Abstract: A light emitting diode with high heat dissipation includes a substrate, a LED chip, a metal light reflection layer, a first lens, a holder, and a second lens. The substrate has an upper surface formed with a positive electrode and an opposite electrode, and a lower surface opposite to the upper surface. The LED chip is arranged on the upper surface of the substrate, and is electrically connected to the positive electrode and the opposite electrode by wires. The metal light reflection layer is located on the upper surface of the substrate for surrounding the LED chip, and reflecting the light emitted from the LED chip. The first lens is mounted on the metal light reflection layer for encapsulating the LED chip. The holder is mounted on the substrate to cover the first lens. And the second lens arranged on the holder.

Abstract: MICRO-CONNECTOR STRUCTURE AND method of making the same are disclosed. The micro-connector is microminiaturized and improved its degree of compaction by using semiconductor process. The process is etching silicon substrates into V-shaped channels and then a layer of nanometer structure is grown on them to increase stability of conductivity.

Abstract: A Tri-color ZnSe white light emitting diode includes at least a ZnSe LED chip, a blue emission layer, and a green fluorescent powder. Each of ZnSe LED chip is a white light source. The blue emission layer is formed on the ZnSe LED chip to emit blue wavelength light, which shines the ZnSe LED chip to produce yellow light. The green fluorescent powder is covered onto ZnSe LED chip capable of absorbing blue light emitted from the blue emission layer to emit green wavelength light, so that mixing the blue light, yellow light, and green light to produce the white light emitting diode.

Abstract: A package structure of a composite LED is to package an LED chip into a SMD LED package subbody component. Then, a single SMD LED package subbody component or multiple SMD LED package subbody components may be packaged into a large sized recessed package mother body, thereby forming the package structure of a composite LED. Thus, the quality is better, and the color shift is less, thereby enhancing the quality of production, and thereby decreasing the cost of production. In addition, the SMD LED may be previously classified according to the features, and may then be packaged into the mother body, thereby obtaining better features, such as Vf, color, brightness or the like.

Abstract: An energy saving type of light emitting diode lamp is disclosed. In such a manner, the human body sensor may be used to detect existence of the human body. Thus, the LED lamp is disposed at a low illuminance state normally, and may be converted into a high illuminance state when the human body approaches. In addition, the light sensor may be used to detect the environmental illuminance. Thus, when the environmental illuminance is insufficient, the light source is fully opened or half opened, and when the environmental illuminance is sufficient, the light source is closed. In such a manner, the LED lamp may be operated by a high power with a large current during a short time, so that the LED lamp consumes less electricity, has a long lifetime, and saves energy highly.

Abstract: A light emitting diode lamp includes multiple LED members, a plane circuit board, an LED fixing cover, a circuit board mounting seat, a drive circuit, and an LED lamp base having a bulb copper head. The plane circuit board is initially cut to form a multiple-ring shape. Then, the multiple LED members are arranged and soldered on the plane circuit board. Then, the circuit board mounting seat is mounted on the bottom of the plane circuit board, thereby forming a spatial shape having a convex arcuate face. Then, the plane circuit board and the circuit board mounting seat are mounted in the LED lamp base. Then, the LED fixing cover is mounted on the LED lamp base, thereby assembling the light emitting diode lamp which may be available for the present filament bulb seat.

Abstract: The present invention is a surface-mounted device of light-emitting diodes (SMD LED) whose component typically has a plane on the surface. Through the calculation of Snell's Law, most of light fails to be emitted directly from the component because of the difference in the refractive index of the epoxy resin and the atmosphere (the refractive index of the light in the atmosphere is 1, the refractive index of the epoxy resin is around 1.5). It takes several times of refraction and a waste of brightness to allow the light that fails to be emitted directly a chance to be emitted, while leaving some light that might never be emitted. Therefore, the brightness reduces. The surface-mounted devices of light-emitting diodes with small lens for the present invention attach several small lens or diffraction lens on the plane surface of the SMD LED. The lens that enlarges the critical angle increases the direct light-emitting opportunity from the light-emitting chip, which in turn increases the brightness of LED.

Abstract: The present invention of a purplish pink light emitting diode irradiates a purple light with a wavelength ranging from 405 to 430 nm of a LED chip of a light emitting diode onto a red fluorescent powder coated on the surface thereon such that the purple light excites the fluorescent powder to produce a red light with a wavelength about 650 nm. The mixture of the excited red light and the original purple light from the purple light emitting diode produces a purplish pink or pinkish red light emitting diode in a new color tone with extensive application. To use the neoteric and unique color (similar to the color of a Hello Kitty) as a backlight or for displaying or illumination on electronic merchandises, such as mobile phones, attracts the consumers of the young generation.

Abstract: The traditional production method of white light LED is adding YAG phospher on blue light chips which causes two-wavelength white light that is only suitable for indication usage. Moreover, the difficulty in controlling adequate amount of phosphor powder leads to inaccurate color of light. Another production method for three wavelength white light by UV chip arousing R.G.B.-mixed phosphor powder is degenerated in its life and quality due to lack of high-efficiency UV LED chips and UV-typed encapsulating resin.

Abstract: The present invention is a surface-mounted device of light-emitting diodes (SMD LED) whose component typically has a plane on the surface. Through the calculation of Snell's Law, most of light fails to be emitted directly from the component because of the difference in the refractive index of the epoxy resin and the atmosphere (the refractive index of the light in the atmosphere is 1, the refractive index of the epoxy resin is around 1.5). It takes several times of refraction and a waste of brightness to allow the light that fails to be emitted directly a chance to be emitted, while leaving some light that might never be emitted. Therefore, the brightness reduces.

Abstract: A LED packaging process is to place LED chips at predetermined positions on the printed circuit board substrate, followed by drilling holes to penetrate the substrate, followed by passing the printed circuit board through the solder furnace to completely fill the through-hole position with solder points, followed by using molds to make the soldering points into a groove reflector, followed by placing LED chips in the groove reflector, followed by wire bonding and using encapsulation resin for packaging to form SMD LED with reflectors. In the present invention, the filling with metal conductor in electrode through holes on the printed circuit board to form the groove reflector can enhance the heat dissipation of LED and the brightness of LED, which has the advantageous effects that traditional SMD LED can not have.

Abstract: The present invention of “Packaging of Light-Emitting Diode” is mainly to use silicon wafer as the substrate, whose crystal surface has a specific orientation for etching to form grooves. On the back of silicon substrate, dry etching is used for through-hole electrodes. Meanwhile, the insulating oxide layer or the nitride layer on silicon surface is plated with a reflective layer and an electrode layer, so the LED substrate is actually made of “silicon substrate”. Through the procedures including placement of LED chips in the grooves of a silicon substrate, die bonding, wire bonding, encapsulation and cutting, SMD LED can be formed. Compared to traditional LED packaging that uses circuit boards or metal leadframes as main packaging substrates, the present invention is a breakthrough, which uses silicon wafers as substrates, so it has several advantages including good heat dissipation, high heat resistance and easy miniaturization, which are not seen in common LED presently.