Patents Assigned to Sophia Wireless, Inc.
  • Patent number: 7449979
    Abstract: A resonator filter assembly is provided having a first wafer (102), a second wafer (104) and a third wafer (106). A plurality of pits are etched in the first and second wafer (102, 104) and arranged such that a plurality of resonant cavities (108) are formed with a coupling cavity (110) disposed between the resonant cavities (108). By altering the dimensions of the resonant and coupling cavities (108, 110), the frequency characteristics of the filter can be adjusted as desired.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: November 11, 2008
    Assignee: Sophia Wireless, Inc.
    Inventors: Philip J. Koh, David T. Nemeth
  • Patent number: 6624508
    Abstract: A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: September 23, 2003
    Assignee: Sophia Wireless, Inc.
    Inventor: Philip Joseph Koh
  • Publication number: 20030042603
    Abstract: A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.
    Type: Application
    Filed: October 24, 2002
    Publication date: March 6, 2003
    Applicant: SOPHIA WIRELESS, INC.
    Inventor: Philip Joseph Koh
  • Publication number: 20020037598
    Abstract: A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.
    Type: Application
    Filed: December 3, 2001
    Publication date: March 28, 2002
    Applicant: Sophia Wireless, Inc.
    Inventor: Philip Joseph Koh