Abstract: A housing or box for dissipation of the heat produced by electrical circuits. The housing includes a metallic armature which has an upper portion with a hermetic recess in which are disposed the electrical circuits, and a lower portion for cooling with a cooling fluid. The cooling portion includes a single-piece metallic assembly in which are formed channels and openings between the channels in such a way that a circulation network for the cooling fluid is formed.
Abstract: A dielectric ceramic substrate is obtained exclusively from aluminum oxide, magnesium oxide and titanium oxide, the respective amounts of said magnesium oxide and said titanium oxide being so selected as to represent substantially equivalent molar proportions. The novel substrate is adapted to be used in electronics in the fields of thin layer and thick layer technology, as well for producing microprocessor protection cases, multilayer substrates and the like.
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