Abstract: An active fluid cooled heatsink is provided. The heatsink includes a heatsink body having a cavity therein, the heatsink body having at least a top internal surface and a bottom internal surface; at least an inlet for receiving fluid at a first temperature into the cavity; at least an outlet for expelling fluid at a second temperature from the cavity; a plurality of foils within the cavity, disposed in contact with the bottom internal surface of the heatsink body, where the plurality of foils direct the flow of the fluid; and a surface area on which to mount a plurality of resource adapters.

Abstract: A system and method for provisioning of artificial intelligence accelerator (AIA) resources. The method includes receiving a request for an NPU allocation from a client device; determining an available NPU based on a scanning of a network to discover NPU resources; and allocating the available NPU to the client device.

Abstract: An active fluid cooled heatsink assembly for modular components is disclosed. The active fluid heatsink assembly includes a fluid cooled heatsink, the heatsink further comprising: an inlet, an outlet, and a surface, wherein fluid passing through the heatsink is received by the inlet at a first temperature and expelled from the outlet at a second temperature, wherein the second temperature is higher than the first temperature; and at least one resource adapter, each resource adapter further comprising a first surface having a shape which conforms to a corresponding electronic resource of at least one electronic resource and a second surface having a shape corresponding to at least a portion of the surface of the fluid cooled heatsink, wherein each resource adapter exchanges heat from the corresponding electronic resource to the fluid cooled heatsink, and wherein the at least one resource adapter is mounted on the surface of the fluid cooled heatsink.