Abstract: A method of manufacturing a printed circuit board includes forming a through hole 2 in an insulating layer 1 having upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductor 4 to be deposited at least in the through hole 2 and on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor 4, while leaving at least the first plated conductor 4 in a mid-portion in a vertical direction within the through hole 2; and forming by semi-additive method a second plated conductor 6 that fills an outer portion than the first plated conductor 4 in the through hole 2, and forms a wiring conductor on the upper and lower surfaces.

Abstract: A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability.

Abstract: A wiring board of the present invention includes a substrate including a woven fabric formed of a plurality of glass fibers and a resin covering the woven fabric; a plurality of through holes T penetrating through the substrate in a thickness direction thereof; and a plurality of through hole conductors adhered to inner walls of the through holes T respectively. The through holes T include a first through hole and a second through hole, and, in the woven fabric, the number of the glass fibers through which the first through hole penetrates is larger than the number of the glass fibers through which the second through hole penetrates. In the first and second through holes, portions thereof having narrowest widths are surrounded by the woven fabric, and the narrow width portion of the first through hole is smaller than the narrow width portion of the second through hole.

Abstract: A wiring board 3 according to the present invention includes a first resin layer 18a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18a; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18a.

Abstract: A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an inner wall of the through-hole. The base body has a fiber layer including a plurality of glass fibers and a resin that covers the plurality of glass fibers. The glass fibers have a groove-shaped concavity on a surface exposed to the inner wall of the through-hole. The concavity is filled with a part of the through-hole conductor.

Abstract: A wiring board includes a plurality of circular semiconductor element connection pads deposited in a lattice form onto a mounting portion of an insulation substrate, their upper surfaces being connected to electrodes of a semiconductor element. A solder resist layer is deposited onto the insulation substrate, which covers the side surfaces of these pads and exposes the upper surfaces of these pads. The solder resist layer has a concave part whose bottom surface corresponds to at least all the upper surfaces of these pads.

Abstract: In a wiring board, insulation layers and wiring conductors are alternately laminated, and a plurality of strip-shaped wiring conductors for connecting semiconductor elements are arranged side by side on the outermost insulation layer. Each of the wiring conductors partly has a connection pad to which the electrode terminals of the semiconductor elements are connected by flip-chip bonding. In the wiring board, a solder resist layer is deposited over the outermost insulation layer and the strip-shaped wiring conductors so as to have slit-shaped openings for exposing the upper surfaces of the connection pads. The solder resist layer fills up the space between the connection pads adjacent to each other and exposed within the slit-shaped openings.

Abstract: A method of manufacturing a printed circuit board includes forming a through hole 2 in an insulating layer 1 having upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductor 4 to be deposited at least in the through hole 2 and on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor 4, while leaving at least the first plated conductor 4 in a mid-portion in a vertical direction within the through hole 2; and forming by semi-additive method a second plated conductor 6 that fills an outer portion than the first plated conductor 4 in the through hole 2, and forms a wiring conductor on the upper and lower surfaces.

Abstract: There is provided a printed circuit board including an insulating substrate having a guide hole, a solder resist layer coated on a surface of the insulating substrate, and a connection pad arranged on the surface of the insulating substrate and having an outer periphery covered with the solder resist layer and a central portion exposed in an opening formed in the solder resist layer. The solder resist layer has a positioning hole having a diameter smaller than that of the guide hole and formed by photolithography above the guide hole simultaneously with the opening.

Abstract: There is provided a collective printed circuit board including a plurality of printed circuit boards each having a mounting unit on which a semiconductor element is mounted at an upper-surface central portion, and a frame having a plurality of through holes having sizes to surround the mounting portion. Upper-surface peripheral edge portions of the printed circuit boards and a through-hole peripheral portion of the frame are bonded to each other such that the mounting units are exposed from the through holes.

Abstract: A wiring board is comprised of a plurality of circular semiconductor element connection pads deposited in a lattice form onto a mounting portion of an insulation substrate, their upper surfaces being connected to electrodes of a semiconductor element, and a solder resist layer deposited onto the insulation substrate, which covers the side surfaces of these pads and exposes the upper surfaces of these pads. The solder resist layer has a concave part whose bottom surface corresponds to at least all the upper surfaces of these pads.

Abstract: A system and method for determining the position of a radio frequency identification (RFID) transponder with respect to a sensor. In one embodiment, the system comprises a plurality of stationary sensors located in an array within certain physical areas. Each sensor comprises a plurality of antenna coils arranged in unique physical orientations and capable of transmitting radio frequency signals of differing phase. The RFID transponder includes an antenna which receives the plurality of signals generated by the antenna coils, and compares the phase of at least two of the signals to determine the relative position of the transponder. In a second aspect of the invention, the aforementioned antenna coils emit two direction finding mode (DFM) signals in succession; the first signal with all antenna coils turned on, the second with one of the coils turned off.

Abstract: A discrete surveillance device for observing a surveillance location has a housing formed in the shape of a smoke detector and multiple miniature video surveillance cameras mounted within the housing to simultaneously observe multiple areas of the surveillance location. The surveillance cameras are concealed in the housing from an observer viewing the exterior of the housing. Further discrete surveillance devices include a face plate or housing having a clock exterior with a miniature video surveillance camera mounted on an adjustable camera gimbal attached to the back surface of the face plate or clock. The surveillance camera is concealed from an observer viewing the exterior surface of the face plate or clock.

Abstract: A lock includes a face plate into which a lock cylinder is mounted. Extending from the rear side of the face plate is a frame for supporting the back of the lock cylinder. A cover plate covers the front of the lock cylinder and includes one or more arms extending through the face plate to the back thereof, where the arms are secured against the plate. By this arrangement, the cover plate is secured to the back of the face plate, preventing removal of the lock cylinder by prying. The frame secures the lock cylinder to the rear, preventing it from being dislodged by hammer blows. Against all such attacks, the full structural integrity of the face plate serves to keep the lock cylinder in place and the lock secure.

Abstract: A secure entry system makes use of radio transmissions to communicate with locks, keys, and related components throughout the system. The radio transmissions can be made using a paging system, a cellular telephone system, or any other RF carrier. Some embodiments employ a cellular telephone in lieu of an electronic key. Others integrate a paging receiver within an electronic key to provide a unit with dual functionality. The system is illustrated with reference to exemplary applications in the industrial site security, real estate lockbox, and transportation fields.

Abstract: A discrete surveillance device for observing a surveillance location has a housing formed in the shape of a smoke detector and multiple miniature video surveillance cameras mounted within the housing to simultaneously observe multiple areas of the surveillance location. The surveillance cameras are concealed in the housing from an observer viewing the exterior of the housing. Further discrete surveillance devices include a face plate or housing having a clock exterior with a miniature video surveillance camera mounted on an adjustable camera gimbal attached to the back surface of the face plate or clock. The surveillance camera is concealed from an observer viewing the exterior surface of the face plate or clock.

Abstract: The latching components of the padlock are driven by a motor between positions for latching and releasing the padlock shackle. Power for the motor is provided by a source carried in an electronic key. An encoder element with associated optical elements provides position information to the control circuit carried inside of the padlock. The control circuit correlates the position information with the signal directing power to the motor so that the motor is precisely controlled for moving the latching elements between release and latch.

Abstract: Latching components of a padlock are driven by a motor between latched and released positions. An encoder element with associated optical elements provides position information to a control circuit. The control circuit correlates the position information with the signal directing power to the motor so that the motor is precisely controlled for moving the latching elements between release and latch. If the motor jams (sensed by overcurrent), it is operated briefly in alternating directions to try and dislodge the grit or ice causing the jam. The padlock shackle is latched into place by balls which are driven into recesses in the shackle legs. The use of plural balls on at least one side helps isolate the drive motor and gears from grit that may enter through the padlock's top shackle holes.

Abstract: An overhead door position sensor assembly includes a sensor actuating device, and a position sensor including a roller track clamping device for mounting the position sensor onto a roller track of an overhead door assembly. The sensor actuating device is mountable to an overhead door of the overhead door assembly for actuating the position sensor when the sensor actuating device is located within a minimum actuation distance from the position sensor. The roller track clamping device includes a body having a main member for placement adjacent to a sidewall of the roller track and a curved resilient member extending from the main member for placement along the contour of a curved roller race that extends from the sidewall of the roller track. A bracket of the roller track clamping device is coupled to the body.