Patents Assigned to S.O.C. Corporation
  • Patent number: 4630022
    Abstract: An electric fuse for high voltage circuit comprises an insulative tubular casing closed at both ends with metal caps and has an insulative cylindrical member within said tubular casing disposed eccentrically and is offset relative to the major axis of said tubular casing so as to define an annular space therewith which is non-uniform in width. The annular space has a wider portion on one side of said tubular member and a narrower portion on the other side thereof. A fusible element is stretched in said narrower portion of said annular space and is secured at both ends to said metal caps.
    Type: Grant
    Filed: February 11, 1985
    Date of Patent: December 16, 1986
    Assignee: S.O.C. Corporation
    Inventor: Yasutada Yuza
  • Patent number: 4599596
    Abstract: A chip fuse comprises a fuse base and a cover therefor both made of a heat resistant and electrically insulating material. The fuse comprises a pair of electrically conductive terminals, each having one end exposed outside of said base for soldering to a printed circuit board, with the other ends of the conductive terminals being spaced apart and in opposed relation to one another inside the fuse base. A fusible element is stretched between the inner ends of said conductive terminals and is secured to said ends by soldering or other suitable means.
    Type: Grant
    Filed: November 29, 1983
    Date of Patent: July 8, 1986
    Assignee: S.O.C. Corporation
    Inventors: Hiroo Arikawa, Yasutada Yuza
  • Patent number: 4559514
    Abstract: A chip type fuse comprises a fuse base and a cover therefor both made of a heat resistant and electrically insulating material. The fuse includes a pair of electrically conductive terminals, having portions exposed outside of the fuse base and having ends disposed within the fuse. A fusible element is stretched between the ends of the conductive terminals inside the fuse. The fuse base has leg portions extending below the bottom of the base and is adapted to be soldered to a printed circuit board.
    Type: Grant
    Filed: November 29, 1983
    Date of Patent: December 17, 1985
    Assignee: S.O.C. Corporation
    Inventor: Hiroo Arikawa
  • Patent number: 4527144
    Abstract: A thermal cut-off device comprises a casing and a cover therefor both made of a highly heat conductive electrically insulating material such as ceramic. A pair of lead wires protrude from opposite ends of the casings with the other ends of the wires being electrically connected to an electrical assembly within the casing. The electrical assembly comprises a leaf spring, a conductive fixed terminal and a plastic mass for biasing the leaf spring so as to contact the fixed terminal during closed circuit condition. A helical spring in the casing stabilizes the leaf spring upon its release when the plastic mass melts due to overheating.
    Type: Grant
    Filed: November 8, 1983
    Date of Patent: July 2, 1985
    Assignee: S.O.C. Corporation
    Inventor: Hiroo Arikawa
  • Patent number: 4511875
    Abstract: An electric micro-fuse comprises a hollow body and a lid therefor. The interior of the fuse body is divided into five sections consisting of two raised plateaus and three recessed sections, wherein the central recess is connected to each end recess through a channel. A fusible element is diagonally stretched between the channels and a lead wire is inserted through each end of the fuse body into the end recesses and are soldered to the respective end of the fusible element. After soldering, the fuse body is covered by the lid and sealed hermetically by a suitable adhesive.
    Type: Grant
    Filed: March 17, 1983
    Date of Patent: April 16, 1985
    Assignee: S.O.C. Corporation
    Inventor: Hiroo Arikawa