Abstract: A mechanically-stable and thermally-conductive interface device between a semiconductor die and a package for the die, and related method of fabrication, comprising: a semiconductor die; a package for the die; a surface area-enhancing pattern on the package and/or the die; and die attach materials between the die and the package, the die attach materials attaching the die to the package through an interface provided by the die attach materials; wherein: an effective bonding area between the die attach materials and the package and/or the die is greater with the pattern than without the pattern; and the increase of the effective bonding area simultaneously increases the surface area for thermal transport between the package and/or the die, and the die attach materials; and increases the surface area for stably attaching the at least one of the package and the die to the die attach materials.

Abstract: A mechanically-stable and thermally-conductive interface device between a semiconductor die and a package for the die, and related method of fabrication, comprising: a semiconductor die; a package for the die; a surface area-enhancing pattern on the package and/or the die; and die attach materials between the die and the package, the die attach materials attaching the die to the package through an interface provided by the die attach materials; wherein: an effective bonding area between the die attach materials and the package and/or the die is greater with the pattern than without the pattern; and the increase of the effective bonding area simultaneously increases the surface area for thermal transport between the package and/or the die, and the die attach materials; and increases the surface area for stably attaching the at least one of the package and the die to the die attach materials.

Abstract: A mechanically-stable and thermally-conductive interface device between a semiconductor die and a package for the die, and related method of fabrication, comprising: a semiconductor die; a package for the die; a surface area-enhancing pattern on the package and/or the die; and die attach materials between the die and the package, the die attach materials attaching the die to the package through an interface provided by the die attach materials; wherein: an effective bonding area between the die attach materials and the package and/or the die is greater with the pattern than without the pattern; and the increase of the effective bonding area simultaneously increases the surface area for thermal transport between the package and/or the die, and the die attach materials; and increases the surface area for stably attaching the at least one of the package and the die to the die attach materials.

Abstract: An assembly and method for irradiating a surface utilizing a plurality of LEDs in a pattern such that a linear fill factor characterizing such pattern is at least 80% along a focusing direction and/or at least 20% along a direction transverse to said focusing direction, the radiation emitted from the LEDs and reflected onto the surface from a trough reflector.