Patents Assigned to Smartrac IP B.V.
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Patent number: 8669910Abstract: An antenna arrangement for a chip card includes an antenna conductor structure that is formed from a surface conductor. The antenna conductor structure includes a dipole arrangement arranged on a card substrate and that has a first antenna strand and a second antenna strand. The antenna conductor structure includes a terminal arrangement connecting the antenna conductor structure to a chip and for forming a transponder including the antenna conductor structure and the chip. A surface of the card substrate is divided into a grasping zone for handling the chip card and a transponder zone for arranging the transponder in such a manner that the grasping zone extends beyond a center region of the substrate surface and at least one lateral edge of the grasping zone is formed by a lateral edge of the substrate surface.Type: GrantFiled: April 28, 2009Date of Patent: March 11, 2014Assignee: Smartrac IP B.V.Inventors: Manfred Rietzler, Raymond Freeman
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Patent number: 8665172Abstract: A chip carrier for contacting with a chip and an antenna is disposed on an antenna substrate. The chip carrier features a carrier substrate having a chip contact arrangement located at a distance from longitudinal ends of the carrier substrate for electrical contacting with a chip. The carrier substrate includes two antenna contact surfaces having the chip contact arrangement therebetween for electrical contacting with the antenna. The chip contact arrangement and the antenna contact surfaces are located on an application surface of the chip carrier. At least one insulation surface-is formed on the application surface between the chip contact arrangement and the antenna contact surfaces.Type: GrantFiled: March 20, 2009Date of Patent: March 4, 2014Assignee: Smartrac IP B.V.Inventors: Manfred Rietzler, Raymond Freeman
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Patent number: 8629015Abstract: According to an aspect of the invention, a method is provided for manufacturing electronic components. A conducting element comprising a first portion, a second portion and a third portion between the first portion and the second portion is provided. Thermally responsive dielectric material is added at least onto the third portion of the conducting element. Electric current is supplied between the first portion and the second portion of the conducting element causing ohmic heating to affix dielectric material located on the third portion to the third portion. Non-thermally-affixed dielectric material is removed.Type: GrantFiled: July 3, 2009Date of Patent: January 14, 2014Assignee: Smartrac IP B.V.Inventors: Tomas Bäcklund, Kaisa Lilja, Timo Joutsenoja
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Patent number: 8616459Abstract: A product that comprises a mounting hole or a preform for the mounting hole and a radio frequency identification transponder for wireless identification, said transponder comprising at least an integrated circuit and wiring, wherein the wiring of the transponder at least partly encircles the mounting hole or the preform, is disclosed. The product may be configured to break when the product is ripped between the mounting hole and an edge of the product. Furthermore, the product may operate in two modes depending on whether or not an electrically conductive object is penetrating the mounting hole, and may be configured to be suspended in connection with an electrically conductive hanger by using the mounting hole. In addition, a method to produce such a product is disclosed.Type: GrantFiled: June 24, 2010Date of Patent: December 31, 2013Assignee: Smartrac IP B.V.Inventors: Tuomas Sykkö, Thomas Wythe
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Publication number: 20130291375Abstract: A method for producing an RFID transponder. An RFID chip is attached onto a conductive sheet. A portion of an antenna element is cut from the conductive sheet using a laser beam after the RFID chip has been attached to the conductive sheet.Type: ApplicationFiled: November 8, 2011Publication date: November 7, 2013Applicant: SMARTRAC IP B.V.Inventors: Juhani Virtanen, Matti Tavilampi
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Publication number: 20130265139Abstract: A method for determining a value of an environment variable using raw data from an energetically essentially passive remote-access apparatus. A value of a first measurable quantity indicative of the environment variable is obtained from the raw data. The value of the environment variable is determined using calibration data and the value of the first measurable quantity. The accuracy is enhanced by measuring the value of the measurable quantity with a measuring signal of which strength is regulated or by obtaining a value of a second measurable quantity. The second measurable quantity is indicative of the environment variable or measurement conditions of the first measurable quantity. A method for forming calibration data for the measurements. RFID reader devices arranged to carry out the methods and energetically essentially passive remote-access apparatuses for the methods. A database that may be used with the method and a computer product including the database.Type: ApplicationFiled: May 4, 2011Publication date: October 10, 2013Applicant: SMARTRAC IP B.V.Inventors: Kaj Nummila, Kaarle Jaakkola, Miika Huusko, Heikki Seppä, Juhani Virtanen, Juha Vattulainen
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Patent number: 8547288Abstract: The present invention relates to an antenna arrangement (10) for the production of chip cards, in particular chip cards used in the UHF frequency range, having a substrate and a plurality of antenna conductor structures (11) formed on the substrate using a coating method, the antenna conductor structures having a terminal arrangement (24) for connecting the antenna conductor structures to a chip, wherein the substrate is formed as a substrate sheet (12), and the antenna conductor structures are disposed on the substrate sheet in a matrix arrangement (13) having a plurality of columns and rows.Type: GrantFiled: April 29, 2009Date of Patent: October 1, 2013Assignee: Smartrac IP B.V.Inventors: Manfred Rietzler, Raymond Freeman
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Patent number: 8522422Abstract: A method for application of a chip module to an antenna module includes supplying a plurality of chip modules arranged in a row arrangement on a sheet carrier. Separating chip modules from the row arrangement and transferring the separated chip modules to a application device. The chip module separated from the row arrangement are subsequently positioned on the antenna substrate by the application device and contacting of the antenna contact surfaces of the chip module with the contact surfaces of the antenna is performed. The invention further relates to a device for the application of a chip module to an antenna module.Type: GrantFiled: March 20, 2009Date of Patent: September 3, 2013Assignee: Smartrac IP B.V.Inventors: Manfred Rietzler, Raymond Freeman
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Patent number: 8505825Abstract: The present invention relates to a layered composite (10) for producing a card body comprising a chip module (12) for a chip card, having a substrate layer arrangement (11) for arranging the chip module, and having intermediate layers (18, 19) disposed on both sides of the substrate layer arrangement, each having a cover layer (21, 22), wherein the substrate layer arrangement and the cover layers are designed in relation to the intermediate layers such that the substrate layer arrangement and the cover layers are formed as layers having a relatively rigid shape and hard surfaces, and the intermediate layers are formed as layers having a relatively elastic shape and soft surfaces, and also relates to a method for producing a layered composite.Type: GrantFiled: March 13, 2009Date of Patent: August 13, 2013Assignee: Smartrac IP B. V.Inventors: Manfred Rietzler, Raymond Freeman
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Patent number: 8467192Abstract: A method for producing a rollable web with successive antennas, where an electronic chip is attached to an antenna in a predetermined position. The position of an electronic chip changes with respect to the antenna when compared to at least some of the chips within individual and successive antennas. A rollable web includes successive antennas, where electronic chips are attached to antennas in a predetermined position. In the rollable web, the position of a chip changes with respect to the antenna compared to at least some of the chips within individual and successive antennas.Type: GrantFiled: April 20, 2009Date of Patent: June 18, 2013Assignee: Smartrac IP B.V.Inventor: Samuli Strömberg
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Patent number: 8448874Abstract: A method for manufacturing a component by etching, the component including a substrate and an electrically conductive line configuration supported by the substrate, the electrically conductive line configuration being formed by etching away locally an electrically conductive coating supported by the substrate. An etching mask is used to control locally removal and maintenance of the electrically conductive coating by using an etchant and it includes barrier material on at least one main area corresponding to the electrically conductive line configuration to be maintained during etching. The etching mask further includes at least one sub-area comprising barrier material, the sub-area being arranged at a distance from the edge of the main area.Type: GrantFiled: December 15, 2008Date of Patent: May 28, 2013Assignee: Smartrac IP B.V.Inventor: Tuomas Koskelainen
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Publication number: 20130105586Abstract: A product that comprises a mounting hole or a preform for the mounting hole and a radio frequency identification transponder for wireless identification, said transponder comprising at least an integrated circuit and wiring, wherein the wiring of the transponder at least partly encircles the mounting hole or the preform, is disclosed. The product may be configured to break when the product is ripped between the mounting hole and an edge of the product. Furthermore, the product may operate in two modes depending on whether or not an electrically conductive object is penetrating the mounting hole, and may be configured to be suspended in connection with an electrically conductive hanger by using the mounting hole. In addition, a method to produce such a product is disclosed.Type: ApplicationFiled: June 24, 2010Publication date: May 2, 2013Applicant: SMARTRAC IP B.V.Inventors: Tuomas Sykkö, Thomas Wythe
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Patent number: 8427322Abstract: The invention relates to a smartcard, particularly an electronic prepayment card, identification card or similar, with at least one transponder unit, and to a method for producing such a smartcard, wherein the transponder unit has at least one chip and at least one antenna connected to the chip, wherein the antenna is made from a conductor that is arranged on an antenna substrate, wherein the extension of the antenna is limited to a patch of the antenna substrate and the antenna has a plurality of conducting lead with at least two windings separated from each other, which windings are arranged so that their axes are at least partly parallel to an axis of symmetry of the smartcard.Type: GrantFiled: May 25, 2007Date of Patent: April 23, 2013Assignee: Smartrac IP B.V.Inventors: Manfred Rietzler, Philippe Castano
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Patent number: 8415782Abstract: The present invention relates to a chip card and a method for the production of a chip card having a chip (21) which is arranged in a card body, and having a plurality of components (18, 19, 22) being electrically conductively connected to the chip by means of a conductor arrangement (20), wherein the card body is composed of a plurality of substrate layers (11, 12, 13) which are arranged in a layer structure, wherein the components and the conductor arrangement are arranged in different substrate layers, specifically a component layer arrangement and a connecting layer arrangement, and have contact surfaces (23, 24, 25, 26, 31, 32, 33, 34), which are disposed so as to overlap one another, for producing an electrically conductive contacting.Type: GrantFiled: May 14, 2009Date of Patent: April 9, 2013Assignee: Smartrac IP B.V.Inventors: Manfred Rietzler, Raymond Freeman
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Patent number: 8395611Abstract: An active-matrix electronic display including a switching circuit for each pixel to control the optical state of the display. The switching circuit includes at least one diode and at least one load impedance for each circuit. The front plane electrode of the display may be unpatterned over a significant portion of the display. The display architecture is especially useful for bi-stable display media that require active matrix addressing, for example electrophoretic displays, and for applications using diodes based on organic semiconductors and/or printed diodes.Type: GrantFiled: December 19, 2006Date of Patent: March 12, 2013Assignee: Smartrac IP B.V.Inventors: Juhani Virtanen, Donald Lupo
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Publication number: 20130014382Abstract: A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.Type: ApplicationFiled: September 24, 2012Publication date: January 17, 2013Applicant: Smartrac IP B.V.Inventor: Smartrac IP B.V.
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Patent number: 8333004Abstract: A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.Type: GrantFiled: October 23, 2008Date of Patent: December 18, 2012Assignee: Smartrac IP B.V.Inventors: Oded Bashan, Guy Shafran
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Publication number: 20120292399Abstract: An RFID tag including a body part and a fixing part for attaching the body part to an object to be identified. The RFID tag includes at least one transponder. The body part and the fixing part include a single integrated piece. The fixing part is formed of a part with a ring-like or loop-like shape that can be fitted around at least a part of the object to be identified. A method for manufacturing an RFID tag and a package including several products separate from each other, including RFID tags for identifying the products separately from each other.Type: ApplicationFiled: January 25, 2011Publication date: November 22, 2012Applicant: SMARTRAC IP B.V.Inventor: Anu Launiainen
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Patent number: 8305764Abstract: The invention relates to a method and a semifinished product for producing an inlay, in particular for chip cards, stored value cards, identification documents, or the like, having at least two electronic components, all electronic components being arranged in a relative configuration on a carrier substrate to implement a component configuration and the component configuration being arranged in a filler material. Furthermore, the invention relates to a method for producing a card having a semifinished product and a card produced using the semifinished product.Type: GrantFiled: November 23, 2007Date of Patent: November 6, 2012Assignee: Smartrac IP B.V.Inventor: Manfred Rietzler
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Patent number: 8188867Abstract: The invention relates to a transponder inlay (11) for manufacturing a layered structure (40) for a personal document with a substrate layer (12) for arranging a transponder unit (15) that includes an antenna coil (13) and a chip module (14) and which is situated on a contact surface (17) of the substrate layer, wherein the chip module (14) is accommodated in a window opening (30) formed in the substrate layer (12) in such a way that a chip carrier (23) of the chip module rests with its circumferential edge on a compressed peripheral shoulder (24) of the window opening (30); the invention also relates to a method for manufacturing the transponder inlay. In addition, the present invention relates to a layered structure for a personal document, which is provided with such a transponder inlay, and an identification document having such a layered structure.Type: GrantFiled: March 9, 2011Date of Patent: May 29, 2012Assignee: Smartrac IP B.V.Inventor: Manfred Rietzler