Abstract: A fume collector can be operated continuously for a long time, and an influence on a three-dimensional article is minimized. Provided is a lamination molding apparatus (1) in which an inert gas supply/discharge apparatus (4) includes an inert gas supply apparatus (43) configured to supply an inert gas into a chamber (10), and a fume collector (6) including a charging section (63) having a charging electrode (631) configured to positively or negatively charge fumes, a charging electrode cleaner (71) configured to remove fumes adhered to the charging electrode (631) and a dust collecting section (65) configured to collect the charged fumes, wherein the charging electrode cleaner (71) removes the fumes when formation of the sintered layers by a laser radiation apparatus (2) is not being performed in operation.

Abstract: It is difficult to perform surface modification by irradiating a side surface of a hole formed on an irradiated object with a low-energy-density electron beam. An irradiated object having an irradiation hole formed thereon is disposed in a vacuum chamber. A cathode electrode is arranged to face a side surface of the irradiation hole. The cathode electrode has a large number of metal projections over an entire surface of a base body, the base body facing at least the side surface of the irradiation hole. A conductive mesh is arranged between the cathode electrode and the side surface of the irradiation hole. The conductive mesh partially contacts the irradiated object and is set to have the same potential as the irradiated object.

Abstract: Provided is a food container supply device in which a gripping device includes a pair of claws and a pair of shutters which move in each horizontal direction between a forward movement position of contacting a food container and a backward movement position of non-contacting the food container respectively and a control device selects one of gripping operation patterns including an operation of respectively moving the claw and the shutter to the forward movement position at the same time, an operation of moving one of the claw and the shutter to the forward movement position and then moving the other to the forward movement position, and an operation of moving only one of the claw and the shutter to the forward movement position during each operation of extracting the food container in response to a shape of the food container.

Abstract: A mold apparatus includes first and second mold plates that constitute a cassette mold, a first base mold, a base intermediate mold for loading the first mold plate, a second base mold for loading the second mold plate, a base intermediate mold driving device for positioning and fixing the base intermediate mold at any position between the first and second base molds, and a controller for performing control to position and fix the base intermediate mold so that the first mold plate and the first base mold are in contact with each other when a molded product is taken out.

Abstract: A mold apparatus includes a first mold plate formed with a runner flow path, a second mold plate, a runner stripper plate having a through hole that communicates with the runner flow path, a runner locking part formed with an inverse tapered space which communicates with the through hole and has an inverse tapered shape and in which a locking portion made of a molding material is formed, and a runner unlocking means for moving the runner stripper plate away from the runner locking part to unlock the locking portion.

Abstract: The method for producing a three-dimensional molded object comprises a placing step, a molding step, and an upper surface processing step. The placing step is a step of placing a base plate and a mounting plate within a molding region. A first material powder layer is formed on the base plate; and the base plate is fixed to the mounting plate at a central part of the base plate to an extent that the base plate is not displaced. The molding step is a step of laminating sintered layers to form a sintered body. The sintered layers are laminated by repeatedly spreading material powder to form a material powder layer and irradiating the material powder layer with a beam to form the sintered layer. The upper surface processing step is a step of planarizing an upper surface of the sintered body to form a processed surface.

Abstract: A gas collecting mechanism installed in the laminating and shaping apparatus has a partition section extending from a ceiling section of the chamber along a second wall surface with a predetermined interval therebetween, a first gas collecting port formed in the partition section, a suction apparatus installed in the first gas collecting port, a first gas guide space section formed between the partition section and the second wall surface, a first duct communicating with the first gas guide space section and installed on the ceiling section, a second gas collecting port formed on the ceiling section adjacent to the second wall surface, and a second duct communicating with the second gas collecting port.

Abstract: A fine hole electric discharge machine includes a machining tank, a storage tank, at least one pipeline, a guide base, a liquid current generator, and a controller. The at least one pipeline has at least one opening directed to the upper surface of a workpiece and allows machining liquid to flow through. The liquid current generator selectively forms a first liquid current in which the machining liquid is supplied from the storage tank and jetted from a predetermined opening of the opening, or a second liquid current in which the machining liquid is sucked from an opening the same as or different from the predetermined opening and recovered to the storage tank. The controller controls the liquid current generator to form the first liquid current or the second liquid current.

Abstract: A dirty fluid tank of a machining fluid supply tank has a capacity smaller than a machining tank and is arranged lower than the machining tank. An intermediate tank has a capacity smaller than the dirty fluid tank, selectively communicates with the dirty fluid tank. A clear fluid tank has a capacity smaller than the intermediate tank, is arranged above the dirty fluid tank and the intermediate tank. The sum of capacities of the dirty fluid tank and the intermediate tank is larger than the capacity of the machining tank. A pipe includes a drain pipeline of the machining tank, a first pipeline for purifying the electric discharge machining fluid and sending the electric discharge machining fluid to the clear fluid tank, and a second pipeline for sending the electric discharge machining fluid from the clear fluid tank to the machining tank.

Abstract: A wire electric discharge machining apparatus includes upper and lower wire guide units including wire guides configured to position and guide a wire electrode and a jet nozzle configured to supply a jet flow coaxially with the wire electrode, and a core holding pad having a through-hole passing therethrough in an upward/downward direction, and in which a plurality of protrusion sections having an equal distance from upper surfaces thereof to a lower surface of the workpiece are formed. The core holding pad is disposed on the lower wire guide unit such that the core holding pad approaches the lower surface of the workpiece as closely as possible.

Abstract: Shown is a method of manufacturing a light emitting device capable of efficiently heating a device at the time of DPP annealing and suppressing heat generation of the device at the time of driving. In the method of manufacturing the light emitting device, a first p-type electrode is formed on a low-concentration portion having a low p-type dopant concentration formed under a first region of the p-type semiconductor portion, a second p-type electrode is formed on a high-concentration portion having a high p-type dopant concentration formed under a second region of the p-type semiconductor portion, and a predetermined forward bias voltage is applied between the first p-type electrode and a first n-type electrode formed on an n-type semiconductor portion at the time of DPP annealing.

Abstract: According to the present invention, a lamination molding apparatus configured to mold a desired lamination molded object based on a project file, comprising: a chamber covering a molding region and being filled with an inert gas; a laser beam emitter configured to irradiate material powder with a laser beam for sintering the material powder, in an irradiation region on a material powder layer formed on a molding region, a cutting machine configured to move a cutting tool, within the chamber, for cutting a predetermined cutting allowance from a sintered layer obtained by sintering the material powder a calculation means configured to calculate an amount of displacement between a target irradiation position and an actual irradiation position of the laser beam, and to determine a recommended value of a size of the cutting allowance based on a time transition of the amount of displacement or to generate a new project file containing a size of the cutting allowance set based on a time transition of the amount of d

Abstract: The wire electric discharge machining device includes a wire bobbin configured to wind and hold a wire electrode, a wire delivery means configured to draw the wire electrode from the wire bobbin and deliver the wire electrode continuously toward a work-piece, a load applying means configured to apply a load to the wire bobbin in a direction against the drawing of the wire electrode, rotation speed detection means configured to detect a rotation speed of the wire bobbin, an emptiness determination means configured to determine that the wire bobbin reaches an empty state based on a rapid change in the rotation speed of the wire bobbin detected by the rotation speed detection means, and a drive control part configured to stop the drive of the wire delivery means when the emptiness determination means determines that the wire bobbin reaches the empty state.

Abstract: A lamination molding apparatus, including a numerical control apparatus configured to form a desired lamination molding object by a repetition in accordance with a main program pre-created and numbered with a sequence number, the main program including a plurality of program lines, wherein the repetition includes forming a material powder layer of a predetermined thickness on a molding table for each divided layer, the molding table being vertically movable, the divided layer being obtained by dividing a shape of the desired lamination molding object at the predetermined thickness; and irradiating a predetermined area of the material powder layer with a laser beam to form a sintered layer.

Abstract: An injection molding machine is provided, wherein a display device displays screens requesting an operator to manipulate the injection molding machine in order in accordance with a manipulation procedure for the injection molding machine from automatic setting of initial molding conditions until actual molding of a molded article, and a guidance showing the manipulation procedure.

Abstract: According to the present invention, a galvanometer scanner, comprising: an operation portion having a rotary shaft; an inner sliding member configured to rotatably support the rotary shaft; a reaction force absorbing portion, provided outside the rotary shaft via the inner sliding member, configured to replace a force acting against the operation portion with an angular acceleration; an outer sliding member configured to rotatably support the reaction force absorbing portion; and a fixed portion provided outside the reaction force absorbing portion via the outer sliding member, is provided.

Abstract: A wire cut electric discharge machining apparatus cannot maintain high machining accuracy because the arm may expand/contract as it receives more heat from the machining fluid. The wire cut electric discharge machining apparatus has guide parts that guide a wire and arms that support the guide parts, wherein at least one of the guide parts has a machining fluid ejection nozzle, and at least one of the arms has an ejection connection pipe and a thermal insulation part. The ejection connection pipe is a hole penetrating the arm and supplies the machining fluid to the machining fluid ejection nozzle, and the thermal insulation part covers the inner peripheral surface of the ejection connection pipe to thermally insulate the inner hole of the ejection connection pipe.

Abstract: A wire electric discharge machining apparatus includes: a processing tank, a lower-side wire guide assembly, a lower arm, a direction changing pulley, a winding roller, and a conveying device. The conveying device comprises a high-pressure jet flow generator and a suction pipe. The high-pressure jet flow generator is provided between the direction changing pulley and the winding roller on a side of a front end of a lower arm, and spouts a high-pressure jet flow toward a direction of the winding roller so that a wire electrode is guided only by a restraining force of the high-pressure jet flow and sent flying to the direction of the winding roller with the high-pressure jet flow. The suction pipe is provided on an exit side of the winding roller, and sucks and captures a tip of the wire electrode sent by the high-pressure jet flow.

Abstract: A laminating and shaping apparatus includes a laser radiation unit configured to radiate a laser to a powder layer and form sintered sections, an imaging unit configured to image the sintered sections, a calculation device configured to calculate actual laser radiation positions from positions of the sintered sections and calculate a positional deviation of the laser radiation position at each of the sintered sections, and a correction device configured to correct the actual laser radiation position of each of the sintered sections to a target laser radiation position. The laser radiation unit forms sintered sections to surround the irradiation region by performing laser radiation on places including outermost positions in the irradiation region, and as the recoater head is moved in the horizontal uniaxial direction after imaging of the plurality of sintered sections by the imaging unit, at least a plurality of sintered sections are removed from the irradiation region.

Abstract: A lamination molding apparatus with a molding table, including: a galvanometer scanner configured to irradiate a small irradiation region on the molding table with a laser beam; an inert gas supplying nozzle having an inert gas supplying opening for supplying an inert gas; a fume suction duct having a fume suction opening for suctioning the inert gas containing fumes generated with irradiation of the laser beam; an integration unit integrally including the galvanometer scanner, the inert gas supplying nozzle and the fume suction duct; and a moving device configured to move the integration unit so the galvanometer scanner scans and irradiates the laser beam on a large irradiation region larger than the small irradiation region on the molding table; wherein the inert gas supplying opening and the fume suction opening are opposed to each other so an irradiation path of the laser beam is placed therebetween.