Abstract: A force or pressure sensor includes a monocrystalline silicon diaphragm coated with silicon dioxide upon which single crystalline silicon resistors are fused in a low profile pattern on the surface. The resistors are almost perfectly electrically isolated from each other and from the underlying silicon substrate. The structure is fabricated by forming resistors in a first wafer and then affixing that surface of the first wafer to the silicon dioxide layer on the second wafer. All of the first wafer except for the resistors has been removed, and metal contact capable of resisting elevated temperatures are formed to provide electrical connections to the resistors.

Abstract: An innput/output terminal assembly for pressure transducers of the flexure type. The transducer includes a flexure member which senses an applied pressure by means of strain gauges mounted thereon. A known problem with such an arrangement concerns the electrical connections to the strain gauges wherein there is conflict between the flexible connections required to accommodate flexure displacement and the rigid connections required to lead away from the gauges since a pressure chamber must be spanned. Previously this conflict has been resolved by bonding an insulative terminal plate proximate the flexure to provide a junction between flexible and rigid conductors. Such an arrangement gives rise to problems of construction rigidity and performance if excess bonding resin contacts the flexure. The invention provides a welded terminal plate, which is insulative by virtue of a thick film layer of glass, on which electrical connection may be made to areas of thick film gold.

Abstract: A sensitive deflector beam having an integral deflectable element utilizes an immobilization pin and a limit pin to prevent damage to the deflectable element during fabrication and use. The immobilization pin is inserted through the beam and to the deflectable element to hold the element rigidly in place during fabrication. Thus, relatively rigorous operations such as polishing and circuit deposition may be accomplished without damage to the element.

Abstract: A fluid pressure transmitting diaphragm assembly is disclosed in which a diaphragm support plate (14) and a force transmitting disk (16) are attached respectively to the outer flange (46) and inner flange (48) of an annular diaphragm (44) having a concave portion (50) between the flanges, the concave portion having been formed by fluid pressure acting on the diaphragm to freely deform it following hermetic welding of the flanges. A method of manufacturing such an assembly also is disclosed.