Patents Assigned to Smart Packaging Solutions (SPS)
  • Patent number: 9256821
    Abstract: A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: February 9, 2016
    Assignee: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Anne Ripert, Pierre Volpe, Yves-Pierre Cuenot, Guillaume Henaut
  • Patent number: 9014755
    Abstract: A communication interface between a smart card to be connected to a smart card connector of a communication mobile substrate, and a wireless communication network, is disclosed. An antenna is offset and/or can be offset outside the structure of the communication mobile substrate, so that the smart card can communicate directly with a contactless communication network without using the communication mobile substrate.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: April 21, 2015
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Publication number: 20140103118
    Abstract: A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.
    Type: Application
    Filed: April 4, 2012
    Publication date: April 17, 2014
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Anne Ripert, Pierre Volpe, Yves-Pierre Cuenot, Guillaume Henaut
  • Patent number: 8644880
    Abstract: A contactless smart card imbedded in a communication mobile substrate connected to a wireless communication network, and a contactless smart card reader in the vicinity of the communication mobile substrate for radiofrequency communication with the contactless smart card, are disclosed. On one hand, a first antenna is provided on the contactless smart card imbedded in the communication mobile substrate and, on the other hand, a second antenna is attached to the communication mobile substrate and connected by inductive coupling to the first antenna, so that the contactless smart card can directly communicate by radiofrequency with the contactless smart card reader without using the wireless communication network.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: February 4, 2014
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Patent number: 8344958
    Abstract: The invention relates to a secured document in the form of a booklet of at least one sheet which may be folded about a folding axis, the document having a transponder with an electronic chip provided with a memory for storing data and a transponder antenna. The document also includes a foldable amplifier antenna, distinct from the transponder antenna and arranged on the document such that, when the same is open, the amplifier antenna amplifies the electromagnetic flux received by the transponder antenna to permit communication of the document with a remote reader and, in the closed position of the document, the amplifier antenna reduces the electromagnetic flux received by the transponder antenna beneath a minimum threshold permitting communication of the electronic chip with a remote reader.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: January 1, 2013
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Olivier Artigue, Cécile Sicot
  • Patent number: 8317108
    Abstract: The invention relates to a chip card with a dual contact and contactless communication interface, including a microelectronic module (11) and a card body (22) provided with a cavity (23) which can receive the microelectronic module, said microelectronic module (11) being formed by a substrate (15), the first face thereof bearing a terminal block of electric contacts (4) and a second face thereof bearing a first microelectronic chip (9) electrically connected to the terminal block of electric contacts (4) and a second chip (10) electrically connected to the terminals of an antenna (13), the coils of which are disposed on the second face of the substrate of the electronic module. The invention is characterised in that the card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11).
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: November 27, 2012
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Patent number: 8272572
    Abstract: The invention relates to an insert for a multilayer chip card, including an intermediate sheet and, on either side of the intermediate sheet, at least one outer sheet having a face in close contact with the corresponding face of the intermediate sheet, the intermediate sheet including at least one recess prior to the lamination of the insert. The insert having at least one of the outer sheets is made from a fluent material, such that, when the intermediate sheet is being laminated with the outer sheets, part of the material of the outer sheets moves into the recess in the intermediate sheet, thereby forming a visual and/or tactile defect on the surface of the insert, indicating whether of not the insert and/or the chip card is authentic.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: September 25, 2012
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Didier Elbaz, Thomas Battmann
  • Patent number: 7992790
    Abstract: A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: August 9, 2011
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Olivier Brunet, Jean-Francois Salvo, Ivan Peytavin
  • Publication number: 20110163167
    Abstract: The invention relates to a contactless smart card that comprises a card body and an electronic module provided with an electronic chip connected to the terminals of an antenna, the electronic module being arranged in a recess formed in the card body, wherein the exposed surface of the electronic module comprises at least one graphic security element capable of protecting said electronic module and the contactless card against attempts at fraud.
    Type: Application
    Filed: June 21, 2009
    Publication date: July 7, 2011
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Olivier Artigue, Stéphane Semori, Deborah Teboul, Cécile Sicot
  • Publication number: 20100288842
    Abstract: The invention relates to an insert for a multilayer chip card, including an intermediate sheet and, on either side of the intermediate sheet, at least one outer sheet having a face in close contact with the corresponding face of the intermediate sheet, the intermediate sheet including at least one recess prior to the lamination of the insert. The insert having at least one of the outer sheets is made from a fluent material, such that, when the intermediate sheet is being laminated with the outer sheets, part of the material of the outer sheets moves into the recess in the intermediate sheet, thereby forming a visual and/or tactile defect on the surface of the insert, indicating whether of not the insert and/or the chip card is authentic.
    Type: Application
    Filed: June 19, 2008
    Publication date: November 18, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Didier Elbaz, Thomas Battmann
  • Publication number: 20100283690
    Abstract: The invention relates to a secured document in the form of a booklet of at least one sheet which may be folded about a folding axis, the document having a transponder with an electronic chip provided with a memory for storing data and a transponder antenna. The document also includes a foldable amplifier antenna, distinct from the transponder antenna and arranged on the document such that, when the same is open, the amplifier antenna amplifies the electromagnetic flux received by the transponder antenna to permit communication of the document with a remote reader and, in the closed position of the document, the amplifier antenna reduces the electromagnetic flux received by the transponder antenna beneath a minimum threshold permitting communication of the electronic chip with a remote reader.
    Type: Application
    Filed: July 15, 2008
    Publication date: November 11, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Olivier Artigue, Cécile Sicot
  • Publication number: 20100176205
    Abstract: The invention relates to a chip card with a dual contact and contactless communication interface, including a microelectronic module (11) and a card body (22) provided with a cavity (23) which can receive the microelectronic module, said microelectronic module (11) being formed by a substrate (15), the first face thereof bearing a terminal block of electric contacts (4) and a second face thereof bearing a first microelectronic chip (9) electrically connected to the terminal block of electric contacts (4) and a second chip (10) electrically connected to the terminals of an antenna (13), the coils of which are disposed on the second face of the substrate of the electronic module. The invention is characterised in that the card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11).
    Type: Application
    Filed: March 28, 2008
    Publication date: July 15, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventor: Philippe Patrice
  • Publication number: 20100022273
    Abstract: A contactless smart card imbedded in a communication mobile substrate connected to a wireless communication network, and a contactless smart card reader in the vicinity of the communication mobile substrate for radiofrequency communication with the contactless smart card, are disclosed. On one hand, a first antenna is provided on the contactless smart card imbedded in the communication mobile substrate and, on the other hand, a second antenna is attached to the communication mobile substrate and connected by inductive coupling to the first antenna, so that the contactless smart card can directly communicate by radiofrequency with the contactless smart card reader without using the wireless communication network.
    Type: Application
    Filed: December 20, 2007
    Publication date: January 28, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventor: Philippe Patrice
  • Publication number: 20100016020
    Abstract: A communication interface between a smart card to be connected to a smart card connector of a communication mobile substrate, and a wireless communication network, is disclosed. An antenna is offset and/or can be offset outside the structure of the communication mobile substrate, so that the smart card can communicate directly with a contactless communication network without using the communication mobile substrate.
    Type: Application
    Filed: December 20, 2007
    Publication date: January 21, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventor: Philippe Patrice
  • Publication number: 20090057414
    Abstract: A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.
    Type: Application
    Filed: February 3, 2006
    Publication date: March 5, 2009
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Olivier Brunet, Jean-Francois Salvo, Ivan Peytavin
  • Publication number: 20080309502
    Abstract: The invention relates to a method of detecting a fire in a wooded area. Some trees in the area are provided with a fire sensor having a radiofrequency emitter able to emit information for identifying and/or locating each sensor, according to a grid of the area to be monitored. At each fire sensor, the fire absent or fire present state is detected A fire sensor emits an alert signal to a monitoring post if a fire is present in the vicinity of the sensor. The alert signal contains information for identifying and/or locating the sensor. The alert signal is transmitted from the monitoring post to a fire brigade by means of a long-range radiofrequency link.
    Type: Application
    Filed: October 25, 2006
    Publication date: December 18, 2008
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Henri Boccia, Philippe Patrice
  • Patent number: D730360
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: May 26, 2015
    Assignee: SMART PACKAGING SOLUTIONS (SPS)
    Inventor: Halim Bousmaha