Patents Assigned to SLSP Partners, Inc.
  • Patent number: 5795356
    Abstract: A process for manufacturing microelectronic components that can be fabricated in a facility 1 including integrated circuits on silicon wafers, flat panel displays on glass substrates or any other microelectronic components fabricated in a similar fashion, a process of constructing the facility, and the facility. The fabrication facility 1 relies on a central hub 3 from which processing areas 2 extend out radially like spokes. The processing areas 2 are arranged in a pattern so as to be served by common services which include gases, chemicals, ultra pure water, vapor exhaust, liquid waste, air conditioning, centralized vacuum, centralized clean compressed air, hot water, steam, natural gas, power including emergency, conditioned, and unconditioned power, and process cooling water.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: August 18, 1998
    Assignee: SLSP Partners, Inc.
    Inventor: Lindsay Leveen