Patents Assigned to Sony Chemicals Corporation
  • Patent number: 7535332
    Abstract: A protective element has a heat-generating member and a low-melting metal member on a substrate, in which the low-melting metal member is blown out by the heat generated by the heat-generating member, wherein at least two strips of low-melting metal member are provided as the low-melting metal member, for example, between the pair of electrodes that pass current to the low-melting metal member, so that the lateral cross section of at least part of the low-melting metal member is substantially divided into at least two independent cross sections. This protective element has a shorter and more consistent operating time. It is preferable here to provide at least two strips of low-melting metal member between the pair of electrodes that pass current to the low-melting metal member. It is also preferable to provide one strip of low-melting metal member having a slit in its center, between the pair of electrodes that pass current to the low-melting metal member.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: May 19, 2009
    Assignee: Sony Chemicals Corporation
    Inventors: Yuji Furuuchi, Hisaya Tamura, Masahiro Matsuyoshi, Kazutaka Furuta, Masami Kawazu
  • Patent number: 7478052
    Abstract: A system and method that reduces content selection cost, to commercialize the proper picture content quickly, and to reduce the cost required to research the detailed sales market. Content introduction information is sent to a contents polling apparatus, the content introduction information is displayed at a contents introduction information display. A pollee views the displayed content introduction information and enters the contents polling information for each picture content, the entered contents polling information is sent to a contents market research apparatus, which counts the sent contents polling information and generates a counted result as the output.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: January 13, 2009
    Assignees: Sony Corporation, Sony Chemicals Corporation
    Inventor: Satoru Ueda
  • Patent number: 7413686
    Abstract: A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The first resin coating being softer than the resin particle. A second conductive thin film is disposed therearound. When the surface part of an electrode of an adherend that is to be connected is hard, a first resin coating of the conductive particle and the second conductive thin film are destroyed by pressure to bring the second conductive thin film in contact with the electrode and a metal wiring. If the surface part of the electrode is soft, the second conductive thin film on the surface side comes in contact with the electrode, which makes it possible for the particle to be used regardless of the surface state of an adherend.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: August 19, 2008
    Assignee: Sony Chemicals Corporation
    Inventor: Yukio Yamada
  • Publication number: 20080157030
    Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
    Type: Application
    Filed: January 22, 2008
    Publication date: July 3, 2008
    Applicant: Sony Chemicals Corporation
    Inventors: Masao Saito, Osamu Takamatsu, Takayuki Matsushima
  • Publication number: 20070170598
    Abstract: There is provided a flexible circuit board 22 that, when deposited on another flexible circuit board 40, causes no gap to occur between wiring films 4a, 4a, of the flexible circuit board 40. Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board 22, the thickness of a bonding layer 16, 16a, on the opposed side of a bowing metallic member 2, of an inter-layer insulating film 10 where which bumps 6 are formed is greater than the thickness of a bonding layer on the side of metallic member 2. When the flexible circuit board 22 is deposited on the other flexible circuit board 40 to form a flexible multi-layer wiring circuit board 50, the bonding layer 16, 16a can be filled between the wiring films 4a, 4a, so that the flexible multi-layer wiring circuit board 50 has no gaps and a less bowing.
    Type: Application
    Filed: May 10, 2004
    Publication date: July 26, 2007
    Applicants: NORTH CORPORATION, SONY CHEMICALS CORPORATION
    Inventors: Tomoo Iijima, Kenji Osawa, Kimitaka Endo, Yoshiaki Echigo, Akira Shigeta, Kazuyoshi Kobayashi, Kenichiro Hanamura
  • Publication number: 20070104973
    Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
    Type: Application
    Filed: September 1, 2006
    Publication date: May 10, 2007
    Applicant: Sony Chemicals Corporation
    Inventors: Masao Saito, Osamu Takamatsu, Takayuki Matsushima
  • Publication number: 20070094872
    Abstract: A method for mounting through an anisotropic conductive film defined as an adhesive sheet an electronic component on a printed circuit board (flexible board) provided with a wiring pattern. The anisotropic conductive film is bonded to an area of the flexible board to be mounted with the electronic component in a state where air intervening between the anisotropic conductive film and the flexible board is heated. Since the air confined between the anisotropic conductive film and the flexible board reduces in volume upon cooled down, occurrence of voids, exposure of the wiring pattern, or the like is avoided. Consequently, reliability can be enhanced without complicating the mounting.
    Type: Application
    Filed: May 5, 2004
    Publication date: May 3, 2007
    Applicant: Sony Chemicals Corporation
    Inventors: Misao Konishi, Hidetsugu Namiki, Jyunji Shinozaki
  • Patent number: 7157125
    Abstract: A double-faced tape according to which, in the case of fixing a liquid crystal display panel and a backlight module together using the double-faced tape, reflection of external light can be reduced as much as possible at the fixed parts, and moreover incident light from the backlight module can be reflected back toward the backlight module with high reflectance, whereby light from a light source can be used effectively; one face of the double-faced tape 10A is made to be a low-reflectance face, and the other face is made to be a high-reflectance face or high-scattering face.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: January 2, 2007
    Assignees: Sony Chemicals Corporation, Seiko Epson Corporation
    Inventors: Kenji Kamiya, Kazumoto Shinojima
  • Patent number: 7074741
    Abstract: A sublimation thermal transfer recording medium and a thermal transfer recording method that can remove background stain and the like, and can realize gradation printing with high accuracy and good correlation between the heat quantity applied and the coloring density are provided. The sublimation thermal transfer recording medium includes a base sheet having formed on one surface thereof a number of thermal transfer dye layers having different hues in parallel to each other. The thermal transfer dye layers contain a resin material having a weight average molecular Mw of about 100,000 or less, and preferably about 60,000 or less, as a main component of a binder resin, and contain a block copolymer silicone resin. The silicone resin preferably includes an amount of Si that ranges from about 5% to about 30% by weight, and a mixing ratio of the resin material and the silicone resin is preferably from about 99:1 to about 70:30.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: July 11, 2006
    Assignees: Sony Corporation, Sony Chemicals Corporation
    Inventors: Junichirou Sugita, Youichi Shutara, Morio Sekiguchi
  • Patent number: 7034750
    Abstract: A chip-like printed antenna in which an open end is formed by at least two antenna conductors separated from each other is mounted on a printed-circuit board. A ground required by one or plural other modules is disposed and mounted on the printed-circuit board so as to surround a remaining area of a surrounding area of the printed antenna except a partial area as indicated by oblique line parts. By this, in the printed-circuit board , a radiation electric field does not come to have a dipole mode, but is formed into a balloon shape and is radiated in one direction as indicated by a broken line.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: April 25, 2006
    Assignees: Sony Corporation, Sony Chemicals Corporation
    Inventors: Kenji Asakura, Hidenobu Muranaka, Shuichiro Yasuda
  • Patent number: 7025852
    Abstract: A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: April 11, 2006
    Assignees: Sony Corporation, Sony Chemicals Corporation
    Inventor: Hiroyuki Kumakura
  • Patent number: 7018118
    Abstract: An improved detectable spool for use with a ribbon includes an improved hub which includes a core and an indication member. The indication member is a generally planar metallic member that is substantially embedded in or is otherwise mounted to the core, with the indication member including a support and a plurality of tabs. In at least one embodiment the indication member is a monolithically formed single-piece member, while in another embodiment the indication member is a multi-component member.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: March 28, 2006
    Assignee: Sony Chemicals Corporation of America
    Inventors: Ernest L. Woosley, Doug Jackson, John A. Pomfret, Richard Crooks
  • Patent number: 6977343
    Abstract: The invention provides a heat-sensitive material having a heat shrinkable material (e.g., a heat shrinkable resin) having dispersed therein electrically conductive particles, which shrinks on heating to allow an electric current to flow. The invention also provides a heat-sensitive element having a heat-sensitive material and a pair of electrode terminals which are useful as an over-charge protective element of lithium ion secondary batteries.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: December 20, 2005
    Assignees: Sony Corporation, Sony Chemicals Corporation
    Inventors: Kazutaka Furuta, Norikazu Iwasaki
  • Patent number: 6940458
    Abstract: A PDA includes a printed-circuit board on which at least one printed antenna pair having two chip-like printed antennas, which receive linearly polarized signals and are disposed along axes orthogonal to each other, is mounted. In each of the printed antennas, an open end is formed of at least two antenna conductors separated from each other. Besides, in the printed-circuit board, a ground required by one or plural other modules is disposed so as to surround a surrounding area of at least three sides of four sides forming a rectangular section in each of the printed antennas, and each of the printed antennas is disposed and mounted so that a remaining one side faces an edge portion of the printed-circuit board. While the PDA can receive circularly polarized signals very effectively, the degree of freedom in layout is greatly expanded and miniaturization can be realized.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: September 6, 2005
    Assignee: Sony Chemicals Corporation Neagari Plant
    Inventors: Kouichi Mukai, Shuichiro Yasuda, Kenji Asakura, Hidenobu Muranaka
  • Patent number: 6918560
    Abstract: A winding apparatus adaptable to longer films with minimum design changes in existing apparatus has a winding shaft 31 on which a reel member 50 capable of winding a given film at multiple stages can be mounted. The winding shaft 31 can be moved in the rotational and axial directions of the reel member 50. The winding apparatus 10 further has a driving mechanism 40 for giving power in the rotational and axial directions to the winding shaft 31.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: July 19, 2005
    Assignee: Sony Chemicals Corporation
    Inventor: Koji Arai
  • Patent number: 6903463
    Abstract: A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips (3) are held in direct connection with the corresponding electrodes on the substrate glass circuit board (1), utilizes a layer (5) of a connecting material for bonding and connecting the semiconductor chip (3) with the substrate board (1). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer (5) and the chip (3) and between the binder layer (5) and the glass board (1), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component (6) containing a thermosetting resin and, on the other hand, electroconductive particles (7) and has a characteristic feature that a tensile elongation percentage at 25° C.
    Type: Grant
    Filed: September 11, 2000
    Date of Patent: June 7, 2005
    Assignee: Sony Chemicals Corporation
    Inventors: Motohide Takeichi, Hiroyuki Fujihira
  • Patent number: 6874725
    Abstract: An improved detectable spool for use with a ribbon includes an improved hub which includes a core and an indication member. The indication member is a generally planar metallic member that is substantially embedded in or is otherwise mounted to the core, with the indication member including a support and a plurality of tabs. In at least one embodiment the indication member is a monolithically formed single-piece member, while in another embodiment the indication member is a multi-component member.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: April 5, 2005
    Assignee: Sony Chemicals Corporation of America
    Inventors: Ernest L Woosley, Doug Jackson, John A. Pomfret, Richard Crooks
  • Patent number: 6863753
    Abstract: In a manufacturing apparatus for flat cable adapted for allowing plural conductive wires arranged on the same plane to be put between a first insulating tape on which first peeling sheets are stuck at predetermined intervals and a second insulating tape on which second peeling sheets are stuck at predetermined intervals to stick the first insulating tape, the conductive wires and the second insulating tape in order recited, such an approach is employed to respectively adjust tensions applied to the first and second insulating tapes to thereby respectively independently change expansions/contractions of the first and second insulating tapes. Thus, it is possible to correct sticking errors of the first peeling sheets and the second peeling sheets.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: March 8, 2005
    Assignee: Sony Chemicals Corporation
    Inventors: Takao Murooka, Hakuji Kobayashi, Masakazu Endo, Toshihiro Tsutsumi, Hiroaki Shirai, Hidehiro Numao
  • Patent number: 6853394
    Abstract: A radiation-curable ink, a method of making the ink, a thermal transfer printer ribbon having a radiation-curable ink layer, and a thermal transfer printer with an actinic energy source are provided. A method of thermal transfer printing using an ink ribbon having radiation-curable components is also provided. The radiation curable components of the ink can be thermally dried and are cured after printing of an image on a receiving article.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: February 8, 2005
    Assignee: Sony Chemicals Corporation of America
    Inventors: Jeffrey F. Taylor, John T. Whalen, Lara A. Reed, Richard G. Crooks, Marlee A. Vrbanic
  • Patent number: 6848176
    Abstract: A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: February 1, 2005
    Assignee: Sony Chemicals Corporation
    Inventors: Hiroyuki Hishinuma, Hideyuki Kurita, Ryo Ito, Masayuki Nakamura