Abstract: An RFID tagged implement assembly includes a metallic implement, and a wireless RFID transponder. The RFID transponder includes a housing; an inductive coupler within the housing, and an RFID chip coupled with the inductive coupler. The inductive coupler is inductively coupled with the metallic implement.

Abstract: A storage container assembly includes a container having a metal side wall, and a passive wireless repeater mounted on the side wall. The repeater includes a first antenna on one side of the side wall, a second antenna on an opposite side of the side wall, and an electrical connection between the first antenna and the second antenna. The electrical connection may be in the form of a first connector mounted to the first antenna and a second connector mounted to the second antenna.

Abstract: An RFID tag includes a circuit board assembly having a substrate comprised of a material with a high dielectric constant of greater than approximately 4 and having a first side and a second side. A patch antenna is mounted to the first side of the substrate. A metallic ground plane is mounted to the second side of the substrate, and an RFID circuit is at the second side of the substrate. A shorting wall includes a plurality of through holes extending through the substrate and interconnecting the antenna with the ground plane. The plurality of through holes are generally linearly arranged relative to each other along an edge of the ground plane. An electrically conductive via extends through the substrate and interconnects the antenna with the RFID circuit. The via is at a distance from the shorting wall whereby an impedance of the RFID circuit approximately matches an impedance of the antenna. A backplane is coupled with the ground plane, on a side of the ground plane opposite the substrate.

Abstract: An RFID tag includes a circuit board assembly having a circuit board, an RFID circuit, an antenna, and a metallic ground plane. The circuit board has a first side and a second side. The circuit board carries the antenna on the first side and the ground plane on the second side. The RFID circuit is coupled with each of the antenna and the ground plane. A backplane is coupled with the ground plane, on a side of the ground plane opposite the circuit board. An overmolded housing surrounds and hermetically seals the circuit board assembly. The housing is comprised of a material which is both autoclavable and has a low dielectric constant of between approximately 1 to 5.

Abstract: An RFID tag includes a substrate made of a material with a high dielectric constant of greater than approximately 4 and having a first side and a second side. A patch antenna is mounted to the first side of the substrate. A metallic ground plane is mounted to the second side of the substrate, and includes a feed through hole. A metallic backplane is coupled with the ground plane, on a side of the ground plane opposite the substrate. The backplane and/or the ground plane includes a recess. An RFID circuit is positioned within the recess. A shorting wall includes a plurality of through holes extending through the substrate and interconnecting the antenna with the ground plane. The plurality of through holes are generally linearly arranged relative to each other along an edge of the ground plane. An electrically conductive via extends through the substrate and the feed through hole of the ground plane. The via has a diameter which is slightly less than the feed through hole.