Patents Assigned to Solapoint Corporation
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Patent number: 8252616Abstract: A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.Type: GrantFiled: October 14, 2010Date of Patent: August 28, 2012Assignee: Solapoint CorporationInventor: Tai-Hui Liu
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Patent number: 8253176Abstract: A photodiode device and methods of manufacturing the same are provided. The photodiode device comprises a light absorption layer defining a light-facing side and a back-light side; a via passing through the absorption layer, the via defining a side wall and a bottom surface; a conformal isolation layer covering the side wall and the bottom surface; a first patterned conductive layer disposed on the back-light side, the first patterned conductive layer having a first portion covering a first portion of the conformation isolation layer; a second patterned conductive layer disposed on the light-facing side of the absorption layer; and an opening through the conformal isolation layer, wherein the opening is filled with the second patterned conductive layer such that the second patterned conductive layer is connected with the first portion of the first patterned conductive layer.Type: GrantFiled: July 23, 2010Date of Patent: August 28, 2012Assignee: Solapoint CorporationInventors: Chan Shin Wu, Tai-Hui Liu
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Publication number: 20120042939Abstract: This invention discloses an electrode of a solar cell electrically connected to a conductive element via a connect structure. The electrode of the solar cell includes a dielectric structure including one or more openings and located on a contact electrode. The connect structure is disposed within the openings to avoid horizontally diffusing into the contact electrode.Type: ApplicationFiled: August 17, 2010Publication date: February 23, 2012Applicant: SOLAPOINT CORPORATIONInventor: Tai Hui LIU
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Publication number: 20120012174Abstract: A solar cell device having an airbridge type contact and the method of forming the same are provided. The solar cell device includes a semiconductor layer for turning light into electric current; at least two conductive line sections for transmitting the electric current from the semiconductor layer and formed on the semiconductor layer; and an airbridge type contact interposing between the two conductive line sections and connecting thereto, wherein a space under the airbridge type contact and between the two conductive line sections is formed, and light is allowed to enter the semiconductor layer by passing through the space.Type: ApplicationFiled: February 28, 2011Publication date: January 19, 2012Applicant: SOLAPOINT CORPORATIONInventor: CHAN SHIN WU
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Publication number: 20110284983Abstract: A photodiode device and the manufacturing method of the same are provided. The photodiode device includes a substrate; an epitaxy layer on the substrate, the epitaxy layer including a window layer and a cap layer on the window layer, the cap layer covering a portion of the window layer; and a patterned conductive layer on the cap layer, the patterned conductive layer being formed with a bottom area and a top area wherein the bottom area is greater than the top area.Type: ApplicationFiled: February 1, 2011Publication date: November 24, 2011Applicant: SOLAPOINT CORPORATIONInventors: Chan Shin WU, Yung-Yi TU, Shan Hua WU
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Publication number: 20110259411Abstract: A packaging structure and process of solar cell is disclosed. The packaging structure of solar cell comprises two conductive films and two surface electrodes disposed on a photovoltaic cell (PV cell), wherein two conductive films are respectively electrically coupled with the surface electrodes via a plurality of solder balls.Type: ApplicationFiled: April 26, 2010Publication date: October 27, 2011Applicant: SOLAPOINT CORPORATIONInventor: Tai Hui LIU
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Publication number: 20110259387Abstract: A multi-junction solar cell structure includes a supporting substrate, a Group IV element-based thin film, and a Group III-V element-based thin film sequentially stacked on the supporting substrate. When the multi-junction solar cell structure is active, the Group III-V element-based thin film contacts the light before the Group IV element-based thin film does. The Group IV element-based thin film includes a first solar cell and the Group III-V element-based thin film includes a second solar cell, wherein the band gap of the first solar cell is lower than the band gap of the second solar cell.Type: ApplicationFiled: April 21, 2011Publication date: October 27, 2011Applicant: SOLAPOINT CORPORATIONInventors: Chan Shin WU, Tsung-Pei CHIN, Yung-Yi TU
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Publication number: 20110226307Abstract: A three-dimensional type concentrating solar cell system without sun-tracing apparatus is provided. The system comprises a plurality of sphere-like concentrators and a plurality of photovoltaic cell. The sphere-like concentrators are arranged to form a curved surface. There is no need for the system to trace the light source, such as the sun. The present invention can provide sufficient electric power for user's applications.Type: ApplicationFiled: March 19, 2010Publication date: September 22, 2011Applicant: SOLAPOINT CORPORATIONInventor: Tai Hui LIU
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Publication number: 20110092023Abstract: A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.Type: ApplicationFiled: October 14, 2010Publication date: April 21, 2011Applicant: SOLAPOINT CORPORATIONInventor: Tai-Hui LIU
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Publication number: 20110020975Abstract: A method of manufacturing photodiode device includes the following steps: providing a wafer having a substrate and an epitaxy layer, the substrate having a first surface and a second surface and the epitaxy layer formed on the first surface; forming a first conductive layer on the second surface of the substrate; forming a patterned conductive layer above the epitaxy layer; and etching the patterned conductive layer by a reactive ion etching (RIE) process performed under argon gas and helium gas.Type: ApplicationFiled: May 21, 2010Publication date: January 27, 2011Applicant: SOLAPOINT CORPORATIONInventors: Chan Shin Wu, Yung-Yi Tu, Shan Hua Wu
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Publication number: 20110018081Abstract: A photodiode device and methods of manufacturing the same are provided. The photodiode device comprises a light adsorption layer defining a light-facing side and a back-light side; a via passing through the adsorption layer, the via defining a side wall and a bottom surface; a conformal isolation layer covering the side wall and the bottom surface; a first patterned conductive layer disposed on the back-light side, the first patterned conductive layer having a first portion covering a first portion of the conformation isolation layer; a second patterned conductive layer disposed on the light-facing side of the adsorption layer; and an opening through the conformal isolation layer, wherein the opening is filled with the second patterned conductive layer such that the second patterned conductive layer is connected with the first portion of the first patterned conductive layer.Type: ApplicationFiled: July 23, 2010Publication date: January 27, 2011Applicant: SOLAPOINT CORPORATIONInventors: Chan Shin Wu, Tai-Hui Liu
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Publication number: 20100269884Abstract: The present invention provides a solar power generating apparatus including a base and multiple power generating units connected in series. Each of the power generating units includes a heat dissipation plate separably connected to the base; a solar cell disposed on the heat dissipation plate; and a rectification device connected in parallel to the solar cell. When the heat dissipation plate of one of the power generating units is detached from the base, the others of the power generating units may continue to operate.Type: ApplicationFiled: April 22, 2010Publication date: October 28, 2010Applicant: SOLAPOINT CORPORATIONInventor: Tai-Hui LIU
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Publication number: 20100122721Abstract: An array type concentrating solar cell system without sun-tracing system is provided, wherein a plurality of transparent spheres or sphere-like transparent articles is used as concentrating means and hence there is no need for the concentrating means to trace the light source, such as the Sun. The plurality of transparent spheres (or sphere-like transparent articles), as concentrating means, can provide sufficient electric power for user's applications.Type: ApplicationFiled: November 18, 2008Publication date: May 20, 2010Applicant: SOLAPOINT CORPORATIONInventor: Tai Hui LIU
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Publication number: 20100108121Abstract: A concentrating solar cell module without sun-tracing system is provided, wherein a transparent sphere is used as a concentrator and hence there is no need for the concentrator to trace light source, such as the Sun.Type: ApplicationFiled: October 30, 2008Publication date: May 6, 2010Applicant: SOLAPOINT CORPORATIONInventor: Tai Hui LIU
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Publication number: 20100071768Abstract: An enhanced solar collector is provided in this invention, wherein a through hole is formed in a secondary mirror in Cassegrain system, and a light collecting device focusing lights, originally shaded by the secondary mirror, via the through hole to increase light-collecting efficiency of the enhanced solar collector.Type: ApplicationFiled: September 25, 2008Publication date: March 25, 2010Applicant: SOLAPOINT CORPORATIONInventor: TAI HUI LIU