Patents Assigned to Sonid Inc.
  • PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE
    Publication number: 20240174898
    Abstract: The present invention relates to a functional pressure-sensitive composition having high heat resistance and bending resistance characteristics, including: 40 to 55 wt % of a urethane acrylate oligomer, 30 to 44 wt % of an acrylate monomer, 2 to 5 wt % of a photoinitiator, 0.2 to 2 wt % of a silane coupling agent, 0.1 to 1 wt % of a light stabilizer, 0.1 to 1 wt % of an ultraviolet absorber and 0.1 to 1 wt % of an antioxidant, and an electrical component with a 3D structure using the same.
    Type: Application
    Filed: August 18, 2023
    Publication date: May 30, 2024
    Applicants: HYUNDAI MOBIS CO., LTD., Sonid Inc.
    Inventors: Jae Joon CHANG, Hyeon Don KIM, Eun Chang LEE, Jae Min LEE, Byeong Chan SONG, Hyun LEE, Tae Won HWANG, So Yeon LIM