Abstract: The present invention provides an interferometric method and system to measure the height profile of reflecting objects with respect of a reference surface. The method comprises obtaining an image of the object along a specular reflection axis, wherein the image corresponds to an intensity pattern projected on the object along a projection axis, and wherein the specular reflection axis corresponds to a direction along which a portion of the intensity pattern is specularly reflected by the object. Then the method comprises calculating an object phase using the image and determining the height profile using the object phase and a reference phase associated to the reference surface.

Abstract: An interferometric method for determining a height profile of regions of the surface area of an object or of several objects, wherein the regions are substantially in different planes, is presented. The optical path of at least one portion of intensity coming from one of the regions is modified while obtaining at least one image, wherein each image contains the portion of intensity and corresponds to an intensity pattern projected on the regions. An object phase associated with the regions is established using the obtained image(s) and a height profile of the regions is determined using the object phase and a reference phase. An optical assembly is used for directing along a common detection axis an intensity coming from said regions that would be otherwise out of sight.

Abstract: A three-dimensional image grabber allowing for the simultaneous projection of multiple phase-shifted patterns onto an object, and the simultaneous acquisition of multiple images of these phase-shifted patterns is described herein. The grabber comprises a pattern projecting assembly and an image acquisition assembly. The pattern projecting assembly includes, for example, a spectral splitter or a plurality of light sources, grids and projectors for simultaneous projection of a plurality of patterns under different monochromatic lights. The image acquisition assembly includes, for example, a CCD camera sensitive to the different monochromatic lights, or a plurality of CCD cameras with filters to gather lights incoming for the object simultaneously illuminated by the plurality of phase-shifted patterns. A method and a system for measuring the relief of an object, using the above-mentioned process, is also disclosed.

Abstract: Phase profilometry inspection system has a pattern projection assembly, a detection assembly imaging a plurality of first light intensity patterns on the object and determining a first height of the object, and an absolute object height determination unit combining said first height with at least one second object height measurement to provides absolute height determination of desired points of said object. The first height is determined within an order of said first light intensity pattern and does not resolve absolute height. The second object height measurement can be done also by projecting a light intensity pattern of a lower spatial frequency than the first patterns.

Abstract: The present invention provides a Fast Moiré Interferometry (FMI) method and system for measuring the dimensions of a 3D object using only two images thereof. The method and the system perform the height mapping of the object or the height mapping of a portion of the object. The present invention can be used to assess the quality of the surface of an object that is under inspection. It can also be used to evaluate the volume of the object under inspection.

Abstract: A three-dimensional image grabber allowing for the simultaneous projection of multiple phase-shifted patterns onto an object, and the simultaneous acquisition of multiple images of these phase-shifted patterns is described herein. The grabber comprises a pattern projecting assembly and an image acquisition assembly. The pattern projecting assembly includes, for example, a spectral splitter or a plurality of light sources, grids and projectors for simultaneous projection of a plurality of patterns under different monochromatic lights. The image acquisition assembly includes, for example, a CCD camera sensitive to the different monochromatic lights, or a plurality of CCD cameras with filters to gather lights incoming for the object simultaneously illuminated by the plurality of phase-shifted patterns. A method and a system for measuring the relief of an object, using the above-mentioned process, is also disclosed.

Abstract: A three-dimensional image grabber allowing for the simultaneous projection of multiple phase-shifted patterns onto an object, and the simultaneous acquisition of multiple images of these phase-shifted patterns is described herein. The grabber comprises a pattern projecting assembly and an image acquisition assembly. The pattern projecting assembly includes, for example, a spectral splitter or a plurality of light sources, grids and projectors for simultaneous projection of a plurality of patterns under different monochromatic lights. The image acquisition assembly includes, for example, a CCD camera sensitive to the different monochromatic lights, or a plurality of CCD cameras with filters to gather lights incoming for the object simultaneously illuminated by the plurality of phase-shifted patterns. A method and a system for measuring the relief of an object, using the above-mentioned process, is also disclosed.

Abstract: A method and a system for measuring the relief of an object are described herein. The system includes a grid projecting for projecting a grid, an image acquisition apparatus that includes a camera, and a computer. Providing a reference object having common elements with the object to measure, the method includes the steps of a) positioning the grid at three different known positions relative to the camera and the common elements; b) for each position of the grid, projecting the grid unto the reference object and, with the camera, taking an image of the reference object to yield three images having values for each pixel of the camera and c) computing the reference object phase for each pixel using the three reference object intensity values for the corresponding pixel. Steps a), b) and c) are repeated by replacing the reference object by the object to be measured.

Abstract: A method and a system for detecting surface defects on electronic circuits, such as Printed Circuit Boards (PCB), are described herein. The method first comprises identifying contours on a digital image of the PCB. Then anomalies are detected on the PCB image by comparing the identified contours to contours on a vectorial model of the PCB. Each detected anomaly is compared to manufacturing data to verify if it corresponds to a defect.

Abstract: A shadow-free 3D and 2D measurement system combining, in one FMI set-up, a Moiré 3D lighting with other simultaneous external illuminations (for example a coaxial one or another). The reconstructed image combines the advantages of these different illuminations. The relative light intensities are selected in order to assure the best 2D detection while maintaining the 3D measurements.

Abstract: A three-dimensional image grabber allowing for the simultaneous projection of multiple phase-shifted patterns onto an object, and the simultaneous acquisition of multiple images of these phase-shifted patterns is described herein. The grabber comprises a pattern projecting assembly and an image acquisition assembly. The pattern projecting assembly includes, for example, a spectral splitter or a plurality of light sources, grids and projectors for simultaneous projection of a plurality of patterns under different monochromatic lights. The image acquisition assembly includes, for example, a CCD camera sensitive to the different monochromatic lights, or a plurality of CCD cameras with filters to gather lights incoming for the object simultaneously illuminated by the plurality of phase-shifted patterns. A method and a system for measuring the relief of an object, using the above-mentioned process, is also disclosed.