Abstract: A device for lacquering or coating a substrate is disclosed. The device includes a substrate plate configured to accommodate said substrate, and one or more suction points connected to, and extending upwardly from, the substrate plate. The one or more suction points may be configured to provide a vacuum to said substrate.
Abstract: In a device for machining, in particular etching and/or developing, substrates, in particular wafers, in particular etching and/or developing, having a turntable, the turntable has a Venturi gap.
Abstract: In a device for machining, in particular etching and/or developing, substrates, in particular wafers, in particular etching and/or developing, having a turntable, the turntable has a Venturi gap.
Abstract: A device for lacquering or coating a substrate is disclosed. The device includes a substrate plate configured to accommodate said substrate, and one or more suction points connected to, and extending upwardly from, the substrate plate. The one or more suction points may be configured to provide a vacuum to said substrate.
Abstract: In a device for machining, in particular etching and/or developing, substrates, in particular wafers, in particular etching and/or developing, having a turntable, the turntable has a Venturi gap.