Abstract: The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements. The visual assessment takes place by means of a video camera and a computing device connected to the video camera. The assessment criteria for the soldered joints are stored in the computing device. The invention also relates to an apparatus for carrying out the method.

Abstract: The invention relates to a method for soldering an object comprising several soldered joints, which method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements, wherein said visual assessment takes place by means of a video camera and a computing device connected to the video camera, in which computing device the assessment criteria for the soldered joints are stored.

Abstract: The invention relates to an apparatus for visually inspecting soldered joints made on a soldered object, comprising: A camera for recording at least one image of the soldered object on which the soldered joints to be soldered are present, a computing device connected to the camera for receiving the signals from the camera that represent the images recorded by the camera, the computing device being arranged for comparing the signals with signals which are representative of correct soldered joints, and a handling device for moving the soldered objects on which the soldered joints to be inspected have been made to a position within the viewing range of the camera.

Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.

Abstract: A method for separating dross floating on solder into solder and a residue, comprising of repeatedly cutting through the dross with at least one knife extending substantially parallel to the direction of movement and removing the residue from the solder. The invention also relates to an apparatus for separating dross floating on solder present in a vessel into solder and a residue, wherein the apparatus comprises at least one knife which is movable along a path extending through the vessel, and wherein the at least one knife is adapted to cut through the dross during the movement along the path. Due to the above stated cutting operation the units of the dross formed by nuclei of solder enveloped by metal oxides are destroyed, whereby the solder enveloped by metal oxides are destroyed, whereby the solder is released and added to the solder already present in the bath, and the released metal oxide will float on the solder. A considerable volume and mass reduction of dross to metal oxide herein takes place.

Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.

Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting, at a desired temperature which can be set using a heater and one or more thermo measuring devices, a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The tool comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board. The tool targets only those areas of the board where bridges or excess solder repeatedly form during the soldering process without disturbing solder joints where no bridges or excess solder form.

Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The debridging tool, which comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board, targets only those areas of the board where bridges or excess solder repeatedly forms during the soldering process without disturbing solder joints where no bridges or excess solder form. More than one movable nozzle may be used where warranted.

Abstract: A flux vapor management system for a reflow oven includes temperature control units disposed in heating and cooling regions of the oven. A fan within each of the temperature control units provides suction to an intake port. Intake ports of selected temperature control units in the heating region of the oven are connected with a barrier vent disposed between the heating and cooling regions of the oven. Gas drawn into the barrier vent by the suction from the intake ports prevents flux laden gas from migrating into the cooling region. The flux vapor management system also includes a filter for removing flux vapors from a reflow oven. The filter condenses flux vapors by converging a jet of hot gas from the oven with a cooled gas jet causing the flux vapors to condense while suspended in the gas stream. The flux laden gas does not contact any solid surface below the flux condensation temperature so there is no build-up of flux within the apparatus.

Abstract: The invention relates to an oven for reflow soldering objects such as printed circuit boards. A temperature differential is established between the top and bottom surfaces of the board to allow gases liberated from solder paste within through-holes to escape, thereby preventing the formation of voids. The oven provides a flow of gas at a first temperature from an upper gas supplying means to the top side of the board. A flow of gas at a second temperature is directed at the bottom side of the board by a lower gas supplying means. According to one aspect of the invention, a portion of the gas supplied by the upper gas supplying means is captured by the lower gas supply means and is heated or cooled to the second temperature. According to another aspect of the invention, a number of pairs of independantly controllable upper and lower gas supplying means are arranged along a conveyor to provide a temperature profile to perform reflow soldering.

Abstract: The invention relates to an apparatus for subjecting objects to processes, wherein the apparatus comprises a plurality of chambers wherein are each adapted to contain at least one object; and processing devices for processing objects present in the chambers, wherein the chambers are adapted to successively perform different processes on the object present in the chamber. According to a first embodiment, the chambers are moveable in accordance with a closed circuit and the processing devices are adapted to perform a process on the object which is present in a chamber present in a defined position. According to a second embodiment the chambers are arranged fixedly and transporting means are arranged to carry the objects for processing and the processed objects in and out of the chambers.

Abstract: A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compartments connected subsequent to the heating compartments for cooling the soldered objects. The first cooling compartment subjects the objects to a first, descending temperature gradient, and the second cooling compartment subjects the objects to a second, descending temperature gradient, wherein the second temperature gradient is steeper than the first temperature gradient. The objects are cooled in the first cooling chamber to a temperature below the solidification temperature of the solder.

Abstract: A transporting device for transporting substantially flat components between a pair of opposed carrier belts guided along two parallel guide rails which extend in the direction of transport. The flat components are held by clamping elements mounted elastically on the carriers for fixedly clamping the flat components for transport between the carrier belts. Additionally, a detection device for detecting an incorrect position of at least one of the clamping elements in relation to its associated carrier belt is provided which produces a signal that can be used to stop the carrier belts, actuate a warning signal, or for other safety enhancing purposes.

Abstract: The invention relates to a transporting device for flat objects, for instance printed circuit boards, comprising two endless carriers which are guided by two parallel extending guides, wherein the carriers are each provided with supports extending substantially horizontally in the direction toward the other carrier, wherein at least a part of the total number of supports is provided with at least one clamp fixing in substantially vertical direction flat objects resting on the supports. Preferably, the clamp is adapted to also exert a horizontal force on flat objects resting on the supports. This results in the flat objects also being fixed in the horizontal direction so that they cannot become detached in this direction either.

Abstract: An apparatus for applying solder enhancing liquid flux to objects for soldering including a fluxer wherein the density of the liquid flux supplied to the fluxer is controlled by a device for determining the density intermediately a flux storage container, and the fluxer; the density determining device producing an output signal whereby the quantity of diluent supplied to a liquid flux storage container is controlled. The density determining device includes a liquid flux pressure measurer with a vessel extending thereabove which includes an overflow to maintain constant flux liquid level therein.

Abstract: The invention relates to a soldering apparatus, comprising a solder vessel; at least one soldering tower located in said solder vessel; transport means for transporting objects to be soldered over said soldering tower; solder wave generating means for generating a solder wave emerging from the apex of the soldering tower and contacting the objects to be soldered, the soldering tower comprising a weir such that at least a part of the solder wave flows parallel to the direction of movement of the objects to be soldered over said weir; and guide means for guiding said part of the solder wave such that the solder wave leaves the soldered object substantially abruptly. As a consequence of said feature the stream of solder is abruptly guided away from the printed circuit board, so that the possibilities for developing short circuits on the printed circuit board are substantially reduced.

Abstract: The invention relates to a device for measuring the height of a solder wave in a soldering apparatus which comprises a solder bath and which is provided with at least one solder tower for generating a solder wave and a pump connected to the solder tower, wherein the measuring device comprises: means for measuring the liquid pressure in the connection between the pump and the solder tower. As a result of these steps it is possible to measure accurately the pressure of the solder moving out of the pump to the solder tower. This pressure is in any case a good measure for the height of the solder wave. According to a first preferred embodiment the means for measuring the liquid pressure comprise a measuring vessel joined to the connection between pump and tower and communicating at its top with the atmosphere, the upper edge of which vessel is located higher than the outflow opening of the solder tower.

Abstract: A soldering device has a chamber; soldering means for soldering objects which are transported through the chamber; a transporting means in the chamber for transporting the objects for soldering along a transport route; a cleaning means for cleaning gases present in the chamber, which cleaning means being connected to the chamber with a feed line and a discharge line; and a fan situated in one of the lines. A cooling device to cool the gases is situated in one of the lines. The soldering device is preferably a reflow-soldering device, wherein the soldering means are formed by heating means.

Abstract: The invention relates to a soldering apparatus comprising: a vessel for liquid solder; at least one soldering tower placed in the vessel for causing liquid solder to leave the soldering tower on the upper side, wherein the soldering tower is adapted to cause the liquid solder to run off on all sides; a conveyor for carrying objects for soldering along the top side of the soldering tower such that the objects for soldering come into contact with the liquid solder; and a cover for maintaining an atmosphere with a reduced oxygen content at least in the surrounding area of the liquid solder.

Abstract: The invention relates to a soldering apparatus comprising: a soldering chamber; transporting means for transporting the objects to be soldered through the soldering chamber; and heating means for heating the objects to be soldered in the soldering chamber, wherein the heating means are formed by means for feeding heated gas to the chamber. A simple device is thus obtained which heats uniformly. Such an apparatus can be embodied in both closed and open form. According to one of the preferred embodiments the means for feeding heated gas are formed by at least one heating unit, wherein the heating units are each formed by a fan and at least one heating device, for instance an electrical heating filament, connected forwardly thereof. Cooling units can also be used.