Abstract: A vacuum pump having substrates which can be wired together easily and cooled easily. A substrate unit structure is formed by covering the opening of the casing of the pump main unit with a plate functioning also as the casing of the control unit. Pins of a terminal fixed while penetrating the plate are soldered directly to an active magnetic bearing (AMB) control substrate and an aerial connection substrate in order to integrate these components. The casing and sealing structures can be of simple construction. A drip-proof structure can be made with the terminal at low cost without using expensive drip-proof connectors. Further, by cooling the plate, electronic components mounted respectively on the AMB control substrate in a vacuum atmosphere and the aerial connection substrate in an air atmosphere can be cooled simultaneously.