine the power level of the amplifier, select a mode of operation of the plurality of modes of operation based on the power level of the amplifier, determine one or more linearization parameters corresponding to the selected mode of operation, and control linearization of the amplified output signal based on the determined one or more linearization parameters.

Abstract: Apparatus and methods for true power detection are provided herein. In certain embodiments, a power amplifier system includes an antenna, a directional coupler, and a power amplifier electrically connected to the antenna by way of a through line of the directional coupler. The power amplifier system further includes a first switch, a second switch, and a combiner that combines a first coupled signal received from a first end of the directional coupler's coupled line through the first switch and a second coupled signal received from a second end of the directional coupler's coupled line through the second switch.

Abstract: Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include receiving by an automated wire cutting apparatus a packaging substrate including a die mounted thereon and a defective wire coupled thereto, positioning one or both of a wire cutting instrument of the automated wire cutting apparatus and the packaging substrate relative to the other based on predetermined instructions, and detaching the defective wire from the packaging substrate using the wire cutting instrument.

Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.

Abstract: A front-end module may include an acoustic wave filter with a first and second interdigital transducer electrode. The first interdigital transducer electrode may be single-ended with a first input bus bar that receives an input signal and a second input bus bar connected to ground. The second interdigital transducer electrode may be differential with a first output bus bar connected to a first output terminal and a second output bus bar connected to a second output terminal. The front-end module may include a low noise amplifier (LNA) that outputs a differential signal via a differential output and has a differential input connected to the acoustic wave filter. The LNA may include a first input transistor that receives a first signal from the first output terminal of the acoustic wave filter and a second input transistor that receives a second signal from the second output terminal of the acoustic wave filter.

Abstract: Aspects of this disclosure relate to acoustic wave devices on stacked die. A first die can include first acoustic wave device configured to generate a boundary acoustic wave. A second die can include a second acoustic wave device configured to generate a second boundary acoustic wave, in which the second die is stacked with the first die. The first acoustic wave resonator can include a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and high acoustic velocity layers on opposing sides of the piezoelectric layer. The high acoustic velocity layers can each have an acoustic velocity that is greater than a velocity of the boundary acoustic wave.

Abstract: A front-end module comprises a low-dropout (LDO) voltage regulator, a reference current generator, and a power amplifier. The LDO voltage regulator, reference current generator, and power amplifier are integrated on a first semiconductor die.

Abstract: In some embodiments, a surface-mountable device can include an electrical element and a plurality of terminals connected to the electrical element. The surface-mountable device can further include a body configured to support the electrical element and the plurality of terminals. The body can have a rectangular cuboid shape with a length, a width, and a height that is greater than the width. The body can include a base plane configured to allow surface mounting of the device.

Abstract: Disclosed herein are embodiments of composite hexagonal ferrite materials formed from a combination of Y phase and Z phase hexagonal ferrite materials. Advantageously, embodiments of the material can have a high resonant frequency as well as a high permeability. In some embodiments, the materials can be useful for magnetodielectric antennas.