Patents Assigned to Solectron Corporqtion
  • Anti-bridging pads for printed circuit boards and interconnecting substrates
    Patent number: 5679929
    Abstract: The present invention provides anti-bridging pad(s) for wave soldering of interconnecting substrates. In particular, the present invention provides interconnecting substrates (e.g. printed circuit board) having anti-bridging pad(s) which substantially conform to trailing pad(s), have geometries and/or placements with respect to trailing pad(s) in an array of functional pads which reduce or eliminate solder bridging.
    Type: Grant
    Filed: July 28, 1995
    Date of Patent: October 21, 1997
    Assignee: Solectron Corporqtion
    Inventors: Douglas Wayne Greenfield, Richard Paul Yorkovich