Abstract: To perform high-speed recognition processing of an image signal acquired by imaging. A recognition processing system of the present disclosure includes: a first sensor device that acquires an image signal by imaging; a second sensor device that performs an object detection process, a selection unit that selects one of a plurality of recognition processes based on information on the object detected by the detection process; and a recognition processing unit that executes the recognition process selected by the selection unit based on the image signal.

Abstract: More improvement of sensitivity is achieved by reducing crosstalk between pixels without deteriorating a light collection property. Provided is an imaging device including multiple pixels each including a photoelectric conversion unit and planarly arranged in a matrix shape, a color filter provided on the photoelectric conversion unit for each of the pixels, and a wall-shaped structure portion that is formed between the adjoining color filters with an external shape of the wall-shaped structure portion defined by a first wall portion and is configured to separate the color filters from each other.

Abstract: The present disclosure relates to a solid-state imaging element and an electronic device capable of increasing the capacitance of a charge holding unit. The solid-state imaging element includes a pixel including a photodiode, an FD that accumulates charges generated in the photodiode, and a charge holding unit that is connected in parallel with the FD. The charge holding unit includes a wiring capacitance formed by parallel running of a first wiring connected to a first potential and a second wiring connected to a second potential different from the first potential. The present disclosure can be applied to a solid-state imaging element that performs global shutter type imaging.

Abstract: The present disclosure relates to an imaging element package and an electronic device that allow images to be captured with better quality. A support portion configured to support a cover glass that protects a light-receiving surface of a semiconductor substrate provided with a photodiode is provided along an outer periphery of the semiconductor substrate, and an antireflection layer is provided between the support portion and the semiconductor substrate at least in an area where the support portion is provided. The antireflection layer is provided entirely on the light-receiving surface of the semiconductor substrate, and the support portion is stacked on the antireflection layer. The present disclosure can be applied to a CMOS image sensor, for example.

Abstract: A solid-state imaging device, an electronic device, and a distance measurement system for miniaturization of pixels in a device that outputs a luminance signal and an event signal. A device includes: a pixel array unit in which an event pixel that detects that a luminance change exceeds a predetermined threshold and a gradation pixel that outputs a luminance signal of a gradation level according to a light amount of incident light are mixed, in which a color filter of the same color is formed in units of two or more pixels in the gradation pixel, and the event pixel is disposed with a region size in which at least two of the gradation pixels are arranged in a row direction or a column direction. The present disclosure can be applied to, for example, a distance measurement system or the like that generates image information and distance measurement information.

Abstract: An image processing device for a light scanner system for scanning an object, including circuitry configured to: obtain first image data representing a first image of the object that is illuminated with a line of light in an illumination plane, wherein the first image is acquired at a first viewpoint; obtain second image data representing a second image of the illuminated object, wherein the second image is acquired at a second viewpoint being different from the first viewpoint; and project the first and the second image data in the illumination plane representing a projected first and second image, respectively, for merging the first and second image data in the illumination plane.

Abstract: To improve a frame rate in a solid-state imaging element that compares a reference signal and a pixel signal. The solid-state imaging element includes a differential amplifier circuit, a transfer transistor, and a source follower circuit. The differential amplifier circuit amplifies a difference between the potentials of a pair of input nodes and outputs the difference from an output node. The transfer transistor transfers charge from a photoelectric conversion element to a floating diffusion layer. The auto-zero transistor short-circuits the floating diffusion layer and the output node in a predetermined period. The source follower circuit supplies a potential to one of the pair of input nodes according to a potential of the floating diffusion layer.

Abstract: The present disclosure provides a touch sensor device that can improve efficiency of acquiring signal components and that can effectively address noise and electromagnetic interference. The touch sensor device includes a driver unit that drives an electrode having a capacitance that changes due to contact, using a voltage having a waveform of any shape, the voltage gradually changing from a first voltage value that is higher than a reference voltage to a second voltage value that is lower than the reference voltage, and from the second voltage value to the first voltage value, a monitor unit that monitors a drive current obtained by driving the electrode, a rectifying unit that performs full-wave rectification of the current monitored by the monitor unit, and a smoothing unit that smooths the rectified current and converts the rectified current to a current that corresponds to the capacitance of the electrode.

Abstract: Implementing fingerprint authentication during a swipe motion on a display. Electronic equipment includes a display and an optical fingerprint sensor. The display includes a display surface including light-emitting pixels in an array in a first direction and a direction intersecting the first direction. The optical fingerprint sensor includes as imaging element including light-receiving elements in an array in the first direction and the second direction on a side opposite to the display surface of the display in a third direction intersecting the first direction and the second direction, and each of the light-receiving elements transfers a photoelectrically converted charge at the same timing.

Abstract: The present disclosure relates to a camera package, a method for manufacturing a camera package, and an electronic device with which it is possible to reduce manufacturing cost for lens formation. The camera package according to the present disclosure includes: a solid-state imaging element; and a lens formed above a transparent substrate that protects the solid-state imaging element. A lens formation region in which the lens is formed above the transparent substrate and a lens free region around the lens formation region differ in contact angle. The present disclosure can be applied to, for example, a camera package in which a lens is disposed above a solid-state imaging element, or the like.

Abstract: An improvement in heat radiation efficiency is achieved. A semiconductor device according to the present technology includes a substrate portion on which a semiconductor chip is mounted and in which an external connection terminal for performing electrical connection to the outside is formed on a rear surface on a side opposite to a front surface which is a surface on a side where the semiconductor chip is mounted, an outer wall portion that protrudes toward the front surface side in an outer circumferential portion of the substrate portion, a lid portion which is supported by the outer wall portion and covers the semiconductor chip, and a heat storage member which is disposed at a position further inside than the outer wall portion between the rear surface of the substrate portion and a rear surface of the lid portion.

Abstract: Communication devices and systems are disclosed. In one example, a communication device includes a LINK that performs protocol conversion of a signal from a Master and outputs the converted signal to a Slave SerDes, and of a signal from the Slave SerDes and outputs the converted signal to the Master. The LINK alternatively selects a first mode and a second mode. In the first mode, the LINK converts a 1-byte signal transmitted from the Master into a signal of a first communication standard in units of the 1-byte signal and transmits the converted signal to the Slave SerDes, then receives a signal of the first communication standard including an ACK signal representing an acknowledgement or a NACK signal representing a negative acknowledgement, and converts the received signal into a signal of a second communication standard and transmits the converted signal to the Master.

Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode; a second electrode that is disposed to be opposed to the first electrode; and an organic layer that is provided between the first electrode and the second electrode. The organic layer includes a compound represented by a general formula (1).

Abstract: The present technology relates to an imaging device and an electronic device that enable construction of an imaging device that outputs information required by a user with a small size. A single-chip imaging device includes: an imaging unit in which a plurality of pixels is arranged two-dimensionally and that captures an image; a signal processing unit that performs signal processing using a captured image output from the imaging unit; an output I/F that outputs a signal processing result of the signal processing and the captured image to an outside; and an output control unit that performs output control of selectively outputting the signal processing result of the signal processing and the captured image from the output I/F to the outside. The present technology can be applied to, for example, an imaging device that captures an image.

Abstract: Electromagnetic noise is inhibited in a semiconductor package provided with rewiring. The semiconductor package includes a semiconductor integrated circuit, wiring, and a ferromagnetic material. In addition, in the semiconductor package including the semiconductor integrated circuit, the wiring, and the ferromagnetic material, the wiring connects the semiconductor integrated circuit to a predetermined external terminal. Further, in the semiconductor package including the semiconductor integrated circuit, the wiring, and the ferromagnetic material, the ferromagnetic material is provided between the wiring and the semiconductor integrated circuit.

Abstract: Provided are a light emitting element array, a light emitting device, an electronic device, and a photonic crystal structure which are improved in stray light suppression, high luminance, and low power consumption. A light emitting element array includes a plurality of a light emitting element including a light emitting surface, in which a plurality of a light emitting unit is formed including at least one of the light emitting element and capable of controlling light emission from the light emitting surface of the light emitting element, and the plurality of the light emitting unit is provided with an optical adjustment layer at least partially including a periodic structure portion in which a refractive index periodically changes.

Abstract: There is provided a technology advantageous for detecting an installation error of an imaging device in a mobile object. The present disclosure relates to a signal processing device including: a vanishing point estimation unit that acquires a surrounding image captured by an imaging device including an optical system which has an optical axis non-parallel to a moving direction of the imaging device and estimates estimated vanishing point position information indicating a position of a vanishing point by analyzing the surrounding image; and an attachment detection unit that acquires imaging attachment information indicating an attachment posture of the imaging device on the basis of the estimated vanishing point position information and reference vanishing point position information indicating a position of a reference vanishing point.

Abstract: A light guiding plate is provided that includes a transparent member; a plurality of reflectors inside of the transparent member; and a projection optical system. The transparent member includes a light entering portion; a first surface on a side of a viewer; and a second surface that faces the first surface and that is a surface at which the video light entering the transparent member is reflected The projection optical system causes video light reflected at the second surface to be reflected onto a corresponding one of the plurality of reflectors. The reflectors are arranged side by side in a direction in which the video light enters the transparent member. Each of the reflectors is inclined at a specified angle with respect to the first surface, and an area of the reflector and/or spacing between the reflectors is changed according to a distance from the projection optical system.

Abstract: An information processing device includes: an acquisition unit that acquires a captured image; a superimposition unit that generates a superimposition image in which images are superimposed on unused areas of the captured image; and a determination unit that determines a state of the captured image on the basis of characteristics of areas on which the images are superimposed in the superimposition image transmitted from the superimposition unit.

Abstract: Section information of a traveling route is provided appropriately to a driver. Traveling route information and traffic information relating to the traveling route are acquired, and on the basis of the information, a driver intervention requiring section and an automatic driving available section of the traveling route are displayed on a reach prediction time axis from a current point on an instrument panel, a tablet, or the like. For example, the driver intervention requiring section includes a manual driving section, a takeover section from automatic driving to manual driving, and a cautious traveling section from the automatic driving.