Abstract: Systems, methods and apparatus related to pre-wetting an edge portion of a bonded wafer prior to wetting a flat, horizontal portion of the bonded wafer. The apparatus includes a frame having nozzles directed such that couplant discharged from these nozzles wet the edge of the wafer. The edge nozzles have couplant flow vectors that interface to dampen the trajectory of fluid to reduce splash and pre-wet the edges of the bonded wafer.

Abstract: In an automated defect detection and classification system, one or more computing devices access scan data acquired in an ultrasonic scan of an object. A first input feature map, including a two-dimensional (2D) scan image, is built from the scan data and input to a first deep neural network to generate a first output feature map. A second input feature map, including an image of a defect-free object, is input to a second deep neural network, having the same structure and weight values as first deep neural network, to produce a second output feature map. The scanned object is determined to contain a defect when a distance between first and second output feature maps is large. In an alternative approach, the 2D scan image and one or more images of the defect-free object are input to different channels of neural network trained using color images.

Abstract: In a method and apparatus for automated inspection, an image is acquired of an object under inspection and a difference image is generated showing the difference between the acquired image and a reference image of a defect-free object of the same type. Characteristics of the difference image, or detected isolated regions of the difference image, are passed to an automated defect classifier to classify defects in the object under inspection. The characteristics of the difference image may be pixels of the difference image or features determined therefrom. The features may be extracted using a neural network, for example. The automated defect classifier is trained using difference images and may be further trained, in operation, based on operator classifications and using simulated images of defects identified by an operator.

Abstract: A coupler and a chuck are described. The chuck is configured to secure an article while the wafer is undergoing an inspection process. The chuck has a plurality of vacuum areas. Some vacuum areas hold the wafer in place while other vacuum areas suction couplant from the edge surface of the wafer. The coupler is used to inspect a surface and subsurface of the wafer for defects and includes a sensing device, which may be a transducer. One or more couplant inlet couplings are disposed on a second portion of the coupler, the couplant inlet couplings provide a couplant to a portion of the wafer inspected by the sensing device. A plurality of vacuum inlet couplings is disposed on a third portion of the coupler. At least one of the vacuum inlet couplings provide suction through a recessed portion of a lower surface of the coupler to remove couplant that is outside the portion of the wafer that is being inspected by the sensing device.

Abstract: A wafer chuck includes a support structure having a first side structurally configured to support a wafer, and a vacuum zone formed on the first side of the support structure. The vacuum zone may be at least partially bounded by a ring extending from a recessed surface of the first side of the support structure. The wafer chuck further includes a plurality of suction cups disposed in the vacuum zone, where one or more of the plurality of suction cups is coupled with a channel extending through the support structure. One or more vacuums are in fluid communication with the channel, where a vacuum is structurally configured to provide suction through the channel.

Abstract: An adjustable fixture for holding a sample for inspection with a scanning acoustic microscope includes a first horizontal bar disposed on a first end of a frame, and a second horizontal bar disposed on a second end of the frame. The second horizontal bar may be engaged with the frame to be movable between the first end and the second end of the frame. The adjustable fixture may further include a side bar disposed on one or more of the first side and the second side of the frame, with an end of the second horizontal bar slidable and lockable along the side bar, and an engagement mechanism releasably coupling the end of the second horizontal bar to the side bar.

Abstract: A wafer chuck includes a support structure having a first side structurally configured to support a wafer, and a vacuum zone formed on the first side of the support structure. The vacuum zone may be at least partially bounded by a ring extending from a recessed surface of the first side of the support structure. The wafer chuck further includes a plurality of suction cups disposed in the vacuum zone, where one or more of the plurality of suction cups is coupled with a channel extending through the support structure. One or more vacuums are in fluid communication with the channel, where a vacuum is structurally configured to provide suction through the channel.

Abstract: An adjustable fixture for holding a sample for inspection with a scanning acoustic microscope includes a first horizontal bar disposed on a first end of a frame, and a second horizontal bar disposed on a second end of the frame. The second horizontal bar may be engaged with the frame to be movable between the first end and the second end of the frame. The adjustable fixture may further include a side bar disposed on one or more of the first side and the second side of the frame, with an end of the second horizontal bar slidable and lockable along the side bar, and an engagement mechanism releasably coupling the end of the second horizontal bar to the side bar.

Abstract: A scanning acoustic microscope includes a signal processor and one or more signal paths. In operation, each signal path couples an ultrasonic transducer to the signal processor that processes signals received from the signal paths to produce an ultrasonic scan image. Each signal path has a response characteristic that includes a response characteristic of the ultrasonic transducer. In order to compensate for variations between the signal paths or variations between different transducers in the same signal path, at least one of the signal paths includes a signal path equalizer. The equalizer may be responsive to a set of equalization coefficients. The coefficients are selected such that the response characteristic of the signal path including the equalizer more closely matches a reference characteristic response. The equalizer may operate on a transmitted or received signal or be used to generate an ultrasonic pulse.

Abstract: Configuration of an ultrasonic inspection system is facilitated using an ultrasound response predicted by a simulation tool. In one embodiment, estimated material properties of an object to be inspected are input to the simulation tool. Also input to the simulation tool is at least one estimated property of an ultrasonic transducer of the ultrasonic inspection. The simulation tool predicts the response of the object to ultrasound from the ultrasonic transducer. This response is dependent upon the estimated material properties of the object to be inspected and the at least one estimated property of the ultrasonic transducer. The ultrasonic inspection system is then configured dependent upon a feature of the predicted response. The system may be configured, for example, by setting the position of a time gate, selecting an appropriate ultrasonic transducer, selecting the position of the transducer to achieve good focus, or selecting parameters for signal processing.

Abstract: A method and apparatus for dynamically adjusting the level of a response signal from an ultrasound transducer is disclosed. During a calibration phase, a description of a gain profile of a level adjuster is set dependent upon an expected response signal for a type of object to be tested and the description is stored in memory. During a measurement phase for an object under test, a description of a gain profile is selected for the type of the object under test and a gain profile is determined from the selected description. The response signal from the object under test is passed through a level adjuster and the level of the response signal is adjusted dynamically in accordance with the gain profile. The description of the gain profile is selected with reference to an expected response either by operator interaction with a user interface or automatically.

Abstract: A method and apparatus for ultrasonic inspection of one or more parts, in which one or more parts to be inspected are transferred from a parts carrier to a scan nest that is located in the scanning station. The parts are restrained in the scan nest and then scanned. A pick and place mechanism is used to transfer the parts to be inspected between the parts carrier the scan nest. The inspection path may be altered if a missing part is detected. In one embodiment, a first gas flow port located on the pick and place mechanism or on the transducer holder is used to blow ultrasonic coupling fluid from the front surface of the parts in the scan nest after they have been scanned. In a further embodiment, two or more scan nests are used for parallel operation.

Abstract: A scanning acoustic microscope includes a signal processor and one or more signal paths. In operation, each signal path couples an ultrasonic transducer to the signal processor that processes signals received from the signal paths to produce an ultrasonic scan image. Each signal path has a response characteristic that includes a response characteristic of the ultrasonic transducer. In order to compensate for variations between the signal paths or variations between different transducers in the same signal path, at least one of the signal paths includes a signal path equalizer. The equalizer may be responsive to a set of equalization coefficients. The coefficients are selected such that the response characteristic of the signal path including the equalizer more closely matches a reference characteristic response. The equalizer may operate on a transmitted or received signal or be used to generate an ultrasonic pulse.

Abstract: A method and apparatus for ultrasonic inspection of one or more parts, in which one or more parts to be inspected are transferred from a parts carrier to a scan nest that is located in the scanning station. The parts are restrained in the scan nest and then scanned. A pick and place mechanism is used to transfer the parts to be inspected between the parts carrier the scan nest. The inspection path may be altered if a missing part is detected. In one embodiment, a first gas flow port located on the pick and place mechanism or on the transducer holder is used to blow ultrasonic coupling fluid from the front surface of the parts in the scan nest after they have been scanned. In a further embodiment, two or more scan nests are used for parallel operation.

Abstract: A method and apparatus for dynamically adjusting the level of a response signal from an ultrasound transducer is disclosed. During a calibration phase, a description of a gain profile of a level adjuster is set dependent upon an expected response signal for a type of object to be tested and the description is stored in memory. During a measurement phase for an object under test, a description of a gain profile is selected for the type of the object under test and a gain profile is determined from the selected description. The response signal from the object under test is passed through a level adjuster and the level of the response signal is adjusted dynamically in accordance with the gain profile. The description of the gain profile is selected with reference to an expected response either by operator interaction with a user interface or automatically.

Abstract: Configuration of an ultrasonic inspection system is facilitated using an ultrasound response predicted by a simulation tool. In one embodiment, estimated material properties of an object to be inspected are input to the simulation tool. Also input to the simulation tool is at least one estimated property of an ultrasonic transducer of the ultrasonic inspection. The simulation tool predicts the response of the object to ultrasound from the ultrasonic transducer. This response is dependent upon the estimated material properties of the object to be inspected and the at least one estimated property of the ultrasonic transducer. The ultrasonic inspection system is then configured dependent upon a feature of the predicted response. The system may be configured, for example, by setting the position of a time gate, selecting an appropriate ultrasonic transducer, selecting the position of the transducer to achieve good focus, or selecting parameters for signal processing.

Abstract: Configuration of an ultrasonic inspection system is facilitated using an ultrasound response predicted by a simulation tool. In one embodiment, estimated material properties of an object to be inspected are input to the simulation tool. Also input to the simulation tool is at least one estimated property of an ultrasonic transducer of the ultrasonic inspection. The simulation tool predicts the response of the object to ultrasound from the ultrasonic transducer. This response is dependent upon the estimated material properties of the object to be inspected and the at least one estimated property of the ultrasonic transducer. The ultrasonic inspection system is then configured dependent upon a feature of the predicted response. The system may be configured, for example, by setting the position of a time gate, selecting an appropriate ultrasonic transducer, selecting the position of the transducer to achieve good focus, or selecting parameters for signal processing.

Abstract: A method and apparatus for ultrasonic scanning of a wafer assembly is disclosed. The wafer assembly is held in a wafer chuck and rotated. A transducer generates ultrasound in the wafer assembly and the ultrasound emitted from the wafer assembly is sensed. A controller adjusts the relative positions of the wafer and the transducer and controls the transducer to generate ultrasound at a number of scan points.

Abstract: A method and apparatus are disclosed for coupling ultrasound between an ultrasonic transducer and an object. A scanning element is attached to an ultrasonic transducer to form an integral transducer assembly in which an ultrasound emitting surface of the ultrasonic transducer is positioned in a fluid cavity of an upper chamber. The ultrasonic transducer assembly may be moved relative to the object to be scanned in order to adjust the focus of the ultrasound. Adjusting a lower wall of the upper chamber in close proximity to the object to be scanned forms a thin film of coupling fluid between a planar region of the lower wall and the upper surface of the object.

Abstract: Configuration of an ultrasonic inspection system is facilitated using an ultrasound response predicted by a simulation tool. In one embodiment, estimated material properties of an object to be inspected are input to the simulation tool. Also input to the simulation tool is at least one estimated property of an ultrasonic transducer of the ultrasonic inspection. The simulation tool predicts the response of the object to ultrasound from the ultrasonic transducer. This response is dependent upon the estimated material properties of the object to be inspected and the at least one estimated property of the ultrasonic transducer. The ultrasonic inspection system is then configured dependent upon a feature of the predicted response. The system may be configured, for example, by setting the position of a time gate, selecting an appropriate ultrasonic transducer, selecting the position of the transducer to achieve good focus, or selecting parameters for signal processing.