Abstract: Disclosed herein is a memory package test jig having a harsh condition creating structure. The memory package test jig includes an upper jig which has package seating holes into which memory packages are seated, a lower jig which fixes a socket board in a place between it and the upper jig, a pusher housing which is hinged to the upper jig, a lift panel which is installed below the pusher housing so as to be vertically movable, a pressing panel which vertically moves the lift panel, a lift means which is provided to embody the vertical movement of the lift panel, a pusher block which presses the memory packages, a harsh-thermal-environment creating unit which creates harsh thermal conditions, a cooling unit which conducts a cooling operation when the harsh-thermal-environment creating unit generates or absorbs heat, and a lift lever which linearly move the pressing panel leftwards or rightwards.