Abstract: A solar cell assembly in which a solar cell component is bonded to a flexible support is disclosed. The solar cell assembly comprises a flexible support with a predetermined size, a solar cell component, bonding adhesive between the support and the solar cell component, wherein the support with the predetermined size has a uniform borders of 0.003 inch to 0.2 inch in width extending beyond the edges of the solar cell component.
Abstract: The present disclosure provides a method of manufacturing a solar cell comprising: providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; and affixing the surface of a permanent supporting substrate composed of a carbon fiber reinforced polymer utilizing a conductive polyimide binding resin directly over said metal contact layer and permanently bonding it thereto by a thermocompressive technique.
Type:
Grant
Filed:
November 13, 2015
Date of Patent:
September 19, 2017
Assignee:
SolAero Technologies Corp.
Inventors:
Mark A. Stan, Chelsea Mackos, Jeff Steinfeldt
Abstract: A method of manufacturing a solar cell assembly by providing a substrate; depositing on the substrate a sequence of layers of semiconductor material forming a solar cell; mounting a permanent laminate supporting member with a thickness of 50 microns or less on top of the sequence of layers; utilizing the laminate structure for supporting the epitaxial sequence of layers of semiconductor material forming a solar cell during the processes of removing the substrate and depositing and lithographically patterning a plurality of metal grid lines disposed on the top surface of the first solar subcell, and attaching a cover glass over at least the grid lines of the solar cell.
Abstract: The present disclosure provides methods of fabricating a multijunction solar cell panel in which one or more of the steps are performed using an automated process. In some embodiments, the automated process uses machine vision.
Type:
Grant
Filed:
June 1, 2016
Date of Patent:
August 29, 2017
Assignee:
SolAero Technologies Corp.
Inventors:
Marvin Bradford Clevenger, Benjamin C. Richards, Cory Tourino, Lei Yang, Daniel Aiken, Daniel Derkacs, Philip E. Blumenfeld
Abstract: A solar cell assembly and a method of bonding a solar cell component to a flexible support are disclosed. The solar cell assembly comprises a flexible support with a predetermined size, a solar cell component, bonding adhesive between the support and the solar cell component, wherein the support with the predetermined size has substantially uniform borders of 0.003 inches to 0.2 inches in width extending beyond the edges of the solar cell component.
Abstract: A multijunction solar cell assembly and its method of manufacture including interconnected first and second discrete semiconductor body subassemblies disposed adjacent and parallel to each other, each semiconductor body subassembly including first top subcell, second (and possibly third) lattice matched middle subcells; a graded interlayer adjacent to the last middle solar subcell; and a bottom solar subcell adjacent to said graded interlayer being lattice mismatched with respect to the last middle solar subcell; wherein the interconnected subassemblies form at least a four junction solar cell by a series connection being formed between the bottom solar subcell in the first semiconductor body and the bottom solar subcell in the second semiconductor body.
Abstract: The present disclosure provides a method of manufacturing a solar cell including: providing a first substrate and a second substrate; depositing on the first substrate a sequence of layers of semiconductor material forming a solar cell including a top subcell and a bottom subcell; forming a back metal contact over the bottom subcell; applying a conductive polyimide adhesive to the second substrate; attaching the second substrate on top of the back metal contact; and removing the first substrate to expose the surface of the top subcell.
Type:
Grant
Filed:
November 6, 2015
Date of Patent:
June 27, 2017
Assignee:
SolAero Technologies Corp.
Inventors:
Mark A. Stan, Chelsea Mackos, Jeff Steinfeldt
Abstract: A multijunction solar cell including an upper first solar subcell having a first band gap; a second solar subcell adjacent to the first solar subcell and having a second band gap smaller than the first band gap; a first graded interlayer adjacent to the second solar subcell; the first graded interlayer having a third band gap greater than the second band gap; and a third solar subcell adjacent to the first graded interlayer, the third subcell having a fourth band gap smaller than the second band gap such that the third subcell is lattice mismatched with respect to the second subcell. A second graded interlayer is provided adjacent to the third solar subcell; the second graded interlayer having a fifth band gap greater than the fourth band gap; and a lower fourth solar subcell is provided adjacent to the second graded interlayer, the lower fourth subcell having a sixth band gap smaller than the fourth band gap such that the fourth subcell is lattice mismatched with respect to the third subcell.
Abstract: A solar cell including a sequence of layers of semiconductor material forming a solar cell; a metal contact layer over said sequence of layers; a permanent supporting substrate composed of a carbon fiber reinforced polymer utilizing a conductive polyimide binding resin disposed directly over said metal contact layer and permanently bonding thereto.
Type:
Application
Filed:
February 27, 2017
Publication date:
June 15, 2017
Applicant:
SolAero Technologies Corp.
Inventors:
Mark Stan, Chelsea Mackos, Jeff Steinfeldt
Abstract: A multijunction solar cell assembly of two or more spatially split solar cell subassemblies, each of which includes a respective monolithic semiconductor body composed of a tandem stack of solar subcells, where the subassemblies are interconnected electrically to one another so that a series electrical circuit is formed between groups of one or more subcells in each subassembly. In some cases, relatively high band gap semiconductor materials can be used for the upper subcells. The solar cell assemblies can be particularly advantageous for applications in space.
Abstract: A multijunction solar cell and its method of manufacture including interconnected first and second discrete semiconductor regions disposed adjacent and parallel to each other in a single semiconductor body, including first top subcell, second (and possibly third) lattice matched middle subcells; and a bottom solar subcell adjacent to said last middle subcell and lattice matched thereto; wherein the interconnected regions form at least a four junction solar cell by a series connection being formed between the bottom solar subcell in the first semiconductor region and the bottom solar subcell in the second semiconductor region.
Abstract: A multijunction solar cell and its method of manufacture including interconnected first and second discrete semiconductor regions disposed adjacent and parallel to each other in a single semiconductor body, including first top subcell, second (and possibly third) lattice matched middle subcells; a graded interlayer adjacent to the last middle solar subcell; and a bottom solar subcell adjacent to said graded interlayer being lattice mismatched with respect to the last middle solar subcell; wherein the interconnected regions form at least a four junction solar cell by a series connection being formed between the bottom solar subcell in the first semiconductor region and the bottom solar subcell in the second semiconductor region.
Abstract: A multijunction solar cell assembly and its method of manufacture including first and second discrete and different semiconductor body subassemblies which are electrically interconnected to form a five junction solar cell, each semiconductor body subassembly including first, second, third and fourth lattice matched subcells; wherein the average band gap of all four cells in each subassembly is greater than 1.44 eV.