Abstract: A quadrax contact assembly includes an isolator having a longitudinal axis and defining four slots extending along the longitudinal axis and circumferentially spaced apart about the longitudinal axis, the four slots being accessible via radial openings in the isolator. The quadrax contact assembly further includes four contacts each configured to be received by a respective slot of the four slots by pressing each of the four contacts into the respective slot in a radial direction.

Abstract: A socket assembly with liquid cooling frame for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a liquid cooling socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path. The socket assembly also includes a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.

Abstract: A shielded modular connector system includes a first portion having a first housing and a plurality of first contact modules, the first housing including a first interface surface and a first interface perimeter surrounding the first interface surface, a first plurality of bays to receive the plurality of first contact modules, and a grounding ring. The system further includes a second portion configured to mate with the first portion, and having a second housing and a plurality of second contact modules. The second housing includes a second interface surface and a second interface perimeter surrounding the second interface surface and designed to face the first interface surface, a second plurality of bays configured to receive the plurality of second contact modules, and a backshell located along at least a portion of the second interface perimeter and extending away from the second interface surface.

Abstract: A high frequency termination for converting a high frequency electrical signal of a circuit into heat. The high frequency termination includes a substrate. The high frequency termination also includes a spiral resistor formed on the substrate and having a first end and a second end. The high frequency termination also includes a conductive pad electrically coupled to the first end of the spiral resistor. The high frequency termination also includes a contact electrically coupled to the conductive pad and configured to connect to the circuit.

Abstract: A method of forming a fluid resistant insulator for use in a connector includes collecting a part having a surface and electrically insulating properties. The method further includes applying a superhydrophobic sealant to the surface of the part having the electrically insulating properties. The method further includes curing the part with the superhydrophobic sealant applied to allow the superhydrophobic sealant to dry.

Abstract: Methods, systems, and apparatus for an electrical connector assembly for connecting an integrated circuit chip to a printed circuit board. The electrical connector assembly includes a socket body that is made of an insulating material. The socket body has a top surface, a bottom surface, and a first plurality of cavities including a first cavity and a second cavity. The first cavity and the second cavity each have an inner surface plated with a conductive material to form a metal grounding shell. The electrical connector assembly includes multiple probes including a first probe and a second probe. The first probe is configured to be positioned within the first cavity and the second probe is configured to be positioned within the second cavity. The electrical connector assembly includes one or more signal traces that electrically connect the metal grounding shells of the first cavity and the second cavity.

Abstract: Methods, systems, and apparatus for electrical connector assemblies. The assemblies include a socket defining a signal cavity, the socket having a first socket opening and a second socket opening. The assemblies include a signal contact probe located within the signal cavity. The signal contact probe includes a first plunger received in the shell cavity and extending through a first shell opening and located in the first socket opening. The signal contact probe includes a second plunger received in the shell cavity and extending through a second shell opening and located in the second socket opening. The assemblies include an end insulation ring located in the second socket opening and around the second plunger, the end insulation ring configured to facilitate substantially constant impedance through the signal spring probe, and configured to restrict lateral movement of the second plunger within the second socket opening.

Abstract: A coupler for electrical connectors. The coupler includes a body having a first end and a second end opposite the first end. The coupler further includes a first connection interface positioned at the first end of the body, the first connection interface having a first set of conductive rings. The coupler further includes a second connection interface positioned at the second end of the body, the second connection interface having a second set of conductive rings electrically connected to the first set of conductive rings.

Abstract: A reconfigurable connector having a first set of electrical contacts and a second set of electrical contacts each configured to be electrically connected to electronic elements. The reconfigurable connector further includes a network access device configured to receive a signal from a remote device and an internal switch coupled to the network access device and configured to reconfigure pairing of the first set of electrical contacts and the second set of electrical contacts based on the signal received by the network access device.

Abstract: A shielded modular connector system includes a first portion having a first housing and a plurality of first contact modules, the first housing including a first interface surface and a first interface perimeter surrounding the first interface surface, a first plurality of bays to receive the plurality of first contact modules, and a grounding ring. The system further includes a second portion configured to mate with the first portion, and having a second housing and a plurality of second contact modules. The second housing includes a second interface surface and a second interface perimeter surrounding the second interface surface and designed to face the first interface surface, a second plurality of bays configured to receive the plurality of second contact modules, and a backshell located along at least a portion of the second interface perimeter and extending away from the second interface surface.

Abstract: A spring probe connector, a device and an assembly for interfacing a daughter card with a backplane. The spring probe connector includes a hollow barrel that defines a first opening and a second opening. The spring probe connector includes a plunger that is received by the first opening. The plunger includes a contact tip that protrudes from the first opening and makes electrical contact with the backplane. The spring probe connector includes one or more springs positioned within the hollow barrel and applies a load onto the plunger. The spring connector includes a contact end that protrudes from the second opening and connects with the printed circuit board of the modular connector assembly.

Abstract: An integrated spring mounted chip termination for converting energy of a circuit into heat to be absorbed by a heatsink. The integrated spring mounted chip termination includes an input tab configured to connect to the circuit. The integrated spring mounted chip termination also includes a chip termination having a top surface. The chip termination includes an input contact located on the top surface and configured to connect to the input tab, a resistor element located on the top surface and connected to the input contact, and a ground contact located on the top surface and connected to the resistor element. The integrated spring mounted chip termination also includes a formed ground spring connected to the ground contact of the chip termination, the formed ground spring configured to attach the chip termination to the heatsink, such that the chip termination and the heatsink are in contact.

Abstract: An electrical connector comprising a first housing defining a cavity therein, a first printed circuit board disposed in the cavity of the first housing, a contact coupled with the first printed circuit board, a disposable second housing defining a cavity therein, and a second printed circuit board disposed in the cavity of the second housing, the second printed circuit board having a contact pad positioned on a surface of the second printed circuit board, the contact pad of the second printed circuit board configured to engage with the contact when the first housing and the second housing are mated together.

Abstract: Methods, systems, and apparatus for reducing electrical arcing in a connector. The connector includes a pin contact having a pin tip end and a pin base end, the pin contact at the pin base end being made of a first material having a first resistance and the plug contact at the tip end being made of a second material having a second resistance greater than the first resistance. The connector also includes a socket contact configured to receive the pin contact, and the socket contact configured to establish an electrical connection with the pin contact to transfer electrical power, the second material of the pin contact configured to prevent electrical arcing by suppressing electrical voltage when the pin contact is mated or unmated from the socket contact while electrical power is being transferred.

Abstract: An integrated spring mounted chip termination for converting energy of a circuit into heat to be absorbed by a heatsink. The integrated spring mounted chip termination includes an input tab configured to connect to the circuit. The integrated spring mounted chip termination also includes a chip termination having a top surface. The chip termination includes an input contact located on the top surface and configured to connect to the input tab, a resistor element located on the top surface and connected to the input contact, and a ground contact located on the top surface and connected to the resistor element. The integrated spring mounted chip termination also includes a formed ground spring connected to the ground contact of the chip termination, the formed ground spring configured to attach the chip termination to the heatsink, such that the chip termination and the heatsink are in contact.