Abstract: Disclosed herein is a sonic resonator system for use in testing the adhesive bond strength of composite materials. Also disclosed herein are a method of calibrating the sonic resonator system to work with a particular composite bond joint, and a method of non-destructive testing the “pass-fail” of the bonded composite bond strength, based on a required bond strength.
Abstract: Disclosed herein is a sonic resonator system for use in testing the adhesive bond strength of composite materials. Also disclosed herein are a method of calibrating the sonic resonator system to work with a particular composite bond joint, and a method of non-destructive testing the “pass-fail” of the bonded composite bond strength, based on a required bond strength.
Type:
Grant
Filed:
May 21, 2010
Date of Patent:
January 8, 2013
Assignee:
Sonipulse, Inc.
Inventors:
Warren Questo, Robert W. Cribbs, Donna L. Cribbs, legal representative, Carl W. Hennige