Patents Assigned to Solid State Cooling Systems
  • Patent number: 9952004
    Abstract: The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.
    Type: Grant
    Filed: April 4, 2014
    Date of Patent: April 24, 2018
    Assignee: Solid State Cooling Systems
    Inventors: Lloyd Wright, Leo Chin
  • Patent number: 9040001
    Abstract: The present invention provides methods and apparatus for efficiently providing accurate temperature control of a microtiter cold plate and precise alignment of the microtiter cold plate with a microtiter plate.
    Type: Grant
    Filed: April 3, 2013
    Date of Patent: May 26, 2015
    Assignee: Solid State Cooling Systems
    Inventor: Lloyd Wright
  • Publication number: 20140305619
    Abstract: The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.
    Type: Application
    Filed: April 4, 2014
    Publication date: October 16, 2014
    Applicant: SOLID STATE COOLING SYSTEMS
    Inventors: Lloyd Wright, Leo A. Chin
  • Patent number: 6427449
    Abstract: A compact, volatile organic compound removal system is presented. The system has a metal condensation plate and a cooling source in intimate thermal contact with the metal condensation plate. The metal condensation plate has a channel formed in the plate, an inlet in the condensation plate for introducing a gas carrying volatile organic compound vapors into the channel, a high surface area metallic structure, such as foamed metal or metallic fins, in intimate contact with the walls of the channel, an outlet in the condensation plate for removing the gas from the channel and a drain in the condensation plate for removing volatile organic compound condensates from the channel. The cooling source cools the channel walls and the high surface area metallic structure so that the volatile organic compound vapors condense on the high surface area metallic structure to be removed from the gas.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: August 6, 2002
    Assignee: Solid State Cooling Systems
    Inventors: Mark A. Logan, Lloyd F. Wright
  • Patent number: 6354002
    Abstract: A process for fabricating a low-cost high-efficiency liquid cold plate is described. The process uses a metal extrusion designed with internal fluid channels that have their major cross-sectional axes aligned perpendicular to the major surfaces of the extrusion. Particular dimensions for the cross-sections of the fluid channels and their spacings permit the extrusion process to be performed simply. A simple process for fabricating fluid inlet and outlet manifolds, creating turbulent flow inside the fluid channels, a method for capping the extrusion ends, and a method for improving the surface contact with heat generating components is described.
    Type: Grant
    Filed: November 11, 2000
    Date of Patent: March 12, 2002
    Assignee: Solid State Cooling Systems
    Inventors: Lloyd F. Wright, Justice Carman
  • Patent number: 6032726
    Abstract: A process for fabricating a low cost high efficiency liquid cold plate is described. The process uses a metal extrusion designed with internal fluid channels. A simple process for fabricating fluid inlet and outlet manifolds, creating turbulent flow inside the fluid channels, a method for capping the extrusion ends, and a method for improving the surface contact with heat generating components is described.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: March 7, 2000
    Assignee: Solid State Cooling Systems
    Inventors: Lloyd F. Wright, Justice Carman
  • Patent number: 5584183
    Abstract: An improved thermoelectric heat exchanger is provided which comprises a series of thermoelectric units sandwiched between two channels for the purpose of transferring heat from a liquid coolant flowing through one channel to a second fluid flowing through the other channel. Heat transfer fins are brazed to the inner surfaces of both channels to provide improved heat transfer between the fluids and the channels. A thermally conductive grease or ductile metal between the thermoelectric units and the channels provides improved heat transfer at this interface. When an electric current is passed through the thermoelectric units, heat is transferred from the liquid coolant through the thermoelectric units to the second fluid via the Peltier Effect.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: December 17, 1996
    Assignee: Solid State Cooling Systems
    Inventors: Lloyd F. Wright, Clifford C. Wright