Abstract: A substrate processing apparatus having heat treatment apparatuses for treating a processing target substrate at a predetermined temperature includes: a temperature adjustment mechanism provided in each of the heat treatment apparatuses forming a plurality of heat treatment apparatus blocks for adjusting a temperature of the processing target substrate; a moving mechanism for moving the temperature adjustment mechanism; an exhaust mechanism for exhausting a gas from the heat treatment apparatus; supply ports for supplying a temperature adjustment liquid to temperature adjustment apparatuses; recovery ports for collecting the liquid supplied to the temperature adjustment apparatuses; and a control mechanism for recognizing temperature information of the liquid recovered from recovery ports.