Abstract: A method for changing test substrates in a continuous-flow vacuum system in a multiple-treatment-step process cycle for treating a substrate, a treatment method using the method for changing test substrates, and systems for treating a plurality of substrates (61) and for changing test substrates. For at least two treatment steps, at least two test substrates (66) are transferred to a vacuum treatment system at the beginning of the process cycle and are transferred back out once the process cycle is concluded. Subsequently, the first test substrate (66) concurrently treated in this step is removed from the measurement position (70) it occupied during the treatment and is deposited in an empty position (71) without a test substrate (66). Subsequently, the second test substrate (66) which has not been treated yet is deposited in the resulting free measurement position (70) for the purpose of supplying the second test substrate to the subsequent treatment step.

Abstract: The invention relates to a diaphragm assembly of an aperture diaphragm for delimiting the coating region which is operative in the deposition of a layer and to a sputtering device which uses the diaphragm assembly. The diaphragm assembly comprises a main part (13) which has a passage (14) delimited by a passage edge. The aim of the invention is to design the diaphragm opening to be temporally and geometrically variable in situ. This is achieved in that the diaphragm assembly has at least one diaphragm plate (17, 17?, 17?) which is assembled on the main part (13) so as to be movable in front of the passage (14) and back. The diaphragm assembly additionally comprises a movement device which is operatively connected to the diaphragm plate (17, 17?, 17?) in order to carry out the movement thereof.

Abstract: Holding devices for receiving a plurality of substrates in a substrate treatment system are disclosed. Holding devices comprise a flange, at least one segment that is releasably disposed on the flange, and at least one carrier for receiving one or a plurality of substrates. The flange has connection faces for disposing the at least one segment on the flange. The at least one segment has a segment support structure. The at least one carrier is assembled on the segment support structure.

Abstract: Sputter devices comprise a vacuum supply, a gas supply, a substrate holding device, and sputter sources. Each sputter source is held by an individual source support, each of which has an individual reference point allocated on a sputter surface facing the deposition area, and each of which has a source distance to a source reference surface from the individual reference point. The sputter sources are spaced apart from each other, are arranged as a two-dimensional array opposite the deposition area, and extend along the source reference surface. The source reference surface is parallel to the substrate reference surface. At least one of the sputter sources has a source distance deviating from zero.