Patents Assigned to Sony Chemical Corporation
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Patent number: 7535332Abstract: A protective element has a heat-generating member and a low-melting metal member on a substrate, in which the low-melting metal member is blown out by the heat generated by the heat-generating member, wherein at least two strips of low-melting metal member are provided as the low-melting metal member, for example, between the pair of electrodes that pass current to the low-melting metal member, so that the lateral cross section of at least part of the low-melting metal member is substantially divided into at least two independent cross sections. This protective element has a shorter and more consistent operating time. It is preferable here to provide at least two strips of low-melting metal member between the pair of electrodes that pass current to the low-melting metal member. It is also preferable to provide one strip of low-melting metal member having a slit in its center, between the pair of electrodes that pass current to the low-melting metal member.Type: GrantFiled: December 5, 2003Date of Patent: May 19, 2009Assignee: Sony Chemicals CorporationInventors: Yuji Furuuchi, Hisaya Tamura, Masahiro Matsuyoshi, Kazutaka Furuta, Masami Kawazu
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Patent number: 7478052Abstract: A system and method that reduces content selection cost, to commercialize the proper picture content quickly, and to reduce the cost required to research the detailed sales market. Content introduction information is sent to a contents polling apparatus, the content introduction information is displayed at a contents introduction information display. A pollee views the displayed content introduction information and enters the contents polling information for each picture content, the entered contents polling information is sent to a contents market research apparatus, which counts the sent contents polling information and generates a counted result as the output.Type: GrantFiled: March 28, 2001Date of Patent: January 13, 2009Assignees: Sony Corporation, Sony Chemicals CorporationInventor: Satoru Ueda
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Patent number: 7413686Abstract: A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The first resin coating being softer than the resin particle. A second conductive thin film is disposed therearound. When the surface part of an electrode of an adherend that is to be connected is hard, a first resin coating of the conductive particle and the second conductive thin film are destroyed by pressure to bring the second conductive thin film in contact with the electrode and a metal wiring. If the surface part of the electrode is soft, the second conductive thin film on the surface side comes in contact with the electrode, which makes it possible for the particle to be used regardless of the surface state of an adherend.Type: GrantFiled: March 25, 2003Date of Patent: August 19, 2008Assignee: Sony Chemicals CorporationInventor: Yukio Yamada
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Publication number: 20080157030Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.Type: ApplicationFiled: January 22, 2008Publication date: July 3, 2008Applicant: Sony Chemicals CorporationInventors: Masao Saito, Osamu Takamatsu, Takayuki Matsushima
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Publication number: 20070170598Abstract: There is provided a flexible circuit board 22 that, when deposited on another flexible circuit board 40, causes no gap to occur between wiring films 4a, 4a, of the flexible circuit board 40. Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board 22, the thickness of a bonding layer 16, 16a, on the opposed side of a bowing metallic member 2, of an inter-layer insulating film 10 where which bumps 6 are formed is greater than the thickness of a bonding layer on the side of metallic member 2. When the flexible circuit board 22 is deposited on the other flexible circuit board 40 to form a flexible multi-layer wiring circuit board 50, the bonding layer 16, 16a can be filled between the wiring films 4a, 4a, so that the flexible multi-layer wiring circuit board 50 has no gaps and a less bowing.Type: ApplicationFiled: May 10, 2004Publication date: July 26, 2007Applicants: NORTH CORPORATION, SONY CHEMICALS CORPORATIONInventors: Tomoo Iijima, Kenji Osawa, Kimitaka Endo, Yoshiaki Echigo, Akira Shigeta, Kazuyoshi Kobayashi, Kenichiro Hanamura
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Publication number: 20070104973Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.Type: ApplicationFiled: September 1, 2006Publication date: May 10, 2007Applicant: Sony Chemicals CorporationInventors: Masao Saito, Osamu Takamatsu, Takayuki Matsushima
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Publication number: 20070094872Abstract: A method for mounting through an anisotropic conductive film defined as an adhesive sheet an electronic component on a printed circuit board (flexible board) provided with a wiring pattern. The anisotropic conductive film is bonded to an area of the flexible board to be mounted with the electronic component in a state where air intervening between the anisotropic conductive film and the flexible board is heated. Since the air confined between the anisotropic conductive film and the flexible board reduces in volume upon cooled down, occurrence of voids, exposure of the wiring pattern, or the like is avoided. Consequently, reliability can be enhanced without complicating the mounting.Type: ApplicationFiled: May 5, 2004Publication date: May 3, 2007Applicant: Sony Chemicals CorporationInventors: Misao Konishi, Hidetsugu Namiki, Jyunji Shinozaki
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Patent number: 7157125Abstract: A double-faced tape according to which, in the case of fixing a liquid crystal display panel and a backlight module together using the double-faced tape, reflection of external light can be reduced as much as possible at the fixed parts, and moreover incident light from the backlight module can be reflected back toward the backlight module with high reflectance, whereby light from a light source can be used effectively; one face of the double-faced tape 10A is made to be a low-reflectance face, and the other face is made to be a high-reflectance face or high-scattering face.Type: GrantFiled: February 25, 2002Date of Patent: January 2, 2007Assignees: Sony Chemicals Corporation, Seiko Epson CorporationInventors: Kenji Kamiya, Kazumoto Shinojima
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Patent number: 7074741Abstract: A sublimation thermal transfer recording medium and a thermal transfer recording method that can remove background stain and the like, and can realize gradation printing with high accuracy and good correlation between the heat quantity applied and the coloring density are provided. The sublimation thermal transfer recording medium includes a base sheet having formed on one surface thereof a number of thermal transfer dye layers having different hues in parallel to each other. The thermal transfer dye layers contain a resin material having a weight average molecular Mw of about 100,000 or less, and preferably about 60,000 or less, as a main component of a binder resin, and contain a block copolymer silicone resin. The silicone resin preferably includes an amount of Si that ranges from about 5% to about 30% by weight, and a mixing ratio of the resin material and the silicone resin is preferably from about 99:1 to about 70:30.Type: GrantFiled: June 16, 2004Date of Patent: July 11, 2006Assignees: Sony Corporation, Sony Chemicals CorporationInventors: Junichirou Sugita, Youichi Shutara, Morio Sekiguchi
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Patent number: 7034750Abstract: A chip-like printed antenna in which an open end is formed by at least two antenna conductors separated from each other is mounted on a printed-circuit board. A ground required by one or plural other modules is disposed and mounted on the printed-circuit board so as to surround a remaining area of a surrounding area of the printed antenna except a partial area as indicated by oblique line parts. By this, in the printed-circuit board , a radiation electric field does not come to have a dipole mode, but is formed into a balloon shape and is radiated in one direction as indicated by a broken line.Type: GrantFiled: October 27, 2003Date of Patent: April 25, 2006Assignees: Sony Corporation, Sony Chemicals CorporationInventors: Kenji Asakura, Hidenobu Muranaka, Shuichiro Yasuda
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Patent number: 7025852Abstract: A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.Type: GrantFiled: May 16, 2003Date of Patent: April 11, 2006Assignees: Sony Corporation, Sony Chemicals CorporationInventor: Hiroyuki Kumakura
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Patent number: 7018118Abstract: An improved detectable spool for use with a ribbon includes an improved hub which includes a core and an indication member. The indication member is a generally planar metallic member that is substantially embedded in or is otherwise mounted to the core, with the indication member including a support and a plurality of tabs. In at least one embodiment the indication member is a monolithically formed single-piece member, while in another embodiment the indication member is a multi-component member.Type: GrantFiled: November 7, 2003Date of Patent: March 28, 2006Assignee: Sony Chemicals Corporation of AmericaInventors: Ernest L. Woosley, Doug Jackson, John A. Pomfret, Richard Crooks
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Patent number: 6977343Abstract: The invention provides a heat-sensitive material having a heat shrinkable material (e.g., a heat shrinkable resin) having dispersed therein electrically conductive particles, which shrinks on heating to allow an electric current to flow. The invention also provides a heat-sensitive element having a heat-sensitive material and a pair of electrode terminals which are useful as an over-charge protective element of lithium ion secondary batteries.Type: GrantFiled: May 17, 2001Date of Patent: December 20, 2005Assignees: Sony Corporation, Sony Chemicals CorporationInventors: Kazutaka Furuta, Norikazu Iwasaki
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Patent number: 6940458Abstract: A PDA includes a printed-circuit board on which at least one printed antenna pair having two chip-like printed antennas, which receive linearly polarized signals and are disposed along axes orthogonal to each other, is mounted. In each of the printed antennas, an open end is formed of at least two antenna conductors separated from each other. Besides, in the printed-circuit board, a ground required by one or plural other modules is disposed so as to surround a surrounding area of at least three sides of four sides forming a rectangular section in each of the printed antennas, and each of the printed antennas is disposed and mounted so that a remaining one side faces an edge portion of the printed-circuit board. While the PDA can receive circularly polarized signals very effectively, the degree of freedom in layout is greatly expanded and miniaturization can be realized.Type: GrantFiled: November 25, 2003Date of Patent: September 6, 2005Assignee: Sony Chemicals Corporation Neagari PlantInventors: Kouichi Mukai, Shuichiro Yasuda, Kenji Asakura, Hidenobu Muranaka
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Patent number: 6918560Abstract: A winding apparatus adaptable to longer films with minimum design changes in existing apparatus has a winding shaft 31 on which a reel member 50 capable of winding a given film at multiple stages can be mounted. The winding shaft 31 can be moved in the rotational and axial directions of the reel member 50. The winding apparatus 10 further has a driving mechanism 40 for giving power in the rotational and axial directions to the winding shaft 31.Type: GrantFiled: August 19, 2003Date of Patent: July 19, 2005Assignee: Sony Chemicals CorporationInventor: Koji Arai
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Patent number: 6903463Abstract: A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips (3) are held in direct connection with the corresponding electrodes on the substrate glass circuit board (1), utilizes a layer (5) of a connecting material for bonding and connecting the semiconductor chip (3) with the substrate board (1). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer (5) and the chip (3) and between the binder layer (5) and the glass board (1), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component (6) containing a thermosetting resin and, on the other hand, electroconductive particles (7) and has a characteristic feature that a tensile elongation percentage at 25° C.Type: GrantFiled: September 11, 2000Date of Patent: June 7, 2005Assignee: Sony Chemicals CorporationInventors: Motohide Takeichi, Hiroyuki Fujihira
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Patent number: 6874725Abstract: An improved detectable spool for use with a ribbon includes an improved hub which includes a core and an indication member. The indication member is a generally planar metallic member that is substantially embedded in or is otherwise mounted to the core, with the indication member including a support and a plurality of tabs. In at least one embodiment the indication member is a monolithically formed single-piece member, while in another embodiment the indication member is a multi-component member.Type: GrantFiled: July 25, 2002Date of Patent: April 5, 2005Assignee: Sony Chemicals Corporation of AmericaInventors: Ernest L Woosley, Doug Jackson, John A. Pomfret, Richard Crooks
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Patent number: 6863753Abstract: In a manufacturing apparatus for flat cable adapted for allowing plural conductive wires arranged on the same plane to be put between a first insulating tape on which first peeling sheets are stuck at predetermined intervals and a second insulating tape on which second peeling sheets are stuck at predetermined intervals to stick the first insulating tape, the conductive wires and the second insulating tape in order recited, such an approach is employed to respectively adjust tensions applied to the first and second insulating tapes to thereby respectively independently change expansions/contractions of the first and second insulating tapes. Thus, it is possible to correct sticking errors of the first peeling sheets and the second peeling sheets.Type: GrantFiled: January 20, 2000Date of Patent: March 8, 2005Assignee: Sony Chemicals CorporationInventors: Takao Murooka, Hakuji Kobayashi, Masakazu Endo, Toshihiro Tsutsumi, Hiroaki Shirai, Hidehiro Numao
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Patent number: 6853394Abstract: A radiation-curable ink, a method of making the ink, a thermal transfer printer ribbon having a radiation-curable ink layer, and a thermal transfer printer with an actinic energy source are provided. A method of thermal transfer printing using an ink ribbon having radiation-curable components is also provided. The radiation curable components of the ink can be thermally dried and are cured after printing of an image on a receiving article.Type: GrantFiled: July 25, 2002Date of Patent: February 8, 2005Assignee: Sony Chemicals Corporation of AmericaInventors: Jeffrey F. Taylor, John T. Whalen, Lara A. Reed, Richard G. Crooks, Marlee A. Vrbanic
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Patent number: 6850263Abstract: A radiation-curable ink, a method of making the ink, a thermal transfer printer ribbon having a radiation-curable ink layer, and a thermal transfer printer with an actinic energy source are provided. A method of thermal transfer printing using an ink ribbon having radiation-curable components is also provided, as well as a thermal transfer printer which utilizes these ribbons. The radiation curable components of the ink can be thermally dried and are cured after printing of an image on a receiving article. A liquid light guide is used to transmit actinic energy from a source to the printed image.Type: GrantFiled: April 11, 2003Date of Patent: February 1, 2005Assignee: Sony Chemicals Corporation of AmericaInventors: Jeffrey F. Taylor, John T. Whalen