Abstract: This invention relates to a plating means, wherein an accurate plating for a smaller work surface is carried out high-speedily. For this purpose, the smaller work surface is enclosed by a mask of the plating means, and a plating solution is jetted for the work surface from a nozzle disposed within a closed space of the mask inside. Further, the plating means according to this invention has means for suctioning and discharging speedily an extra plating solution together with atmosphere within the closed space as well as outer air induced by an outer air induction means. Further, the used plating solution is again returned to a plating solution tank by a preferred recycling system. Thus, consumption of the plating solution is saved greatly.

Abstract: This invention relates to a plating process and its means, wherein an accurate plating for a smaller work surface is carried out high-speedily. For this purpose, the smaller work surface is enclosed by a mask of the plating means, and a plating solution is jetted for the work surface from a nozzle disposed within a closed space of the mask inside. Further, the plating process according to this invention has a step for suctioning and discharging speedily an extra plating solution together with atmosphere within the closed space as well as outer air induced by an outer air induction means. Further, the used plating solution is again returned to a plating solution tank by a preferred recycling system. Thus, the consumption of the plating solution is saved greatly.