Abstract: A process that permits existing thick film printing technology to be utilized with existing conductive adhesives to form multi-layer dielectric devices, more specifically to form multi-layer ferroelectric devices, and more specifically to form multilayer piezoelectric devices. A conductive paste is applied to a first surface of a piezoelectric element in a desired pattern. The disclosed process utilizes conductive paste, which replaces the usual adhesive requirement for bonding while still acting as the conductive layer between the individual elements of the stacked sintered substrates. An isolating filler paste is applied to the first surface of the piezoelectric element in a manner that electrically isolates the conductive pattern as to enable multiple distinct, possibly unequal, regions of electric potential. This paste also may assist bonding and will prevent shorting between the electrically non-equivalent regions of the overall electrode pattern.