Abstract: A method of manufacturing diodes includes steps of cutting grooves on a ceramic base to form a plurality of units, each of the grooves being formed with a vertical surface and an inclined surface, applying a layer of conductive cream all over top of each of the units except a portion close to a first edge thereof, adhering a plurality of chips on the units with one of the chips on each of the units, applying green sensing paint to the ceramic base and the chips, letting the green sensing paint to expose, developing the green sensing paint, and then removing film to uncover top of the chips and the grooves, applying a layer of conductive cream all over top of the chips except a portion close to a second edge which is opposite to the first edge, mounting a sheet of glass on top of the units and printing codes thereon, severing the ceramic base into a plurality of elongated rectangular blocks; electroplating both longer vertical sides of the elongated rectangular blocks with silver to form two opposite silver-pl