Abstract: The present disclosure relates to carrier tapes, IC modules, and smart card devices. According to one embodiment, an article of manufacture comprises: a non-conductive substrate having a front side and a rear side, and a plurality of through holes extending from the front side to the rear side; a smart card contact area arranged on the front side of the substrate and having a plurality of conductive pads which are mutually insulated and close front-side ends of the through holes; a plurality of through-hole solder pads and a plurality of conductive traces arranged on the rear side of the substrate, wherein the through-hole solder pads are arranged at rear-side ends of the through holes, wherein the conductive traces are conductively coupled to the through-hole solder pads respectively; and a solder mask at least partially overlaying the conductive traces.

Abstract: The present disclosure relates to a smart card device comprising: a laminated core comprising: a front substrate (10); a first flexible sheet (20) having a card circuitry formed thereon; a first substrate (30); a second flexible sheet (40) having an inductive circuitry formed thereon, and a second substrate (50) in a top-to-bottom order, wherein the front substrate (10) provides at least one first opening (11) which defines a perforated design and a second opening (12) through which a contact pad (22) is exposed, wherein the card circuitry includes: a flip chip (21), a first antenna coil (24) conductively coupled to the flip chip (21), the contact pad (22), at least one conductor path (23) conductively coupling the contact pad (22) to the flip chip (21), wherein the inductive circuitry includes at least one LED module (46) arranged proximate to the at least one first opening (11) and a second antenna coil (44) conductively coupled to the at least one LED module (46), and wherein the first substrate (30) inclu

Abstract: Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.

Abstract: Embodiments of the invention relate to processes for fabricating a smart device (200), e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers (220, 240) interposing a flexible film (230) having conductor pattern thereon, at least one flip chip (250) for operating the smart card device is embedded in a first substrate (220) such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip (250) is arranged at a position in a first vertical plane; and a contact pad (260), for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.