Abstract: A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.

Abstract: Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.

Abstract: A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.

Abstract: Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.

Abstract: The present invention has been proposed to resolve the above-described problems, and it is an objective of the present invention to provide a heat dissipation sheet with excellent heat dissipation properties, which has a specific porosity, exhibits excellent horizontal heat conductivity, and exhibits an excellent effect in peel strength, and a manufacturing method thereof.

Abstract: The present invention relates to a horizontal thermoelectric tape and a method for manufacturing same, and more particularly, to a horizontal thermoelectric tape for an effective blocking of an electromagnetic wave and an excellent heat dissipation effect. The horizontal thermoelectric tape of the present invention unifies the double layer structure of an adhesion layer and a heat dissipation layer, more effectively achieving the heat dissipation effect, and simplifying the manufacturing process thereof, and by using a non-evaporated metal foil as a conductive base material, enables a horizontal thermoelectric tape having an excellent heat conductivity, and using a conductive base material not containing impurities.

Abstract: The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention provides a heat dissipating tape, comprising: a conductive substrate which is made of conductive fiber coated with a conductive material; and an heat dissipating adhesion layer which is formed on at least one side of the conductive substrate and is coated with a heat dissipating adhesive including a graphite-containing acrylic adhesive or silicon adhesive. The heat dissipating tape has excellent resistance to external forces on the product, has an excellent outer appearance due to its smooth surface, is less likely to get damaged, and the heat dissipating adhesion layer is not easily separated from the conductive substrate.

Abstract: The present invention relates to a horizontal thermoelectric tape and a method for manufacturing same, and more particularly, to a horizontal thermoelectric tape for an effective blocking of an electromagnetic wave and an excellent heat dissipation effect. The horizontal thermoelectric tape of the present invention unifies the double layer structure of an adhesion layer and a heat dissipation layer, more effectively achieving the heat dissipation effect, and simplifying the manufacturing process thereof, and by using a non-evaporated metal foil as a conductive base material, enables a horizontal thermoelectric tape having an excellent heat conductivity, and using a conductive base material not containing impurities.

Abstract: The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention provides a heat dissipating tape, comprising: a conductive substrate which is made of conductive fiber coated with a conductive material; and an heat dissipating adhesion layer which is formed on at least one side of the conductive substrate and is coated with a heat dissipating adhesive including a graphite-containing acrylic adhesive or silicon adhesive. The heat dissipating tape has excellent resistance to external forces on the product, has an excellent outer appearance due to its smooth surface, is less likely to get damaged, and the heat dissipating adhesion layer is not easily separated from the conductive substrate.