Patents Assigned to Sonipulse, Inc.
  • Patent number: 8756997
    Abstract: Disclosed herein is a sonic resonator system for use in testing the adhesive bond strength of composite materials. Also disclosed herein are a method of calibrating the sonic resonator system to work with a particular composite bond joint, and a method of non-destructive testing the “pass-fail” of the bonded composite bond strength, based on a required bond strength.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: June 24, 2014
    Assignee: Sonipulse, Inc.
    Inventors: Warren Questo, Carl W. Hennige
  • Patent number: 8347723
    Abstract: Disclosed herein is a sonic resonator system for use in testing the adhesive bond strength of composite materials. Also disclosed herein are a method of calibrating the sonic resonator system to work with a particular composite bond joint, and a method of non-destructive testing the “pass-fail” of the bonded composite bond strength, based on a required bond strength.
    Type: Grant
    Filed: May 21, 2010
    Date of Patent: January 8, 2013
    Assignee: Sonipulse, Inc.
    Inventors: Warren Questo, Robert W. Cribbs, Donna L. Cribbs, legal representative, Carl W. Hennige