Patents Assigned to SolVisions Technologies Interantional Inc.
  • Apparatus and Methods for High-Density Chip Connectivity
    Publication number: 20120061856
    Abstract: An electronic circuit and method may include a first chip including first electronics and a first connector including multiple self-alignment features and conductive pads. A second chip may include second electronics and a second connector including multiple self-alignment features and conductive pads. The first chip and second chip may be indirectly horizontally aligned with one another and in electrical communication with one another via the first and second connectors.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 15, 2012
    Applicant: SolVisions Technologies Interantional Inc.
    Inventor: Madhukar B. Vora