Patents Assigned to Solutions
  • Patent number: 11802276
    Abstract: Disclosed are methods for isolating polymerase complexes from a mixture of polymerase complex components. The polymerase complexes can comprise a nanopore to provide isolated nanopore sequencing complexes. The methods relate to the positive and negative isolation of the polymerase complexes and/or nanopore sequencing complexes. Also disclosed is a nucleic acid adaptor for isolating active polymerase complexes, polymerase complexes comprising the nucleic acid adaptor, and methods for isolating active polymerase complexes using the nucleic acid adaptor.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 31, 2023
    Assignee: Roche Sequencing Solutions, Inc.
    Inventors: Helen Franklin, Cynthia Cech, Timothy Kellogg Craig, Aruna Ayer, Kirti Dhiman, Natalie B. Chechelski Johnston, Joshua N. Mabry, Arkadiusz Bibillo, Peter Crisalli, Randall W. Davis
  • Patent number: 11802210
    Abstract: A thin film structure including a reflector layer; and a hybrid layer including an organic colored material and at least one of an organic filler and an inorganic filler; wherein a concentration of the at least one of an organic filler or an inorganic filler is in a range of from about 3 wt. % to about 30 wt. %. A method of making a thin film structure is also disclosed.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: October 31, 2023
    Assignee: VIAVI SOLUTIONS INC.
    Inventors: Vladimir Raksha, Joe Garcia, Paul Kohlmann, Alberto Argoitia, Carole Thoraval, Robert Oberti
  • Patent number: 11801752
    Abstract: A motor vehicle control device, comprising an outer housing part, a control unit including a control surface and a printed circuit board which is carried by a circuit board carrier that is at least partly accommodated and floatingly mounted in the outer housing part.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: October 31, 2023
    Assignee: BCS AUTOMOTIVE INTERFACE SOLUTIONS GMBH
    Inventors: Nelson Carvalho, Pawel Borowczyk, Steffen Sornberger, Helmut Sowig, Leandro Conde, Viktor Beliuzhenko
  • Patent number: 11804667
    Abstract: A board-to-board connector assembly includes first and second connector assemblies and a connector interconnect between the first and second connector assemblies. Each connector assembly includes an outer shell and a connector received in a cavity of the outer shell. The connector has a connector body holding contacts in a card slot, which receives a circuit card edge of an add-in card. The outer shell has an outer board guide configured to engage the add-in card and guide mating of the outer shell with the add-in card. The outer shell has a latch configured to latchably engage the add-in card to secure the connector to the add-in card. The connector interposer electrically interconnects the contacts of the connector assemblies to electrically connect the add-in cards.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: October 31, 2023
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventors: Randall Robert Henry, Michael John Phillips, Michael David Herring, Brandon Michael Matthews
  • Patent number: 11804507
    Abstract: A solid-state imaging device including a first substrate having a pixel unit formed thereon and including a first semiconductor substrate and a first multi-layered wiring layer stacked, a second substrate having a circuit formed thereon and including a second semiconductor substrate and a second multi-layered wiring layer, the circuit having a predetermined function, and a third substrate having a circuit formed thereon and including a third semiconductor substrate and a third multi-layered wiring layer. The first substrate and the second substrate are bonded together such that that the first multi-layered wiring layer and the second semiconductor substrate are opposed to each other. The solid-state imaging device includes a first coupling structure and a second coupling structure. The first coupling structure electrically couples a circuit of the first substrate and the circuit of the second substrate.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: October 31, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Ikue Mitsuhashi, Reijiroh Shohji, Minoru Ishida, Tadashi Iijima, Takatoshi Kameshima, Hideto Hashiguchi, Hiroshi Horikoshi, Masaki Haneda
  • Patent number: 11805324
    Abstract: To suppress entrance of incident light into a charge holding section in a pixel to prevent a reduction in image quality. An imaging device includes a pixel array. The pixel array includes a plurality of pixels each including a photoelectric converter that generates a charge depending on incident light, a charge holding section that holds the generated charge, and a charge transfer section that transfers the generated charge to the charge holding section, each of the plurality of pixels generating an image signal depending on the held charge. The charge holding section or the charge transfer section in each of the plurality of pixels is arranged close to an optical center of the pixel array with respect to the incident light.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: October 31, 2023
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Shinichiro Noudo
  • Patent number: 11805291
    Abstract: Tag data is created from in-band data in a media content item by a remote location while the media content item is being broadcasted by a content provider and received by the remote location. The tag data identifies locations in the media content item which enables media devices to accurately jump to particular locations in the media content item based on the tag data.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: October 31, 2023
    Assignee: TiVo Solutions Inc.
    Inventors: Mark Berner, David Chamberlin, Kevin P. Smith
  • Patent number: 11802445
    Abstract: A cable head for attaching a wireline to a downhole tool includes an upper tubular member and a lower tubular member removably attached by a threaded connection. The cable head includes a pack-off assembly disposed within the upper tubular member. The pack-off assembly includes a deformable pack-off element comprising an outer sidewall for sealing against an inner sidewall of the upper tubular member, and an inner sidewall for sealing around the wireline. The pack-off assembly includes a biasing means axially in line with the deformable pack-off element. The pack-off element and the biasing means are axially compressed between an internal shoulder of the upper tubular member and the lower tubular member when the upper and lower tubular members are removably attached by the threaded connection, to enhance the seal of the tubular pack-off element with the inner sidewall of the upper tubular member, and with the wireline.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: October 31, 2023
    Assignee: Tier 1 Energy Solutions, Inc.
    Inventor: Jeffrey Golinowski
  • Patent number: 11805698
    Abstract: According to one embodiment, a power generation element, includes a first conductive layer, a second conductive layer, and a crystal member. A direction from the second conductive layer toward the first conductive layer is along a first direction. The crystal member is provided between the first conductive layer and the second conductive member. The crystal member includes a crystal pair. The crystal pair includes a first crystal part and a second crystal part. A second direction from the first crystal part toward the second crystal part crosses the first direction. A gap is provided between the first crystal part and the second crystal part. The first conductive layer is electrically connected to the first crystal part. The second conductive layer is electrically connected to the second crystal part.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: October 31, 2023
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Energy Systems & Solutions Corporation
    Inventors: Hisashi Yoshida, Hisao Miyazaki, Shigeya Kimura, Hiroshi Tomita, Souichi Ueno, Takeshi Hoshi
  • Patent number: 11801544
    Abstract: Method and Apparatus for fabricating a spacer frame for use in an insulating glass unit. One of a multiple number of possible spacer frame materials is chosen for the spacer frame. An elongated strip of the material is moved to a notching station where notches are formed at corner locations. The character of the notches is adjusted based on the selection of the metal strip material and more particularly to achieve bending of the material in an repeatable, straightforward manner. Better control over the notching process is also achieved by exhaust flow control of a double acting cylinder. A positioning spacer achieve very accurate side to side positioning of a die and anvil to precisely notch and deform the metal strip. Downstream from the notching station the metal strip is bent into a channel shaped elongated frame member having side walls. Further downstream a leading strip of channel shaped material is severed or separated from succeeding material still passing through the notching and bending station.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: October 31, 2023
    Assignee: GED Integrated Solutions, Inc.
    Inventors: William A. Briese, John Grismer, Timothy B. McGlinchy
  • Patent number: 11803908
    Abstract: Computer-implemented methods and computer systems for an electronic transaction platform that enables the buying and/or selling of securities by users. The methods and systems relate to the identification and selection of one or more financial instruments to trade during an electronic communication session for trading a financial instrument between an initiating user and one or more invitee users with the assistance of a dealer user or other intermediate entity. The selected financial instrument is identified based on a degree of match between the preferred yield risk profile of the initiating user and the plurality of attributes associated with the financial instruments that are available to be traded, wherein the plurality of attributes includes at least two of a set of yield attributes, a set of issuer attributes, and a set of underwriting attributes.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: October 31, 2023
    Assignee: Broadridge Fixed Income Liquidity Solutions, LLC
    Inventors: James Toffey, Spenser Huston, Vijay Mayadas, William Gartland, Thomas Duignan, Rick Montgomery, Albert John Cass, Suneel Nallagonda, Bryan Moore
  • Patent number: 11801157
    Abstract: The present invention relates to an ostomy device for contacting a stoma. The present invention also relates to the use of an ostomy device for contacting a stoma and a kit of parts for preparing an ostomy assembly or system.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: October 31, 2023
    Assignee: Advanced Medical Solutions Limited
    Inventors: Roxanna Woodward, Wayne Bonnefin
  • Patent number: 11804460
    Abstract: Structures, methods and devices are disclosed, related to improved stack structures in electronic devices. In some embodiments, a stack structure includes a pad implemented on a substrate, the pad including a polymer layer having a side that forms an interface with another layer of the pad, the pad further including an upper metal layer over the interface, the upper metal layer having an upper surface. In some embodiments, the stack structure also includes a passivation layer implemented over the upper metal layer, the passivation layer including a pattern configured to provide a compressive force on the upper metal layer to thereby reduce the likelihood of delamination at the interface, the pattern defining a plurality of openings to expose the upper surface of the upper metal layer.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: October 31, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jiro Yota, Dogan Gunes
  • Patent number: 11804799
    Abstract: A system for controlling a synchronous motor drive may be configured to receive a command voltage signal and to identify, in the synchronous motor drive, a resistance imbalance signature from the command voltage signal. The system may determine, based on the resistance imbalance signature, respective phase resistances that correspond to phases of a synchronous motor of the synchronous motor drive. Each respective phase resistance may include a phase transistor resistance and a phase winding resistance. The system may identify, based on the phase resistances and an estimated average resistance between the phases of the synchronous motor, one or more phases of the synchronous motor that correspond to one or more phase resistances representing a resistance imbalance.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: October 31, 2023
    Assignee: Steering Solutions IP Holding Corporation
    Inventors: Prerit Pramod, Rakesh Mitra, Darren Qu, Subhra Paul, Julie A. Kleinau
  • Patent number: 11803044
    Abstract: A spectral imaging device (1312) for capturing one or more, two-dimensional, spectral images (1313A) of a sample (1310) including (i) an image sensor (1328), (ii) an illumination source (1314), (iii) a beam path adjuster (1362), and (iv) a control system (1330). The illumination source (1314) that generates an illumination beam (1316) that is directed along an incident sample beam path (1360) at the sample (1310). The beam path adjuster (1362) selectively adjusts the incident sample beam path (1360).
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: October 31, 2023
    Assignee: Daylight Solutions, Inc.
    Inventors: Jeremy A. Rowlette, Miles James Weida, Edeline Fotheringham, Justin Kane, Rudy Bermudez, William Chapman
  • Patent number: 11804502
    Abstract: The height of a solid-state imaging element is further reduced as compared to the related art. A solid-state imaging element that is a wafer-level chip size package, including: an optical sensor chip; a protective layer that is stacked on a light receiving surface of the optical sensor chip; and a rewiring layer that is stacked on a surface opposite to the light receiving surface of the optical sensor chip, in which a connection terminal of the rewiring layer is a copper flat pad without a solder ball, an alloy layer of tin and copper is not formed on a front surface of the flat pad, and a thermal expansion coefficient of the protective layer is substantially balanced with a thermal expansion coefficient of the rewiring layer.
    Type: Grant
    Filed: February 21, 2023
    Date of Patent: October 31, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Naoto Sasaki, Yutaka Ooka
  • Patent number: 11804234
    Abstract: A method for enhancing telephone speech signals based on Deep Convolutional Neural Network (CNN) is disclosed. The method is able to reduce the effect of acoustic distortions in daily scenarios during a telephone call. It is a single-channel, speech-oriented method with causal design and low latency. The novelty lies in the noise reduction method which, based on the classical gain method, uses a CNN to learn the Wiener estimator. Then, it computes the gain of the filter to enhance the speech power over the noise power for each time-frequency component of the signal. The selection of the Wiener gain estimator as an essential element of the method, decreases the vulnerability to estimation errors since the characteristics of this measure make it very appropriate to be estimated by deep learning approaches.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: October 31, 2023
    Assignee: SYSTEM ONE NOC & DEVELOPMENT SOLUTIONS, S.A.
    Inventors: Javier Gallart Mauri, IƱigo Garcia Morte, Dayana Ribas Gonzalez, Antonio Miguel Artiaga, Alfonso Ortega Gimenez, Eduardo Lleida Solano
  • Patent number: 11804435
    Abstract: A semiconductor-on-insulator die includes a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, and a first via layer between the active layer and the first metal layer. The die includes at least one contact pad and a transistor including a first terminal formed within the active layer. A conduction path can include a plurality of first conduction path portions extending between the first terminal and the at least one contact pad and residing within a footprint of the at least one contact pad.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: October 31, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yang Liu, Yong Hee Lee, Thomas Obkircher
  • Patent number: 11804359
    Abstract: Methods and systems for acquiring transmission electron microscope video data on a rolling-shutter detector at an enhanced frame rate and without temporal distortions are described. Also described are methods to enhance the dynamic range of image and diffraction data acquired using a transmission electron microscope. The disclosed methods and systems may also be applicable to photon detection and imaging systems.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: October 31, 2023
    Assignee: INTEGRATED DYNAMIC ELECTRON SOLUTIONS, INC.
    Inventors: Ruth Bloom, Sang Tae Park, Bryan Reed, Daniel Masiel
  • Patent number: 11803873
    Abstract: Embodiments of system are disclosed in which selection strategies for a direct marketing campaign that identify consumers from a credit bureau or other consumer database can be planned, tested, and/or refined on a stable subset of the credit database. In some embodiments, once refined, consumer selection criteria may be used to execute the direct marketing campaign on the full consumer/credit database, which is preferably updated approximately twice weekly. In one preferred embodiment, the data for the test database represents a random sampling of approximately 10% of the full database and the sampling is regenerated approximately weekly in order to provide a stable set of data on which campaign developers may test their campaign. For each consumer in the sampling, the environment may allow a client to access and use both attributes calculated by the credit bureau and proprietary attributes and data owned by the client.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: October 31, 2023
    Assignee: Experian Information Solutions, Inc.
    Inventors: Laura J. DeSoto, Michele M. Pearson, Kristi Ann Adkinson, Venkat R. Achanta, Felicia Peng