Patents Assigned to Smart Packaging Solutions (SPS)
  • Patent number: 12277466
    Abstract: The invention relates to an antenna inlay for a smart card with a contactless communication interface or a dual contact and contactless communication interface. The antenna inlay does not have a layer of plastic material, and is essentially constituted by a metal sheet comprising conductive turns delimited by zones rendered non-conductive by anodization.
    Type: Grant
    Filed: August 25, 2023
    Date of Patent: April 15, 2025
    Assignee: Smart Packaging Solutions
    Inventors: Sautet Alexandre, Turelier Mathieu, Richard Damien
  • Publication number: 20220083830
    Abstract: The invention relates to a chip card with a dual, contactless and contact-based communication interface, comprising a card body made up of two metal sheets and an electronic module provided with a terminal block and an antenna designed for radio-frequency communication with the antenna of a remote reader. The electronic module includes an active communication circuit powered by a battery in the chip card, and configured to generate a carrier signal capable of interacting with the carrier signal emitted by a remote contactless reader in order to establish active radio-frequency communication between the chip card and the remote reader.
    Type: Application
    Filed: December 6, 2019
    Publication date: March 17, 2022
    Applicant: Smart Packaging Solutions
    Inventors: Lea VACCARELLO, Guillaume GERIN, Stephan DANLER-BAUMGARTNER
  • Publication number: 20200394484
    Abstract: An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.
    Type: Application
    Filed: November 20, 2018
    Publication date: December 17, 2020
    Applicant: Smart Packaging Solutions
    Inventors: Bernard CALVAS, Guillaume GERIN, Kevin FABRIZIO
  • Publication number: 20190102663
    Abstract: The invention relates to a contactless chip card intended to communicate with a chip card reader operating at a resonant frequency F0?. The chip card includes a booster antenna provided with an inductive main antenna U and with an inductive concentrator antenna L2, which antennae are connected in series or parallel with a capacitor C, wherein the inductances of L1 and L2 and the capacitance of C are chosen on the one hand to obtain a resonant frequency F0 that is far enough from the frequency of the signal emitted by the reader to limit radiofrequency communication with the reader, and on the other hand so that the connection in parallel of a predetermined capacitance Cd brings the resonant frequency of the card into the vicinity of said frequency F0? of the signal emitted by said reader.
    Type: Application
    Filed: March 9, 2017
    Publication date: April 4, 2019
    Applicant: Smart Packaging Solutions
    Inventors: Stephan Danler-Baumgartner, Benjamin Mear, Deborah Teboul
  • Patent number: 9014755
    Abstract: A communication interface between a smart card to be connected to a smart card connector of a communication mobile substrate, and a wireless communication network, is disclosed. An antenna is offset and/or can be offset outside the structure of the communication mobile substrate, so that the smart card can communicate directly with a contactless communication network without using the communication mobile substrate.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: April 21, 2015
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Patent number: 8644880
    Abstract: A contactless smart card imbedded in a communication mobile substrate connected to a wireless communication network, and a contactless smart card reader in the vicinity of the communication mobile substrate for radiofrequency communication with the contactless smart card, are disclosed. On one hand, a first antenna is provided on the contactless smart card imbedded in the communication mobile substrate and, on the other hand, a second antenna is attached to the communication mobile substrate and connected by inductive coupling to the first antenna, so that the contactless smart card can directly communicate by radiofrequency with the contactless smart card reader without using the wireless communication network.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: February 4, 2014
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Patent number: 8344958
    Abstract: The invention relates to a secured document in the form of a booklet of at least one sheet which may be folded about a folding axis, the document having a transponder with an electronic chip provided with a memory for storing data and a transponder antenna. The document also includes a foldable amplifier antenna, distinct from the transponder antenna and arranged on the document such that, when the same is open, the amplifier antenna amplifies the electromagnetic flux received by the transponder antenna to permit communication of the document with a remote reader and, in the closed position of the document, the amplifier antenna reduces the electromagnetic flux received by the transponder antenna beneath a minimum threshold permitting communication of the electronic chip with a remote reader.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: January 1, 2013
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Olivier Artigue, Cécile Sicot
  • Patent number: 8317108
    Abstract: The invention relates to a chip card with a dual contact and contactless communication interface, including a microelectronic module (11) and a card body (22) provided with a cavity (23) which can receive the microelectronic module, said microelectronic module (11) being formed by a substrate (15), the first face thereof bearing a terminal block of electric contacts (4) and a second face thereof bearing a first microelectronic chip (9) electrically connected to the terminal block of electric contacts (4) and a second chip (10) electrically connected to the terminals of an antenna (13), the coils of which are disposed on the second face of the substrate of the electronic module. The invention is characterised in that the card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11).
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: November 27, 2012
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Patent number: 8272572
    Abstract: The invention relates to an insert for a multilayer chip card, including an intermediate sheet and, on either side of the intermediate sheet, at least one outer sheet having a face in close contact with the corresponding face of the intermediate sheet, the intermediate sheet including at least one recess prior to the lamination of the insert. The insert having at least one of the outer sheets is made from a fluent material, such that, when the intermediate sheet is being laminated with the outer sheets, part of the material of the outer sheets moves into the recess in the intermediate sheet, thereby forming a visual and/or tactile defect on the surface of the insert, indicating whether of not the insert and/or the chip card is authentic.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: September 25, 2012
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Didier Elbaz, Thomas Battmann
  • Patent number: 7992790
    Abstract: A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: August 9, 2011
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Olivier Brunet, Jean-Francois Salvo, Ivan Peytavin