Abstract: Methods for treating polymeric substrates by placing the substrate in a gaseous mixture and subjecting it to a dielectric barrier electrical discharge. The gaseous mixture, which has a pressure around atmospheric, contains a carrier gas, a reducing gas and an oxidizing gas. The amount of the oxidizing gas in the gas mixture is between about 50 ppm and about 2000 ppm by volume, while the amount of the reducing gas in the gas mixture is between about 50 ppm and 30000 ppm by volume.
Type:
Grant
Filed:
January 22, 2001
Date of Patent:
December 12, 2006
Assignees:
L'Air Liquide, Societe Anonyme A' Directolre et Conseil de Surveillance pour l'Etude Et. l'Exploitation des Procedes Georges Claude, SOFTAL Electronic Erik Blumentfeld GmbH Co