Abstract: Aspects of the disclosure include a wireless device comprising a module input to receive an input signal, a module output to provide an amplified output signal, a low-noise amplifier including an input amplification stage coupled to the input, and a plurality of output amplification stages switchably coupled to the input amplification stage, and a plurality of impedance-matching circuits, each impedance-matching circuit of the plurality of impedance-matching circuits having an input coupled to a respective output amplification stage and an output coupled to the module output.

Abstract: Embodiments of the invention relate to a circuit assembly for biasing a PIN diode, wherein a DC biasing voltage is obtained by extracting power from a radio-frequency transmission path. The circuit assembly comprises a PIN diode, an input node configured to receive a radio-frequency input voltage, a rectifying circuit configured to receive the radio-frequency input voltage from the input node and generate a rectified voltage, and a smoothing circuit configured to receive the rectified voltage from the rectifying circuit and generate a DC voltage. The output of the smoothing circuit forms the input to the PIN diode to reverse-bias the diode. Related methods, radio-frequency switching circuits and radio-frequency modules are also provided.

Abstract: This disclosure relates to a system for mitigating distortion in a signal, including a first calculation circuit configured to determine a bit-cell population available to be activated of a plurality of bit-cells based on a signal strength of an input signal, a second calculation circuit configured to determine a number of bit-cells to be activated based on the signal strength of the input signal, the number of bit-cells to be activated being less than or equal to the bit-cell population, a variable-width dynamic element matching network (“variable DEM”) configured to activate a first subset of bit-cells of the bit-cell population based on the number of bit-cells to be activated, and one or more fixed-width dynamic element matching networks (“fixed DEMs”) configured to activate a second subset of bit-cells of the bit-cell population based on the number of bit-cells to be activated.

Abstract: Aspects of this disclosure relate to a radio frequency filter with two pass bands. The RF filter employs a first RF bandpass filter coupled to a common RF input and a common RF output. The RF filter further employs a second RF bandpass filter coupled to the common RF input and the common RF output. A first RF pass band of the first RF bandpass filter and a second RF pass band of the RF second bandpass filter are overlapping RF pass bands. Related methods and wireless communication devices are also disclosed.

Abstract: A piezoelectric microelectromechanical system microphone comprises a support substrate, a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a portion of a perimeter of the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and slits defined in the piezoelectric element about the perimeter of the piezoelectric element, the slits defining a plurality of partial anchors securing the piezoelectric element to the support substrate to improve sensitivity of the piezoelectric microelectromechanical system microphone.

Abstract: An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

Abstract: Examples of the disclosure relate to a carrier aggregation circuit including a first path, a second path, and a switch assembly. The first path has a first filter configured to provide a matched impedance in a first frequency band. The second path has an adjustable matching network and a terminal for coupling to an external filter configured to provide a matched impedance in the second frequency band. The switch assembly is configured to adjust the adjustable matching network to provide a mismatched impedance in the first frequency band. Related methods for carrier aggregation, radio-frequency modules, and wireless devices are also provided.

Abstract: A ladder type acoustic wave filter is disclosed. The acoustic wave filter can include a plurality of parallel arm resonators and a plurality of series arm resonators, in which an electromechanical coupling coefficient of a parallel arm resonator closest to an input node of the acoustic wave filter among the plurality of parallel arm resonators can be smaller than an electromechanical coupling coefficient of a series arm resonator closest to the input node among the plurality of series arm resonators.

Abstract: A piezoelectric microelectromechanical system microphone comprises a support substrate, a membrane including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the membrane, and a compliant anchor including a trench defined in the support substrate about a portion of a perimeter of the membrane to increase sensitivity of the piezoelectric microelectromechanical system microphone.

Abstract: A filter circuit including a plurality of capacitances and a plurality of inductances including one variable reactance that is either an inductance or a capacitance. The filter circuit has a plurality of resonant modes that each correspond to resonance at a resonant frequency between the variable reactance and one or more of the plurality of inductances and one or more of the plurality of capacitances. The variable reactance is conductively coupled with one or more other inductances and capacitances of the pluralities of inductances and capacitances such that a change in the variable reactance causes a change in a resonant frequency of more than one of the plurality of resonant modes. Front-end modules and wireless communication devices incorporating such a filter circuit and a method using such a filter circuit are also described.

Abstract: Examples of the disclosure include a wireless device comprising a power amplifier configured to output a balanced amplified signal, an antenna configured to transmit and receive signals, a balun coupled to the power amplifier and the antenna, and being configured to receive the balanced amplified signal and output, based on the balanced amplified signal, an unbalanced amplified signal to the antenna, and at least one capacitor coupled in series between the power amplifier and the balun.

Abstract: An interdigital transducer increased propagation frequency and a method for making the same is described. The transducer comprises a substrate for propagation of acoustic waves comprising a first surface having alternating high and low surface portions extending laterally across the substrate, a set of elongate first electrodes, each first electrode disposed on a respective high surface portion and a set of elongate second electrodes, each second electrode disposed on a respective low surface portion such that the first and second electrodes are alternately adjacent to one another, the high and low surface portions being substantially equal in width to each electrode of the first and second sets of electrodes.

Abstract: A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least two of the walls defining a respective anchor region each, a piezoelectric film layer defining at least two beams, each respective beam supported by the substrate at each anchor region, the beams being free along a portion of their respective lengths and also connected at a connecting region away from the respective anchor regions; and an electrode disposed over the piezoelectric film layer. A method of manufacturing such a MEMS microphone is also provided.

Abstract: A switching audio amplifier and method of operation. The switching audio amplifier comprises a voltage supply selector coupling a power supply input to a first power supply voltage; a switching circuit generating a drive signal for a loudspeaker by modulating the power supply input based on a modulation signal; a pulse generator receiving an audio input signal and outputting the modulation signal based on the audio input signal and the voltage of the power supply input; and a supply voltage monitor. The supply voltage monitor is configured to increase the voltage of the power supply input by causing the voltage supply selector to couple the power supply input to a second power supply voltage responsive to the modulation signal exceeding the first threshold, and the supply voltage monitor preventing the voltage supply selector from reducing the voltage of the power supply input for a first time period.

Abstract: A filter assembly operating at wider passband with an enhanced reflection coefficient is provided herein. In certain embodiments, the filter assembly comprises a first filter configured to allow signals received via an antenna node to pass at a first passband, the first filter including a plurality of resonators connected in series and parallel arms, the plurality of resonators of the first filter including a first type of resonator configured to broaden the first passband, at least a series resonator nearest to the antenna node or a shunt resonator nearest to the antenna node among the plurality of resonators of the first filter being a second type of resonator configured to improve reflection characteristics at a stopband of the first filter, and a second filter configured to allow the signals received via the antenna node to pass at a second passband using the second type of resonators.

Abstract: A class-D amplifier having an output driver with a first, second, and third driver, the output driver having a first output coupled to the first and third drivers, a second output coupled to the second driver; a sensing resistor coupled in series between the first driver and the first output; and a pulse width modulation (PWM) controller coupled to the inputs of the drivers and configured to receive an audio input signal; control a PWM generator to generate a first pulse signal and a second pulse signal based on the audio input signal and a power supply input; determine a voltage drop across the sensing resistor; and, responsive to the voltage drop being greater than a threshold, sequence control of the first pulse signal to the first driver and switch a voltage at the first driver to an increased voltage based on the voltage drop.

Abstract: Electronic acoustic devices and methods of operating the same include a microphone having a frequency response including a resonance frequency, a reference microphone having a frequency response including a resonance frequency, the microphone and the reference microphone configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the microphone, and an equalization module configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone.

Abstract: Disclosed herein are signal amplifier architectures that provide a plurality of gain modes. Different gain modes can use different paths through the amplifier architecture. Switches that are used to select the path through the amplifier architecture can be configured to also provide targeted impedance in a degeneration block or matrix. The switches that select the gain path are provided in the amplifier architecture and are thus not needed or used in the degeneration block, thereby reducing the size of the package for the amplifier architecture, improving the noise figure (NF), improving impedance matching, and eliminating the need for control logic associated with the degeneration block or matrix.

Abstract: An acoustic wave device, and an acoustic wave filter and electronics module including the same. The acoustic wave device comprises a first interdigital transducer electrode having a first bus bar and a first plurality of electrode fingers extending from the first bus bar, the first bus bar having a width of 3 ?m or less in a direction parallel to the extension of the first plurality of electrode fingers, and a second interdigital transducer electrode having a second bus bar and a second plurality of electrode fingers extending from the second bus bar and interleaved with the first plurality of electrode fingers, the second bus bar having a width of 3 ?m or less in a direction parallel to the extension of the second plurality of electrode fingers. The acoustic wave device allows for improvements in power durability when used in an acoustic wave filter, without an increase in size of the acoustic wave filter.