Abstract: A method of bonding copper to a heat conducting and electrically insulating power electronics substrate made of a non-oxide ceramic selected from AlN, SiC, and BN, the method including the steps of oxidizing the surface of the substrate and then directly bonding copper to the oxidized surface of the substrate, wherein the step of oxidizing the surface of the substrate is performed by irradiating the surface using a laser beam to a thickness in the range 0.1 .mu.m to 3 .mu.m.
Type:
Grant
Filed:
June 25, 1993
Date of Patent:
December 5, 1995
Assignee:
Societe Anonyme Dite Alcatel Alsthom Compagnie Generale d'Electricite
Abstract: The present invention provides a proton-conducting polymer solid electrolyte comprising a polyether which has two terminal primary amine functions and which is cross-linked by a curing agent having two epoxy functions, an acid being incorporated into said cross-linked polyether.
Type:
Grant
Filed:
August 31, 1993
Date of Patent:
July 4, 1995
Assignee:
Societe Anonyme dite Alcatel Alsthom Compagnie Generale d'Electricite