Abstract: This invention relates generally to ID frequency identification (RFID) transponders and receivers. More specifically to the methods, apparatus and systems of the fabrication of the transponders and receivers. In one example embodiment, to methods, apparatus, and systems to form effective barriers for devices having a layer structure, including encapsulating at least a portion of the side of the devices from being degraded due to impurity penetration into a laminate structure of the devices, which can cause corrosion or malfunction of the devices.

Abstract: A transponder apparatus for a transponder unit has a UHF and HF transponder The UHF transponder has a transponder support, a UHF antenna and a UHF chip. The HF transponder has an HF antenna and an HF chip. The UHF antenna is at the transponder support and is made up of conducting UHF antenna structures in transponder support planes which are spatially separated from one another. The transponder apparatus includes an electrically-insulating attachment layer connecting the UHF transponder to the HF antenna. The transponder apparatus includes an electrically-insulating spacer element connected to the HF transponder and which spatially separates the UHF transponder and the HF transponder relative to a body. The UHF transponder is disposed on the HF antenna. A conducting HF antenna structure of the HF antenna extends beyond a covering surface of the UHF transponder and the HF antenna structure.

Abstract: The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32)

Abstract: Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Abstract: The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32)

Abstract: Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.