Patents Assigned to Small Precision Tools, Inc.
  • WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS
    Publication number: 20090308911
    Abstract: A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portion being tapered towards the tip thereof, said working tip portion having an annular chamfer at the tip thereof; wherein the concentric capillary opens into the annular chamfer of the working tip, and wherein the diameter of the cylindrical portion decreases consecutively at a plurality of discrete intervals along the length of the cylindrical portion towards the working tip portion.
    Type: Application
    Filed: August 25, 2009
    Publication date: December 17, 2009
    Applicant: SMALL PRECISION TOOLS INC.
    Inventors: Jaime Castaneda, Kay Soon Goh
  • Wire bonding capillary tool having multiple outer steps
    Patent number: 7597231
    Abstract: A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portion being tapered towards the tip thereof, said working tip portion having an annular chamfer at the tip thereof; wherein the concentric capillary opens into the annular chamfer of the working tip, and wherein the diameter of the cylindrical portion decreases consecutively at a plurality of discrete intervals along the length of the cylindrical portion towards the working tip portion.
    Type: Grant
    Filed: April 10, 2006
    Date of Patent: October 6, 2009
    Assignee: Small Precision Tools Inc.
    Inventor: Jaime Castaneda
  • Semiconductor bonding tool
    Patent number: 5217154
    Abstract: The disclosure relates to a bonding tool tip bonding electronic interconnects having a shank portion formed of a relatively hard, stiff material having a high modulus of elasticity and a foot portion formed of polycrystalline diamond bonded to the shank portion. The shank portion is preferably formed of tungsten carbide. The foot portion can have an aperture therethrough for feeding of wire to be welded.
    Type: Grant
    Filed: May 22, 1990
    Date of Patent: June 8, 1993
    Assignee: Small Precision Tools, Inc.
    Inventors: Richard Elwood, Kenneth Ellett, Hugo Stebler
  • Protection of semiconductor wire bonding capillary from spark erosion
    Patent number: 4513190
    Abstract: A wire bonding capillary of a hard, normally electrically non-conductive material wherein surfaces of the capillary are coated with a thin electrically conductive material for protecting the capillary bonding face from spark erosion damage and reduction in carbon-like material build-up inside the inner taper of the capillary bore by conduction of current from an electronic flame-off (EFO) torch through a low resistance path to ground.
    Type: Grant
    Filed: January 3, 1983
    Date of Patent: April 23, 1985
    Assignee: Small Precision Tools, Inc.
    Inventors: Kenneth W. Ellett, Peter Glutz