Abstract: In a multi-chip package semiconductor device, a drive chip having an analog circuit and a logic chip having a digital circuit are mounted within the same package. The driver chip includes a logic-chip power-supply circuit that makes up a logic-chip power supply for the logic chip and a group of operational amplifiers that amplify detection signals from a plurality of sensors. The driver chip has the shape of a square as a whole, and the plurality of operational amplifiers and the logic-chip power-supply circuit are disposed in diagonally opposed positions.

Abstract: A program processing device that improves efficiency when debugging software. The processing device includes a CPU core and a break circuit, which is connected to an internal bus that is used by the CPU core to access a memory area. The break circuit monitors the internal bus and checks whether a designated variable in the program has been rewritten. When the designated variable has been rewritten, the break circuit breaks the operation of the CPU core.