Abstract: An apparatus for filtering dry film solvent includes a hollow vessel having a side wall, an open top end and a second end that includes a main outlet that allows fluid to flow out of a hollow interior of the vessel. A removable cover closes off the open top end of the vessel. The apparatus also includes at least one fluid inlet port formed along the side wall of the vessel and defining an entrance into the hollow interior of the vessel and at least one fluid outlet port formed along the side wall of the vessel and defining an exit from the hollow interior of the vessel. A removable filter member is disposed within the hollow interior and is defined by a frame and filter media that extends across the frame such fluid flowing into the hollow interior through the main inlet must flow through the filter media to reach the main outlet. The filter media is disposed at an angle other than 90 degrees relative to the frame of the filter member.

Abstract: A system and method for performing a wet etching process is disclosed. The system includes multiple processing stations accessible by a transfer device, including a measuring station to optically measure the thickness of a substrate, a controller to calculate an etch recipe for the substrate, in real time, and cause a single wafer wet etching station to etch the substrate according to the recipe. In addition, the system can measure the after etch thickness and calculate etch recipes, in real time, as a function of the final measurements of a previous substrate. The system can also include an in situ end point detection device for detecting the TSV reveal point while etching TSVs substrates. The system provides an automated solution to adjust etch recipe parameters in real time according to feedback concerning previously etched wafers and precisely control the TSV reveal height and etch duration using end point detection.