Abstract: A flexible photovoltaic (PV) cell having enhanced properties of mechanical impact absorption, includes: a semiconductor wafer that is freestanding and carrier-less; having a thickness, and having a first surface, and a having second surface that is opposite to that first surface; and non-transcending gaps within the semiconductor wafer. Each non-transcending gap penetrates from the first surface towards the second surface, but reaches to a depth of between 50 to 99 percent of the thickness of the semiconductor wafer, and does not reach said second surface. Each non-transcending gap does not entirely penetrate through an entirety of the thickness of the semiconductor wafer. The semiconductor wafer maintains between 1 to 50 percent of the thickness of the semiconductor wafer as an intact and non-penetrated thin layer of semiconductor wafer that remains intact and non-penetrated by the non-transcending gaps.

Abstract: A flexible photovoltaic (PV) cell having enhanced properties of mechanical impact absorption, includes: a semiconductor wafer that is freestanding and carrier-less; having a thickness, and having a first surface, and a having second surface that is opposite to that first surface; a set of non-transcending gaps within the semiconductor wafer. Each non-transcending gap penetrates from the first surface towards the second surface but reaches to a depth of between 80 to 99 percent of the thickness of the semiconductor wafer, and does not reach said second surface. Each non-transcending gap does not entirely penetrate through an entirety of the thickness of the semiconductor wafer. The semiconductor wafer maintains at least 1 percent of the thickness of the semiconductor wafer as an intact and non-penetrated thin layer of semiconductor wafer that remains intact and non-penetrated by the non-transcending gaps. The intact and non-penetrated thin layer of semiconductor wafer absorbs and dissipates mechanical forces.

Abstract: Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit toughened physical characteristics making them more suitable for use in mechanically challenging or stressful environments. Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit toughened thermal characteristics making them more suitable for use in environmentally challenging applications. Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit sufficiently toughened characteristics and increase impact resistance to permit packaging in non-rigid and light weight encapsulating layer(s). Semiconductor substrates and semiconductor devices produced from such substrates may exhibit sufficient flexibility to permit for rolling up during shipment and or for non-destructive deformation during deployment over uneven surfaces.