Abstract: The invention concerns a method for producing electronic modules with ball connector (7) or integrated preforms capable of being soldered on a printed circuit (3) and a device for implementing said method. The invention concerns a method for producing electronic modules in the form of ball housings combining a ball grid array (7) or geometrically identical preforms for interconnecting or shielding and surface-mounted components (2) on the same surface of a substrate (1), thereby enabling said module to be directly connectable by soldering on a printed circuit (3). The balls (7) and the components (2) are transferred in one single step onto the substrate (1) by means of a gripping device adapted to the topography of the module to be produced.

Abstract: Device for filling multiple blind holes. The invention involves a device that permits the filling of blind holes in an effective and controlled manner. It is composed of a mobile body (1) in airtight contact with the surface (10) containing the hole openings. The body (1) contains two slots, the first (2) of which is kept airtight from the exterior of the device and from the second slot (5), is separate and parallel to the direction of travel of the device, and is larger than the largest opening. The first slot exposed to the openings while moving is connected to a vacuum chamber (3), while the second slot exposed to the openings is connected to a reservoir (6) containing the product (7) to be transferred.

Abstract: The invention concerns a method for producing and soldering electrical connection beads (1) on mounting lands (2) for electronic circuit or component (3) electrical connection. The invention further concerns the device for implementing said method. The invention is characterized in that it essentially comprises the following steps: the operations for filling the stencil screen openings (4) by means of a squeegee (6) or the like and hot refusion are carried out with the stencil screen positioned above the substrate; the stencil screen (4) positioned on the component (3) during refusion is separated from the component after refusion but before the beads (1) are solidified, the latter being still in liquid state such that the balls that are being formed acquire their balanced position and their strictly identical spherical shape whatever their number; after the beads are solidified, the denatured binder is cleaned out.

Abstract: A device (14) for implementing a method for setting on a substrate (2) interconnecting balls or preforms (1) comprising the following phases: storing in bulk the preforms (1); seizing in ordered position the preforms (1) with an adapted gripping device (9); setting the preforms (1) on the substrate (2) with the gripping device (9). Said device (14) is charaterized in that it consists of at least a matrix for storing the preforms, said matrix comprising a floor capable of acting as stop for the preforms when the matrix is being filled thereby enabling the implementation of a method whereby the passage from bulk storage to ordered storage is performed in masked time. The device is useful for incorporating or replacing balls in substrates of electronic components.

Abstract: A stencil (8) with a tension part combined with an operational device allowing deposition of solder paste to replace constituents on an electronic board. The stencil consists of a flat sheet (1), of rectangular shape, made of synthetic flexible material or metal and outfitted with transfer openings (2) for transferring and distributing a product. Two of the parallel sides of the sheet are connected to rigid and mobile vertical tabs (3) in an affixed position on a tension unit of the sheet. The other two parallel sides of the sheet, orthogonal to the former ones, are extended with flexible walls (6), orthogonal to the sheet. Bead folds (7) separate the perforated sheet and each of the flaps and delimit the sheet. The flaps freely rotate around the folds. The invention also has an operational device consisting of arm (20) with several jointed strands outfitted with a sole means of locking (22) its joints. The stencil may be configured and moved in accordance with 6 degrees of freedom.